Reliability of a-Si:H TFTs and Copper Interconnect Lines for Flexible Electronics

Yue Kuo; Mary R. Coan; Guojun Liu

doi:10.1149/1.2980573

Reliability of a-Si:H TFTs and Copper Interconnect Lines for Flexible Electronics

ECS Transactions ◽

10.1149/1.2980573 ◽

2019 ◽

Vol 16 (9) ◽

pp. 345-351

Author(s):

Yue Kuo ◽

Mary R. Coan ◽

Guojun Liu

Keyword(s):

Flexible Electronics ◽

Copper Interconnect ◽

Interconnect Lines

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Microstructural characterization of inlaid copper interconnect lines

Journal of Electronic Materials ◽

10.1007/s11664-001-0038-7 ◽

2001 ◽

Vol 30 (4) ◽

pp. 320-330 ◽

Cited By ~ 56

Author(s):

Paul R. Besser ◽

Ehrenfried Zschech ◽

Werner Blum ◽

Delrose Winter ◽

Richard Ortega ◽

...

Keyword(s):

Microstructural Characterization ◽

Copper Interconnect ◽

Interconnect Lines

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Grain growth in copper interconnect lines

Microelectronic Engineering ◽

10.1016/j.mee.2004.07.053 ◽

2004 ◽

Vol 76 (1-4) ◽

pp. 190-194 ◽

Cited By ~ 34

Author(s):

W. Wu ◽

D. Ernur ◽

S.H. Brongersma ◽

M. Van Hove ◽

K. Maex

Keyword(s):

Grain Growth ◽

Copper Interconnect ◽

Interconnect Lines

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Numerical Modeling of Grain Boundary Effects in the Diffusional Creep of Copper Interconnect Lines

International Journal of Fracture ◽

10.1023/b:frac.0000035089.16019.12 ◽

2004 ◽

Vol 127 (2) ◽

pp. L149-L155 ◽

Cited By ~ 4

Author(s):

Vasyl Grychanyuk ◽

Igor Tsukrov ◽

Todd Gross

Keyword(s):

Numerical Modeling ◽

Grain Boundary ◽

Boundary Effects ◽

Diffusional Creep ◽

Copper Interconnect ◽

Grain Boundary Effects ◽

Interconnect Lines

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Studies on size effect of copper interconnect lines

2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) ◽

10.1109/icsict.2001.981507 ◽

2002 ◽

Cited By ~ 6

Author(s):

Wen Wu ◽

K. Maex

Keyword(s):

Size Effect ◽

Copper Interconnect ◽

Effect Of Copper ◽

Interconnect Lines

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Mechanical strains and stresses in aluminum and copper interconnect lines for 0.18 μm logic technologies

10.1063/1.59911 ◽

1999 ◽

Cited By ~ 4

Author(s):

Paul R. Besser

Keyword(s):

Copper Interconnect ◽

Interconnect Lines

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Effects of line and passivation geometry on curvature evolution during processing and thermal cycling in copper interconnect lines

Acta Materialia ◽

10.1016/s1359-6454(00)00114-2 ◽

2000 ◽

Vol 48 (12) ◽

pp. 3169-3175 ◽

Cited By ~ 36

Author(s):

T.-S Park ◽

S Suresh

Keyword(s):

Thermal Cycling ◽

Copper Interconnect ◽

Interconnect Lines

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Texture and Stress Study of Sub-Micron Copper Interconnect Lines Using X-ray Microdiffraction

Materials for Information Technology - Engineering Materials and Processes ◽

10.1007/1-84628-235-7_21 ◽

2006 ◽

pp. 241-249 ◽

Cited By ~ 2

Author(s):

I. Zienert ◽

H. Prinz ◽

H. Geisler ◽

E. Zschech

Keyword(s):

X Ray ◽

Copper Interconnect ◽

Stress Study ◽

Interconnect Lines

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Constraint effect in deformation of copper interconnect lines subjected to cyclic Joule heating

The Journal of Strain Analysis for Engineering Design ◽

10.1243/03093247jsa532 ◽

2009 ◽

Vol 44 (7) ◽

pp. 543-554 ◽

Cited By ~ 4

Author(s):

D T Read ◽

R H Geiss ◽

N Barbosa

Keyword(s):

Joule Heating ◽

Constraint Effect ◽

Copper Interconnect ◽

Interconnect Lines

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Temperature-Dependent Stress Measurements at Inlaid Copper Interconnect Lines

10.1063/1.2173560 ◽

2006 ◽

Cited By ~ 1

Author(s):

H. Geisler

Keyword(s):

Temperature Dependent ◽

Stress Measurements ◽

Copper Interconnect ◽

Interconnect Lines

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A-Si:H TFT Nonvolatile Memories and Copper Interconnect for Rigid and Flexible Electronics

ECS Transactions ◽

10.1149/1.3152975 ◽

2019 ◽

Vol 22 (1) ◽

pp. 183-190

Author(s):

Yue Kuo

Keyword(s):

Flexible Electronics ◽

Copper Interconnect ◽

Nonvolatile Memories

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