Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole
2002 ◽
Vol 149
(10)
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pp. C521
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2001 ◽
Vol 148
(9)
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pp. C574
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Keyword(s):
2008 ◽
Vol 19
(5)
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pp. 335-341
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Keyword(s):
2000 ◽
Vol 36
(10)
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pp. 2095-2103
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2001 ◽
Vol 148
(2)
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pp. C71
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2012 ◽
Vol 415
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pp. 374-379
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2000 ◽
Vol 14
(7)
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pp. 897-914
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2002 ◽
Vol 106
(48)
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pp. 12508-12516
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2002 ◽
Vol 149
(1)
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pp. C10
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Keyword(s):