Use of Slurry Colloidal Behavior in Modeling of Material Removal Rates for Copper CMP
2007 ◽
Vol 154
(6)
◽
pp. H507
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2008 ◽
Vol 155
(8)
◽
pp. H582
◽
2006 ◽
Vol 153
(11)
◽
pp. G948
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2013 ◽
Vol 797
◽
pp. 73-78
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Keyword(s):
1994 ◽
Vol 208
(1)
◽
pp. 47-59
◽
Keyword(s):
2013 ◽
Vol 393
◽
pp. 108-114
Keyword(s):