Chemical Mechanical Polishing of a Fluorinated Carbon Low Dielectric Constant Interlayer and a Tantalum Nitride Barrier Layer by Magnesium Oxide Slurry

1999 ◽  
Vol 2 (7) ◽  
pp. 339 ◽  
Author(s):  
Tohru Hara
Keyword(s):  
Dielectric Constant ◽  
Magnesium Oxide ◽  
Barrier Layer ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Tantalum Nitride ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Fluorinated Carbon

Investigations Of The Chemical-Mechanical Polishing Of Polymer Films For ILD Applications

1995 ◽  
Vol 381 ◽  
Author(s):  
Jan. M. Neirynck ◽  
S. P. Murarka ◽  
R. J. Gutmann
Keyword(s):  
Dielectric Constant ◽  
Chemical Mechanical Polishing ◽  
Chemical Properties ◽  
Mechanical Polishing ◽  
Low Dielectric Constant ◽  
Acidic Ph ◽  
Interlayer Dielectric ◽  
Low Dielectric ◽  
Damascene Process ◽  
And Chemical Properties

AbstractLow dielectric constant films are being investigated as the interlayer dielectric (ILD) in a multilevel interconnection scheme for advanced ULSI circuits. In such applications they will be subjected to planarization processes using chemical-mechanical polishing (CMP), either directly during dielectric planarization or indirectly in the final stages of metal patterning using the Damascene process. In this paper we report the results of our initial investigations of the CMP of three different polymers, all with dielectric constant in the range of 2.3 – 2.7 and with different mechanical and chemical properties. The CMP was carried out using alumina as the abrasive in basic and acidic pH slurries. The effect of preannealing the polymer on the CMP behavior was also investigated

Chemical Mechanical Polishing Mechanisms of Low Dielectric Constant Polymers in Copper Slurries

1999 ◽  
Vol 146 (11) ◽  
pp. 4309-4315 ◽  
Author(s):  
Christopher L. Borst ◽  
Dipto G. Thakurta ◽  
William N. Gill ◽  
Ronald J. Gutmann
Keyword(s):  
Dielectric Constant ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Low Dielectric Constant ◽  
Low Dielectric

Thermal Stability and Interfacial Reaction of Barrier Layers with Low-Dielectric-Constant Fluorinated Carbon Interlayer

2000 ◽  
Vol 39 (Part 2, No. 6A) ◽  
pp. L506-L509 ◽  
Author(s):  
Tohru Hara ◽  
Keiichi Sakamoto ◽  
Fumiaki Togoh ◽  
Hongning Yang ◽  
David R. Evans
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Interfacial Reaction ◽  
Low Dielectric Constant ◽  
Barrier Layers ◽  
Low Dielectric ◽  
Fluorinated Carbon
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