Grain Growth and Flecking in Electroplated Copper Caused by Cyclic Stress

1958 ◽  
Vol 105 (7) ◽  
pp. 384
Author(s):  
H. Ōkubo ◽  
N. Nozaki
Keyword(s):  
Grain Growth ◽  
Cyclic Stress ◽  
Electroplated Copper

Enhanced Grain Growth of Electroplated Copper on Cobalt-Containing Seed Layer

2013 ◽  
Vol 160 (12) ◽  
pp. D3045-D3050 ◽  
Author(s):  
Q. Huang ◽  
B. C. Baker-O'Neal ◽  
C. Cabral ◽  
E. Simonyi ◽  
V. R. Deline ◽  
...  
Keyword(s):  
Grain Growth ◽  
Seed Layer ◽  
Electroplated Copper

117 Cyclic Stress Measurement Using Grain Growth in Electrodeposited Nickel Foil

2014 ◽  
Vol 2014.52 (0) ◽  
pp. _117-1_-_117-2_
Author(s):  
Yasuyuki YAGI ◽  
Yuichi ONO ◽  
Takuya HARADA ◽  
Kouitu MIYACHIKA
Keyword(s):  
Grain Growth ◽  
Stress Measurement ◽  
Cyclic Stress ◽  
Nickel Foil ◽  
Electrodeposited Nickel

Grain-Growth in Metals by Cyclic Stress

Nature ◽  
1957 ◽  
Vol 180 (4586) ◽  
pp. 604-605 ◽  
Author(s):  
H. ŌKUBO ◽  
N. NOZAKI
Keyword(s):  
Grain Growth ◽  
Cyclic Stress

Annealing Phenomena in Cu/Ni Composite Electrodeposit

2012 ◽  
Vol 715-716 ◽  
pp. 952-952
Author(s):  
K.H. Kim ◽  
D.H. Kang ◽  
Yong Bum Park
Keyword(s):  
Grain Size ◽  
Grain Growth ◽  
Abnormal Grain Growth ◽  
The Other ◽  
Atomic Diffusion ◽  
Copper Sheet ◽  
Interfacial Stresses ◽  
Mean Size ◽  
Electroplated Copper ◽  
Different Parts

Cu/Ni composite electrodeposit was fabricated by electroplating nickel on the both sides of an electroplated copper sheet. In order to lower interfacial stresses between copper and nickel, the microstructure of nickel was controlled to consist of grains with a mean size of 15 nanometers. The different parts of the composite electrodeposit underwent different evolution of textures and microstructures during annealing. In the Cu electrodeposit, the as-deposited texture characterized by a relatively high <100>//ND and twin components transformed to be diffuse due to grain growth during annealing above 300°C. This is attributed to a large number of twins conducting the as-deposited microstructure. On the other hand, in the Ni electrodeposit, grain growth that takes place during annealing above 250°C corresponds to abnormal grain growth in terms of the scale change of the grain size. This grain growth also transformed the as-deposited texture of strong <100>//ND into a diffuse texture. In the interface between copper and nickel, the atomic diffusion was generated by excessive vacancies resulting from the grain growth during the annealing of nanostructured Ni electrodeposit. An 'interface texture' began to developed in the previous Cu region above 500°C, and the microtexture development was similar to the growth texture of the annealed Ni electrodeposit.

Current Induced Grain Growth of Electroplated Copper Film

2012 ◽  
Vol 51 ◽  
pp. 05EA04 ◽  
Author(s):  
Liyana Razak ◽  
Takamasa Yamaguchi ◽  
Seishi Akahori ◽  
Hideki Hashimoto ◽  
Kazuyoshi Ueno
Keyword(s):  
Grain Growth ◽  
Copper Film ◽  
Electroplated Copper

Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films

2003 ◽  
Vol 48 (6) ◽  
pp. 683-688 ◽  
Author(s):  
Jong-Min Paik ◽  
Young-Joon Park ◽  
Min-Seung Yoon ◽  
Je-Hun Lee ◽  
Young-Chang Joo
Keyword(s):  
Grain Boundary ◽  
Grain Growth ◽  
Abnormal Grain Growth ◽  
Copper Films ◽  
Electroplated Copper

Two-step room temperature grain growth in electroplated copper

1999 ◽  
Vol 86 (7) ◽  
pp. 3642-3645 ◽  
Author(s):  
S. H. Brongersma ◽  
E. Richard ◽  
I. Vervoort ◽  
H. Bender ◽  
W. Vandervorst ◽  
...  
Keyword(s):  
Grain Growth ◽  
Room Temperature ◽  
Electroplated Copper
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