High Aspect Ratio Trench Filling Using Two‐Step Subatmospheric Chemical Vapor Deposited Borophosphosilicate Glass for <0.18 μm Device Application
1999 ◽
Vol 146
(5)
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pp. 1884-1888
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1997 ◽
Vol 144
(9)
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pp. 3208-3212
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2005 ◽
Vol 152
(6)
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pp. C408
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2017 ◽
Vol 56
(6S2)
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pp. 06HE02
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Keyword(s):
Keyword(s):
2012 ◽
Vol 30
(5)
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pp. 051204
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Keyword(s):