Highly Selective Reactive Ion Etching of Polysilicon with Hydrogen Bromide

1989 ◽  
Vol 136 (10) ◽  
pp. 3003-3006 ◽  
Author(s):  
L. Y. Tsou
2004 ◽  
Vol 224 (1-4) ◽  
pp. 222-226 ◽  
Author(s):  
C.S. Wang ◽  
D.Y. Shu ◽  
W.Y. Hsieh ◽  
M.-J. Tsai

2001 ◽  
Vol 227-228 ◽  
pp. 801-804 ◽  
Author(s):  
Lin Guo ◽  
Kaicheng Li ◽  
Daoguang Liu ◽  
Yihong Ou ◽  
Jing Zhang ◽  
...  

Materials ◽  
2020 ◽  
Vol 13 (19) ◽  
pp. 4278
Author(s):  
Na Zhou ◽  
Junjie Li ◽  
Haiyang Mao ◽  
Hao Liu ◽  
Jinbiao Liu ◽  
...  

Heavily doped polysilicon layers have been widely used in the fabrication of microelectromechanical systems (MEMS). However, the investigation of high selectivity, anisotropy, and excellent uniformity of heavily doped polysilicon etching is limited. In this work, reactive ion etching of undoped and heavily doped polysilicon-based hydrogen bromide (HBr) plasmas have been compared. The mechanism of etching of heavily doped polysilicon is studied in detail. The final results demonstrate that the anisotropy profile of heavily doped polysilicon can be obtained based on a HBr plasma process. An excellent uniformity of resistance of the thermocouples reached ± 2.11%. This technology provides an effective way for thermopile and other MEMS devices fabrication.


1994 ◽  
Vol 30 (22) ◽  
pp. 1895-1897 ◽  
Author(s):  
A.T. Ping ◽  
I. Adesida ◽  
J.N. Kuznia ◽  
M. Asif Khan

1996 ◽  
Author(s):  
George F. McLane ◽  
Paul Cooke ◽  
Robert P. Moerkirk

2020 ◽  
Vol 54 (6) ◽  
pp. 672-676
Author(s):  
L. K. Markov ◽  
I. P. Smirnova ◽  
M. V. Kukushkin ◽  
A. S. Pavluchenko

1988 ◽  
Vol 24 (13) ◽  
pp. 798 ◽  
Author(s):  
T. Matsui ◽  
H. Sugimoto ◽  
T. Ohishi ◽  
H. Ogata

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