The Effects of Ion Beam Etching on Si, Ge, GaAs , and InP Schottky Barrier Diodes

1985 ◽  
Vol 132 (4) ◽  
pp. 918-922 ◽  
Author(s):  
C. S. Wu ◽  
D. M. Scott ◽  
Wei Chen ◽  
S. S. Lau
Keyword(s):  
Schottky Barrier ◽  
Ion Beam ◽  
Schottky Barrier Diodes ◽  
Ion Beam Etching

Current/voltage characteristics of ion beam synthesised CoSi2/Si Schottky barrier diodes

1992 ◽  
Vol 28 (3) ◽  
pp. 296 ◽  
Author(s):  
R.S. Spraggs ◽  
G. Pananakakis ◽  
D. Bauza ◽  
K.J. Reeson ◽  
B.J. Sealy
Keyword(s):  
Schottky Barrier ◽  
Ion Beam ◽  
Schottky Barrier Diodes ◽  
Current Voltage ◽  
Current Voltage Characteristics

scholarly journals Medium Energy Carbon and Nitrogen Ion Beam Induced Modifications in Charge Transport, Structural and Optical Properties of Ni/Pd/n-GaN Schottky Barrier Diodes

Materials ◽  
2020 ◽  
Vol 13 (6) ◽  
pp. 1299 ◽  
Author(s):  
Santosh Kumar ◽  
Xiang Zhang ◽  
Vinay Kumar Mariswamy ◽  
Varra Rajagopal Reddy ◽  
Asokan Kandasami ◽  
...  
Keyword(s):  
Optical Properties ◽  
Charge Transport ◽  
Schottky Barrier ◽  
Ion Irradiation ◽  
Ion Beam ◽  
Schottky Barrier Diodes ◽  
Medium Energy ◽  
Structural And Optical Properties ◽  
Carbon And Nitrogen ◽  
Nitrogen Ion

The irradiation effects of carbon and nitrogen medium energy ions (MEI) on charge transport, structural and optical properties of Ni/Pd/n-GaN Schottky barrier diodes are reported. The devices are exposed to 600 keV C2+ and 650 keV N2+ ions in the fluence range of 1 × 1013 to 1 × 1015 ions cm−2. The SRIM/TRIM simulations provide quantitative estimations of damage created along the trajectories of ion beams in the device profile. The electrical parameters like Schottky barrier height, series resistance of the Ni/Pd/n-GaN Schottky barrier diodes decreases for a fluence of 1 × 1013 ions cm−2 and thereafter increases with an increase in fluence of 600 keV C2+ and 650 keV N2+ ions. The charge transport mechanism is influenced by various current transport mechanisms along with thermionic emission. Photoluminescence studies have demonstrated the presence of yellow luminescence in the pristine samples. It disappears at higher fluences due to the possible occupancy of Ga vacancies. The presence of the green luminescence band may be attributed to the dislocation caused by the combination of gallium vacancy clusters and impurities due to MEI irradiation. Furthermore, X-ray diffraction studies reveal that there is a decrease in the intensity and shift in the diffraction peaks towards the lower side of two thetas. The reductions in the intensity of C2+ ion irradiation is more when compared to N2+ ion irradiation, which may be attributed to change in the mean atomic scattering factor on a given site for light C2+ ion as compared to N2+ ion.

Electrical Characterization of Phosphorus Doped Ion Beam Synthesised CoSi2/Si Schottky Barrier Diodes.

1992 ◽  
Vol 260 ◽  
Author(s):  
R. S. Spraggs ◽  
G. Pananakakis ◽  
D. Bauza ◽  
K. J. Reeson ◽  
R. M. Gwilliam ◽  
...  
Keyword(s):  
Charge Density ◽  
Space Charge ◽  
Schottky Barrier ◽  
Ion Beam ◽  
Electrical Characterization ◽  
Space Charge Density ◽  
Schottky Barrier Diodes ◽  
Dopant Distribution ◽  
Annealing Temperatures ◽  
Current Voltage

ABSTRACTThe current/voltage characteristics of ion beam synthesised CoSi2/Si (n - type) Schottky barrier diodes implanted with phosphorus to doses between 5 × 1012 and 2 × 1013 ions cm-2are examined after annealing at temperatures in the range 400° - 1000°C. For each dose of implanted phosphorus, the effective barrier height of the CoSi2/Si interface is successively reduced as the anneal temperature increases. The results of Secondary Ion Mass Spectroscopy (SIMS) analysis indicate that these changes are due to an increase in the space charge density at the interface. For lower annealing temperatures the increase in space charge density is attributed to activation of the phosphorus in the tail of the dopant distribution which extends across the CoSi2/Si interface. For higher annealing temperatures larger increases in the space charge density are attributed to a modified dopant distribution resulting from phosphorus diffusion and activation at the interface. For doses of 1 × 1014 P* cm-2and 2×1015P*cm2, ohrnie characteristics are seen after annealing at temperatures of 1000°C and 500°C respectively.

Ultrastructural Features of Normal and Diseased Hair Revealed by Ion Beam Etching and Freeze Fracture

1975 ◽  
Vol 33 ◽  
pp. 358-359
Author(s):  
M. Spector ◽  
A. C. Brown
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Ectodermal Dysplasia ◽  
Ion Beam ◽  
Freeze Fracture ◽  
Ion Current ◽  
Ion Beam Etching ◽  
Pili Torti ◽  
Argon Ion ◽  
Scanning Electron

Ion beam etching and freeze fracture techniques were utilized in conjunction with scanning electron microscopy to study the ultrastructure of normal and diseased human hair. Topographical differences in the cuticular scale of normal and diseased hair were demonstrated in previous scanning electron microscope studies. In the present study, ion beam etching and freeze fracture techniques were utilized to reveal subsurface ultrastructural features of the cuticle and cortex.Samples of normal and diseased hair including monilethrix, pili torti, pili annulati, and hidrotic ectodermal dysplasia were cut from areas near the base of the hair. In preparation for ion beam etching, untreated hairs were mounted on conducting tape on a conducting silicon substrate. The hairs were ion beam etched by an 18 ky argon ion beam (5μA ion current) from an ETEC ion beam etching device. The ion beam was oriented perpendicular to the substrate. The specimen remained stationary in the beam for exposures of 6 to 8 minutes.

Gallium Oxide Schottky Barrier Diodes

2016 ◽  
Vol 136 (4) ◽  
pp. 479-483
Author(s):  
Masataka Higashiwaki ◽  
Kohei Sasaki ◽  
Hisashi Murakami ◽  
Yoshinao Kumagai ◽  
Akito Kuramata
Keyword(s):  
Schottky Barrier ◽  
Gallium Oxide ◽  
Schottky Barrier Diodes

Chemical Precursors for GaAs Etching with low Energy ion Beams: Chlorine adsorption on GaAs(100)

1991 ◽  
Vol 223 ◽  
Author(s):  
Richard B. Jackman ◽  
Glenn C. Tyrrell ◽  
Duncan Marshall ◽  
Catherine L. French ◽  
John S. Foord
Keyword(s):  
Ion Beam ◽  
Ion Beams ◽  
Low Energy ◽  
Ion Beam Etching ◽  
Chlorine Adsorption

ABSTRACTThis paper addresses the issue of chlorine adsorption on GaAs(100) with respect to the mechanisms of thermal and ion-enhanced etching. The use of halogenated precursors eg. dichloroethane is also discussed in regard to chemically assisted ion beam etching (CAIBE).

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