Mechanical strains and stresses in aluminum and copper interconnect lines for 0.18 μm logic technologies

1999 ◽  
Author(s):  
Paul R. Besser
Keyword(s):  
Copper Interconnect ◽  
Interconnect Lines

Microstructural characterization of inlaid copper interconnect lines

2001 ◽  
Vol 30 (4) ◽  
pp. 320-330 ◽  
Author(s):  
Paul R. Besser ◽  
Ehrenfried Zschech ◽  
Werner Blum ◽  
Delrose Winter ◽  
Richard Ortega ◽  
...  
Keyword(s):  
Microstructural Characterization ◽  
Copper Interconnect ◽  
Interconnect Lines

Grain growth in copper interconnect lines

2004 ◽  
Vol 76 (1-4) ◽  
pp. 190-194 ◽  
Author(s):  
W. Wu ◽  
D. Ernur ◽  
S.H. Brongersma ◽  
M. Van Hove ◽  
K. Maex
Keyword(s):  
Grain Growth ◽  
Copper Interconnect ◽  
Interconnect Lines

Reliability of a-Si:H TFTs and Copper Interconnect Lines for Flexible Electronics

2019 ◽  
Vol 16 (9) ◽  
pp. 345-351
Author(s):  
Yue Kuo ◽  
Mary R. Coan ◽  
Guojun Liu
Keyword(s):  
Flexible Electronics ◽  
Copper Interconnect ◽  
Interconnect Lines

Analytical electron microscopy of grain boundaries in Al-Cu metallizations

1992 ◽  
Vol 50 (2) ◽  
pp. 1684-1685
Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuits ◽  
Failure Mode ◽  
Current Density ◽  
Thermal History ◽  
Analytical Electron Microscopy ◽  
Cu Metallization ◽  
Analytical Electron ◽  
Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

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