A Mathematical Model for a Parallel Plate Plasma Etching Reactor

1988 ◽  
Vol 135 (11) ◽  
pp. 2786-2794 ◽  
Author(s):  
Demetre J. Economou ◽  
Richard C. Alkire
Keyword(s):  
Mathematical Model ◽  
Plasma Etching ◽  
Parallel Plate

The Influence of HBr Discharge Ambience on Poly-Si/SiO2 Etching Selectivity

1991 ◽  
Vol 223 ◽  
Author(s):  
E. Ikawa ◽  
K. Tokashiki ◽  
T. Kikkawa ◽  
Y. Teraoka ◽  
I. Nishiyama
Keyword(s):  
Plasma Etching ◽  
Parallel Plate ◽  
Etch Rate ◽  
Etching Rate ◽  
Mass Analysis ◽  
Ion Etching ◽  
Loading Effect ◽  
Batch Type ◽  
Etching Selectivity ◽  
Hbr Plasma

ABSTRACTThe influence of HBr discharge ambience on SiO2 etching is investigated. A batch type parallel-plate reactive ion etching (RIE) dry etcher was used. The discharge ambience was changed by changing the numbers of poly-Si and SiO2 wafers in the same chamber. It is found that as the number of poly-Si wafers increased, the poly-Si etch rate slightly decreased due to a loading effect and SiO2 etching rate drastically increased. The selectivity of poly-Si / SiO2 decreased with increasing the ratio of the loaded poly-Si number in the same chamber. When A12O3 wafers instead of poly-Si wafers were loaded with SiO2 substrates, SiO2 etching rate enhancement did not occur. Therefore, increase of SiO2 etch rate could not be explained using a loading effect. From the results of mass analysis during etching in Si contained HBr plasma, etching products SiBrx (x=1,2,3) peaks were observed. Namely, when the Si etching products were supplied to SiO2 surface, SiO2 etch rate increased. In order to suppress the enhancement of SiO2 etch rate, the etch temperature must be reduced.

Mathematical model of the plasma etching of resists containing silicon

1992 ◽  
Author(s):  
Dan V. Nicolau ◽  
Gheorghita Jinescu ◽  
Florin Fulga ◽  
Mircea V. Dusa
Keyword(s):  
Mathematical Model ◽  
Plasma Etching

A mathematical model for flow maldistribution study in a parallel plate-fin heat exchanger

2017 ◽  
Vol 121 ◽  
pp. 462-472 ◽  
Author(s):  
Huizhu Yang ◽  
Jian Wen ◽  
Xin Gu ◽  
Yuce Liu ◽  
Simin Wang ◽  
...  
Keyword(s):  
Mathematical Model ◽  
Heat Exchanger ◽  
Parallel Plate ◽  
Flow Maldistribution

scholarly journals MATHEMATICAL ANALYSIS OF UNSTEADY MHD BLOOD FLOW THROUGH PARALLEL PLATE CHANNEL WITH HEAT SOURCE

2020 ◽  
Vol 5 (1) ◽  
pp. 40-50
Author(s):  
M.V. Surseh ◽  
P. Sekar
Keyword(s):  
Mathematical Model ◽  
Blood Flow ◽  
Numerical Model ◽  
Heat Source ◽  
Prandtl Number ◽  
Mathematical Analysis ◽  
Parallel Plate ◽  
Flow Through ◽  
Fractional Differential ◽  
Plate Channel

A mathematical model of flimsy blood move through parallel plate channel under the action of a connected steady transverse attractive field is proposed. The model is subjected to warm source. Expository articulations are gotten by picking the hub speed; temperature dispersion and the typical speed of the blood rely upon y and t just to change over the arrangement of fractional differential conditions into an arrangement of normal differential conditions under the conditions characterized in our model. The model has been breaking down to discover the impacts of different parameters, for example, Hart-mann number, warm source parameter and Prandtl number on the hub speed, temperature circulation, and the ordinary speed. The numerical arrangements of pivotal speed, temperature conveyances, and typical speed are demonstrated graphically for better comprehension of the issue. Subsequently, the present numerical model gives a straightforward type of pivotal speed, temperature circulation and typical speed of the bloodstream so it will help not just individuals working in the field of Physiological liquid elements yet in addition to the restorative professionals.

Scale-up of a Parallel Plate RF Plasma Etching Reactor by Using Reactive Gas Flow Simulations

2001 ◽  
Vol 148 (8) ◽  
pp. G456 ◽  
Author(s):  
Masato Ikegawa ◽  
Takahiro Tamai ◽  
Koyo Morita ◽  
Kenji Maeda
Keyword(s):  
Plasma Etching ◽  
Parallel Plate ◽  
Gas Flow ◽  
Scale Up ◽  
Rf Plasma ◽  
Flow Simulations ◽  
Reactive Gas

scholarly journals Numerical Investigation on Suppressing High Frequency Self-Excited Noises of Armature Assembly in a Torque Motor Using Ferrofluid

2017 ◽  
Vol 2017 ◽  
pp. 1-10
Author(s):  
Hasiaoqier Han ◽  
Songjing Li ◽  
Liang Guo ◽  
Qingwen Wu
Keyword(s):  
Numerical Simulation ◽  
Mathematical Model ◽  
High Frequency ◽  
Parallel Plate ◽  
Shear Thickening ◽  
Squeeze Flow ◽  
Resistance Force ◽  
Viscous Damping ◽  
The Mathematical Model ◽  
Damping Model

Attempting to suppress high frequency self-excited noises of armature assembly, ferrofluid is added to the working clearances of torque motor. The mathematical model of resistance force of ferrofluid applied to armature is derived theoretically from parallel plate squeeze flow theory and ferrofluid constitutive model in which shear thickening and shear thinning effects are taken into account. Then the equivalent physical model of ferrofluid is established according to the resistance force, and, through analysis, it can be further simplified as viscous damping model. Finally, the suppressing effect introduced by ferrofluid on high frequency noises of armature assembly is verified by comparing the results of numerical simulation with ferrofluid and that without ferrofluid.

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