Plasma-Enhanced Atomic Layer Deposition of Ru–TiN Thin Films for Copper Diffusion Barrier Metals

2006 ◽  
Vol 153 (6) ◽  
pp. G578 ◽  
Author(s):  
Se-Hun Kwon ◽  
Oh-Kyum Kwon ◽  
Jae-Sik Min ◽  
Sang-Won Kang
Keyword(s):  
Thin Films ◽  
Atomic Layer Deposition ◽  
Diffusion Barrier ◽  
Atomic Layer ◽  
Copper Diffusion ◽  
Layer Deposition ◽  
Tin Thin Films

Plasma-Enhanced Atomic Layer Deposition of Ta(C)N Thin Films for Copper Diffusion Barrier

2019 ◽  
Vol 25 (4) ◽  
pp. 301-308 ◽  
Author(s):  
Kwang-Ho Kim ◽  
Seong-Jun Jeong ◽  
Jaesik Yoon ◽  
Young-Moon Kim ◽  
Se-hun Kwon
Keyword(s):  
Thin Films ◽  
Atomic Layer Deposition ◽  
Diffusion Barrier ◽  
Atomic Layer ◽  
Copper Diffusion ◽  
Layer Deposition

Physical Properties of Highly Conformal TiN Thin films Grown by Atomic Layer Deposition

2003 ◽  
Vol 42 (Part 1, No. 3) ◽  
pp. 1375-1379 ◽  
Author(s):  
Jaebum Kim ◽  
Hyunseok Hong ◽  
Subhankar Ghosh ◽  
Ki-Young Oh ◽  
Chongmu Lee
Keyword(s):  
Thin Films ◽  
Atomic Layer Deposition ◽  
Physical Properties ◽  
Atomic Layer ◽  
Layer Deposition ◽  
Tin Thin Films

Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition

2014 ◽  
Vol 3 (7) ◽  
pp. P253-P258 ◽  
Author(s):  
Loïc Assaud ◽  
Kristina Pitzschel ◽  
Margrit Hanbücken ◽  
Lionel Santinacci
Keyword(s):  
Thin Films ◽  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Layer Deposition ◽  
Tin Thin Films
Sign in / Sign up

Export Citation Format

Share Document