Electrochemically Deposited Cobalt Thin Films on p‐Type Silicon and Its Characterization

1995 ◽  
Vol 142 (11) ◽  
pp. 3889-3892 ◽  
Author(s):  
C. Wisniewski ◽  
I. Denicoló ◽  
I. A. Hümmelgen
2016 ◽  
Author(s):  
A. K. M. Muaz ◽  
U. Hashim ◽  
M. K. Md. Arshad ◽  
A. R. Ruslinda ◽  
R. M. Ayub ◽  
...  

1991 ◽  
Vol 238 ◽  
Author(s):  
F. Abou-Elfotouh ◽  
S. Ashour ◽  
S. A. Alkuhaimi ◽  
J. Zhang ◽  
D. J. Dunlavy ◽  
...  

ABSTRACTThe properties (electrical and structural) and the defect levels dominating cadmium telluride (CdTe) films prepared by radio frequency (rf) planar magnetron sputtering, and electrochemical deposition have been determined and compared. The properties of the deposited CdTe film and the behavior of its interface with cadmium sulfide (CdS) depend strongly on the method of depositing the CdTe film, and on postdeposition heat treatments. These treatments determine various parameters crucial to the device performance, including the type and concentration of the dominant defects, interface states, and deep trap levels. Photoluminescence (PL) emission from p-type CdTe polycrystalline thin films and single crystals is reported at low temperatures (9–50 K) as well as at room temperature. The room temperature PL peak at 1.58 eV due to band-to-band recombination was observed for the first time in polycrystalline thin films. The peak location of the exciton emission is indicative of the structure perfection of the film, which is also related to the deviation from stoichiometry. The as-grown polycrystalline films are composed of a close-packed array of preferentially oriented (the [100], [110], and [111] axes aligned perpendicular to the substrate) single-crystal grains of a size in the range of 0.25–2.0 μm for the electrochemically deposited films (E-film) and 0.3–4.0 μm for rf sputtered material (rf-film). The resistivity of the heat treated E-film was substantially lower than that of the rf-film (ρ = 1.0–5.0 and 300–500 Ωcm). The performance of the CdS/(E-CdTe) devices is limited by deep levels, while the performance of die rf-CdTe device is affected by a high density of interface states.


1982 ◽  
Vol 13 ◽  
Author(s):  
A. S. Wakita ◽  
T. W. Sigmon ◽  
J. F. Gibbons

ABSTRACT4He+ Backscattering and SIMS were used to study impurity redistribution during laser formation of refractory silicides. Thin films of Mo and W were evaporated on to <100> p-type silicon substrates, which were As or B implanted to doses of 1 ×1015 to 1 ×1016cm−2 . These samples were laser reacted with multiple or single laser scans at various powers. Analysis of these films indicate impurity movement into the forming silicide layer. Impurity concentrations in the films were observed to be as high as 7.8×1020 cm−3−> for As in WSi2 , however a reduction in this concentration occurred with subsequent thermal annealing.


2013 ◽  
Vol 54 ◽  
pp. 85-90 ◽  
Author(s):  
Sang-Hoon Lee ◽  
Yung-Bin Chung ◽  
Sung-Soo Lee ◽  
Jae-Soo Jung ◽  
Nong-Moon Hwang

1986 ◽  
Vol 74 ◽  
Author(s):  
M. Siegal ◽  
J. J. Santiago ◽  
J. Van Der Spiegel ◽  
W. R. Graham ◽  
M. Setton

AbstractThin films of tungsten silicide with resistivities of 30 – 35 μΩ-cm have been formed by sputter depositing 71 nm of W metal onto (100) oriented, 5 Ω-cm, p-type silicon wafers that were etched in BOE 500 solution. The samples were fast radiatively processed in an RTA system under high vacuum for time anneals ranging from 15 – 50 seconds at a temperature of ∼ 1100°C. The inevitable oxide barrier at the interface is shown to decrease with increasing RTA time.


2018 ◽  
Vol 09 (02) ◽  
pp. 259-272
Author(s):  
Rémi Ndioukane ◽  
Moussa Touré ◽  
Diouma Kobor ◽  
Laurence Motte ◽  
Marcel Pasquinelli ◽  
...  

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