Electroless Plating of Copper and Nickel on Surface-Modified Poly(tetrafluoroethylene) Films

2001 ◽  
Vol 148 (2) ◽  
pp. C71 ◽  
Author(s):  
M. C. Zhang ◽  
E. T. Kang ◽  
K. G. Neoh ◽  
K. L. Tan
Keyword(s):  
Electroless Plating ◽  
Surface Modified

Electroless plating of nickel–phosphorous on surface-modified poly(ethylene terephthalate) films

2003 ◽  
Vol 220 (1-4) ◽  
pp. 238-250 ◽  
Author(s):  
S.C Domenech ◽  
E Lima ◽  
V Drago ◽  
J.C De Lima ◽  
N.G Borges ◽  
...  
Keyword(s):  
Electroless Plating ◽  
Ethylene Terephthalate ◽  
Poly Ethylene Terephthalate ◽  
Poly Ethylene ◽  
Surface Modified

Electroless plating of copper on surface-modified glass substrate

2011 ◽  
Vol 257 (18) ◽  
pp. 8067-8071 ◽  
Author(s):  
Wei Su ◽  
Libei Yao ◽  
Fang Yang ◽  
Peiyuan Li ◽  
Juan Chen ◽  
...  
Keyword(s):  
Electroless Plating ◽  
Glass Substrate ◽  
Surface Modified

scholarly journals Laser direct structuring and electroless plating applicable super-engineering plastic PPS based thermal conductive composite with particle surface modification

RSC Advances ◽  
2018 ◽  
Vol 8 (18) ◽  
pp. 9933-9940
Author(s):  
Kiho Kim ◽  
Jinseong Lee ◽  
Seokgyu Ryu ◽  
Jooheon Kim
Keyword(s):  
Surface Modification ◽  
Boron Nitride ◽  
Polymer Matrix ◽  
Electroless Plating ◽  
Coupling Agent ◽  
Silane Coupling Agent ◽  
Particle Surface ◽  
Engineering Plastic ◽  
Silane Coupling ◽  
Surface Modified

Boron nitride (BN) and laser activate particles (LAPs) which used for electroless plating were surface-modifiedviabase treatment and by using a silane coupling agent in order to confer functionality and enhance the interfacial affinity of these particles for a polymer matrix.

Copper Metallization on the Surface-Modified Polyimide Films by Electroless Plating Method

2008 ◽  
Vol 492 (1) ◽  
pp. 275/[639]-282/[646] ◽  
Author(s):  
Eun Sun Ji ◽  
Hyun Gil Cha ◽  
Chang Woo Kim ◽  
Young Soo Kang
Keyword(s):  
Electroless Plating ◽  
Copper Metallization ◽  
Polyimide Films ◽  
Plating Method ◽  
Surface Modified ◽  
Electroless Plating Method

Analytical Electron Microscopy of Surface-Modified Ceramics

1985 ◽  
Vol 43 ◽  
pp. 276-279
Author(s):  
P. S. Sklad
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Theoretical Models ◽  
Ceramic Materials ◽  
Solute Concentration ◽  
Second Phase ◽  
Analytical Electron ◽  
Implantation Techniques ◽  
Lattice Damage ◽  
Surface Modified

Over the past several years, it has become increasingly evident that materials for proposed advanced energy systems will be required to operate at high temperatures and in aggressive environments. These constraints make structural ceramics attractive materials for these systems. However it is well known that the condition of the specimen surface of ceramic materials is often critical in controlling properties such as fracture toughness, oxidation resistance, and wear resistance. Ion implantation techniques offer the potential of overcoming some of the surface related limitations.While the effects of implantation on surface sensitive properties may be measured indpendently, it is important to understand the microstructural evolution leading to these changes. Analytical electron microscopy provides a useful tool for characterizing the microstructures produced in terms of solute concentration profiles, second phase formation, lattice damage, crystallinity of the implanted layer, and annealing behavior. Such analyses allow correlations to be made with theoretical models, property measurements, and results of complimentary techniques.

Sign in / Sign up

Export Citation Format

Share Document