Modeling of Copper CMP Using the Colloidal Behavior of an Alumina Slurry with Copper Nanoparticles
2007 ◽
Vol 154
(12)
◽
pp. H1018
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2006 ◽
Vol 153
(11)
◽
pp. G948
◽
2007 ◽
Vol 154
(6)
◽
pp. H507
◽
Keyword(s):
2019 ◽
Vol 6
(11)
◽
pp. 115058
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Keyword(s):