Thermal Stability of Sputtered Tungsten Carbide as Diffusion Barrier for Copper Metallization

2001 ◽  
Vol 148 (9) ◽  
pp. G500 ◽  
Author(s):  
Shui Jinn Wang ◽  
Hao Yi Tsai ◽  
S. C. Sun ◽  
M. H. Shiao
Keyword(s):  
Thermal Stability ◽  
Tungsten Carbide ◽  
Diffusion Barrier ◽  
Copper Metallization ◽  
Thermal Stability Of

Comparison of Ru/Ta and Ru/TaN as Barrier Stack for Copper Metallization

2006 ◽  
Vol 914 ◽  
Author(s):  
Xin-Ping Qu ◽  
Jing-Jing Tan ◽  
Mi Zhou ◽  
Tao Chen ◽  
Guo-Ping Ru ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Diffusion Barrier ◽  
Ion Beam ◽  
Barrier Properties ◽  
Copper Metallization ◽  
Ion Beam Sputtering ◽  
Beam Sputtering ◽  
Cu Interconnect ◽  
Interconnect Technology ◽  
Thermal Stability Of

AbstractThe diffusion barrier properties for ultrathin Ru/Ta and Ru/TaN bilayer structure as the copper diffusion barrier are compared. Cu, Ru, Ta and TaN thin films are deposited by using the ion beam sputtering technique. The experimental results show that the thermal stability of the Cu/Ru/Ta or TaN /Si structure is much more improved than that of the Cu/Ru/Si structure without the interlayer. However, the Cu/Ru/TaN/Si shows better thermal stability than the Cu/Ru/Ta/Si structure, which should be attributed to the amorphous nature of the TaN interlayer. The microstructure evolution of the Cu/Ru/Ta (TaN)/Si structure during annealing is discussed. The results show that the Ru/TaN bilayer can be a very promising diffusion barrier in the future seedless Cu interconnect technology.

Thermal stability of PECVD W-B-N thin film as a diffusion barrier

1997 ◽  
Author(s):  
YongTae Kim ◽  
Dong J. Kim ◽  
Chang W. Lee ◽  
Jong-Wan Park
Keyword(s):  
Thin Film ◽  
Thermal Stability ◽  
Diffusion Barrier ◽  
Thermal Stability Of

Thermal stability of ultra thin Zr-B-N films as diffusion barrier between Cu and Si

2020 ◽  
Vol 527 ◽  
pp. 146810
Author(s):  
Y. Meng ◽  
Z.X. Song ◽  
Y.H. Li ◽  
D. Qian ◽  
W. Hu ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Diffusion Barrier ◽  
Thermal Stability Of

scholarly journals Thermal stability of Mg/Co multilayer with B_4C, Mo or Zr diffusion barrier layers

2011 ◽  
Vol 19 (22) ◽  
pp. 21849 ◽  
Author(s):  
Jingtao Zhu ◽  
Sika Zhou ◽  
Haochuan Li ◽  
Zhanshan Wang ◽  
Philippe Jonnard ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Diffusion Barrier ◽  
Barrier Layers ◽  
Thermal Stability Of

Thermal Stability of Amorphous-like WNx/W Bilayered Diffusion Barrier for Chemical Vapor Deposited-Tungsten/p+-Si Contact System

1999 ◽  
Vol 38 (Part 1, No. 3A) ◽  
pp. 1343-1351 ◽  
Author(s):  
Kow-Ming Chang ◽  
I-Chung Deng ◽  
Ta-Hsun Yeh ◽  
Kuen-Der Lain ◽  
Chao-Ming Fu
Keyword(s):  
Thermal Stability ◽  
Diffusion Barrier ◽  
Chemical Vapor ◽  
Contact System ◽  
Chemical Vapor Deposited ◽  
Thermal Stability Of

Thermal stability of AlCrTaTiZrMo-nitride high entropy film as a diffusion barrier for Cu metallization

2019 ◽  
Vol 773 ◽  
pp. 482-489 ◽  
Author(s):  
Rongbin Li ◽  
Minxu Li ◽  
Chunxia Jiang ◽  
Bangwei Qiao ◽  
Weiwei Zhang ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Diffusion Barrier ◽  
High Entropy ◽  
Cu Metallization ◽  
Thermal Stability Of
Sign in / Sign up

Export Citation Format

Share Document