Interface Engineering by PVD-Based In-Situ Fabrication Method for Advanced Metal/High-k Gate Stacks

2019 ◽  
Vol 6 (3) ◽  
pp. 71-85
Author(s):  
Heiji Watanabe ◽  
Shinya Horie ◽  
Hiroaki Arimura ◽  
Naomu Kitano ◽  
Takashi Minami ◽  
...  
2006 ◽  
Author(s):  
Shinya Horie ◽  
Takashi Minami ◽  
Naomu Kitano ◽  
Motomu Kosuda ◽  
Heiji Watanabe ◽  
...  

2019 ◽  
Vol 54 (21) ◽  
pp. 13821-13833 ◽  
Author(s):  
Noor Sahirah Muhazeli ◽  
Nur Azmah Nordin ◽  
Saiful Amri Mazlan ◽  
Norhaniza Rizuan ◽  
Siti Aishah Abdul Aziz ◽  
...  

2020 ◽  
Vol 143 (7) ◽  
Author(s):  
Xing Li ◽  
Chao Yan ◽  
Qi Liu ◽  
Guangneng Dong

Abstract Interface interaction between gallium-based liquid metal and copper-based materials results in the formation of intermetallic CuGa2 grains. In particular, CuGa2 grains are able to produce a uniform film and the newly formed CuGa2 film holds peculiar characteristics, which have not been fully explored up to now. In this study, we present an electrochemical fabrication method of an in situ CuGa2 film on copper surface. Surface morphology and chemical composition of this film are confirmed. Tribological experiments demonstrate that the CuGa2 film enables good antifriction and antiwear abilities. Furthermore, the lubrication mechanisms of the CuGa2 film are revealed.


2008 ◽  
Vol 254 (19) ◽  
pp. 6119-6122 ◽  
Author(s):  
Hiroaki Arimura ◽  
Shinya Horie ◽  
Yudai Oku ◽  
Takashi Minami ◽  
Naomu Kitano ◽  
...  

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