Electroless plating of copper on surface-modified glass substrate

2011 ◽  
Vol 257 (18) ◽  
pp. 8067-8071 ◽  
Author(s):  
Wei Su ◽  
Libei Yao ◽  
Fang Yang ◽  
Peiyuan Li ◽  
Juan Chen ◽  
...  
Keyword(s):  
Electroless Plating ◽  
Glass Substrate ◽  
Surface Modified

Electroless Plating of Copper and Nickel on Surface-Modified Poly(tetrafluoroethylene) Films

2001 ◽  
Vol 148 (2) ◽  
pp. C71 ◽  
Author(s):  
M. C. Zhang ◽  
E. T. Kang ◽  
K. G. Neoh ◽  
K. L. Tan
Keyword(s):  
Electroless Plating ◽  
Surface Modified

Electroless plating of nickel–phosphorous on surface-modified poly(ethylene terephthalate) films

2003 ◽  
Vol 220 (1-4) ◽  
pp. 238-250 ◽  
Author(s):  
S.C Domenech ◽  
E Lima ◽  
V Drago ◽  
J.C De Lima ◽  
N.G Borges ◽  
...  
Keyword(s):  
Electroless Plating ◽  
Ethylene Terephthalate ◽  
Poly Ethylene Terephthalate ◽  
Poly Ethylene ◽  
Surface Modified

AN INVESTIGATION OF SMOOTH NANOSIZED COPPER FILMS ON GLASS SUBSTRATE BY IMPROVED ELECTROLESS PLATING

2006 ◽  
Vol 13 (04) ◽  
pp. 471-478 ◽  
Author(s):  
HUIPING ZHANG ◽  
ZHONGHAO JIANG ◽  
XIANLI LIU ◽  
JIANSHE LIAN
Keyword(s):  
Grain Size ◽  
Film Thickness ◽  
Electroless Plating ◽  
Glass Substrate ◽  
Deposition Time ◽  
Copper Films ◽  
Diffraction Intensity ◽  
Cu Films ◽  
Fine Grain ◽  
Cu Film

Thin nanocrystalline Cu films (< 1 μm) are deposited on a glass substrate using an improved electroless plating technique. The deposition course of the Cu film is illustrated by the variation of surface morphology with different deposition time. The results show that a more uniform and continuous nanocrystalline Cu film with very small nodules can be formed on a glass substrate at the deposition time over 1 min. The roles of SDBS as an additive in the bath are also discussed. According to the relation of the film thickness and the deposition time, it is obvious that the film thickness nearly linearly varies with the deposition time in the present work. An enhanced (111) texture with the diffraction intensity ratio (I(111)/I(200)) of about 4.0 and the very fine grain size of 15–28 nm determined by X-ray results has been observed. The variations of the resistivity show that it is strongly affected by the film thickness and grain size.

Effects of Surface Treatment on Adhesion of Silver Film on Glass Substrate Fabricated by Electroless Plating

2013 ◽  
Vol 664 ◽  
pp. 566-573 ◽  
Author(s):  
Natechanok Chitvoranund ◽  
Sirithan Jiemsirilers ◽  
Dujreutai Pongkao Kashima
Keyword(s):  
Surface Treatment ◽  
Electroless Plating ◽  
Glass Substrate ◽  
Silver Film ◽  
Combined Treatment ◽  
Nitrate Solution ◽  
Silver Nitrate Solution ◽  
Before And After ◽  
Plating Solution ◽  
Phase Surface

Silver film was fabricated on a glass substrate by electroless plating technique. Plating solution, which also known as Tollen’s reagent, consisted of three main solutions: silver nitrate solution as a silver source, ammonia and sodium hydroxide as pH controllers and D-glucose as a reducing agent. Glass surface was treated by three different methods: HF etching, SnCl2activation and SiC paper grinding. After that, a glass slide was immersed in plating solution for 90 minutes at a room temperature. The purpose of this work was to study the effects of different surface treatments on adhesion between substrate and film. X-ray diffraction (XRD) pattern confirmed that the obtained film was a silver phase. Surface morphology of glass slides, before and after plating was investigated by scanning electron microscope (SEM). Moreover, the adhesion of silver film to glass substrate was performed by crosscut test and it was indicated that combined treatment by SiC paper grinding and HF etching was the best surface treatment which provided a good adhesion of film to substrate.

scholarly journals Laser direct structuring and electroless plating applicable super-engineering plastic PPS based thermal conductive composite with particle surface modification

RSC Advances ◽  
2018 ◽  
Vol 8 (18) ◽  
pp. 9933-9940
Author(s):  
Kiho Kim ◽  
Jinseong Lee ◽  
Seokgyu Ryu ◽  
Jooheon Kim
Keyword(s):  
Surface Modification ◽  
Boron Nitride ◽  
Polymer Matrix ◽  
Electroless Plating ◽  
Coupling Agent ◽  
Silane Coupling Agent ◽  
Particle Surface ◽  
Engineering Plastic ◽  
Silane Coupling ◽  
Surface Modified

Boron nitride (BN) and laser activate particles (LAPs) which used for electroless plating were surface-modifiedviabase treatment and by using a silane coupling agent in order to confer functionality and enhance the interfacial affinity of these particles for a polymer matrix.

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