A-Si:H TFT Nonvolatile Memories and Copper Interconnect for Rigid and Flexible Electronics

2019 ◽  
Vol 22 (1) ◽  
pp. 183-190
Author(s):  
Yue Kuo
Keyword(s):  
Flexible Electronics ◽  
Copper Interconnect ◽  
Nonvolatile Memories

Reliability of a-Si:H TFTs and Copper Interconnect Lines for Flexible Electronics

2019 ◽  
Vol 16 (9) ◽  
pp. 345-351
Author(s):  
Yue Kuo ◽  
Mary R. Coan ◽  
Guojun Liu
Keyword(s):  
Flexible Electronics ◽  
Copper Interconnect ◽  
Interconnect Lines

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

Fabrication of 3D Temperature Sensor Using Magnetostrictive Inkjet Printhead

2020 ◽  
Vol 64 (5) ◽  
pp. 50405-1-50405-5
Author(s):  
Young-Woo Park ◽  
Myounggyu Noh
Keyword(s):  
Flexible Electronics ◽  
Inkjet Printing ◽  
Temperature Sensor ◽  
Computer Aided Design ◽  
Low Cost ◽  
Three Dimensional ◽  
Drop On Demand ◽  
Aided Design ◽  
Nanoparticle Ink ◽  
Inkjet Printhead

Abstract Recently, the three-dimensional (3D) printing technique has attracted much attention for creating objects of arbitrary shape and manufacturing. For the first time, in this work, we present the fabrication of an inkjet printed low-cost 3D temperature sensor on a 3D-shaped thermoplastic substrate suitable for packaging, flexible electronics, and other printed applications. The design, fabrication, and testing of a 3D printed temperature sensor are presented. The sensor pattern is designed using a computer-aided design program and fabricated by drop-on-demand inkjet printing using a magnetostrictive inkjet printhead at room temperature. The sensor pattern is printed using commercially available conductive silver nanoparticle ink. A moving speed of 90 mm/min is chosen to print the sensor pattern. The inkjet printed temperature sensor is demonstrated, and it is characterized by good electrical properties, exhibiting good sensitivity and linearity. The results indicate that 3D inkjet printing technology may have great potential for applications in sensor fabrication.

Sample Preparation and Preservation for TEM Analysis of Copper Interconnect Integrated Circuit

2004 ◽  
Author(s):  
Qiang Gao ◽  
Mark Zhang ◽  
Ming Li ◽  
Chorng Niou ◽  
W.T. Kary Chien
Keyword(s):  
Integrated Circuit ◽  
Thermal Exposure ◽  
Ambient Atmosphere ◽  
Ion Milling ◽  
Tem Analysis ◽  
Single Beam ◽  
Copper Interconnect ◽  
Beam Modulation ◽  
Area Of Interest ◽  
Transmission Electron

Abstract This paper examines copper-interconnect integrated circuit transmission electron microscope (TEM) sample contamination. It investigates the deterioration of the sample during ion milling and storage and introduces prevention techniques. The paper discusses copper grain agglomeration issues barrier/seed step coverage checking. The high temperature needed for epoxy solidifying was found to be harmful to sidewall coverage checking of seed. Single beam modulation using a glass dummy can efficiently prevent contamination of the area of interest in a TEM sample during ion milling. Adoption of special low-temperature cure epoxy resin can greatly reduce thermal exposure of the sample and prevent severe agglomeration of copper seed on via sidewall. TEM samples containing copper will deteriorate when stored in ordinary driers and sulphur contamination was found at the deteriorated point on the sample. Isolation of the sample from the ambient atmosphere has been verified to be very effective in protecting the TEM sample from deterioration.

scholarly journals Flexible Electronics: Flexible, Strong, Anisotropic Wood‐Derived Conductive Circuit (Adv. Sustainable Syst. 6/2021)

2021 ◽  
Vol 5 (6) ◽  
pp. 2170011
Author(s):  
Hao Sun ◽  
Tong Ji ◽  
Hongjie Bi ◽  
Xin Lin ◽  
Chen Chen ◽  
...  
Keyword(s):  
Flexible Electronics

scholarly journals Ultralow magnetostrictive flexible ferromagnetic nanowires

Nanoscale ◽  
2021 ◽  
Author(s):  
Giuseppe Muscas ◽  
Petra Jönsson ◽  
Ismael Garcia Serrano ◽  
Örjan Vallin ◽  
M. Venkata Kamalakar
Keyword(s):  
Flexible Electronics ◽  
Magnetic Nanowires ◽  
Wearable Technologies ◽  
Ferromagnetic Nanowires ◽  
Core Components

The integration of magneto-electric and spintronic sensors to flexible electronics presents massive potential for advancing flexible and wearable technologies. Magnetic nanowires are core components for building such devices. Therefore, realizing...

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