Proposal of a Modified Four-Point Bending Method for Determining Interfacial Fracture Energy at Electrode/Electrolyte Interfaces in SOFCs

2019 ◽  
Vol 91 (1) ◽  
pp. 825-835
Author(s):  
Keigo Kumada ◽  
Kazuhisa Sato ◽  
Yuki Asoh ◽  
Toshiyuki Hashida
1993 ◽  
Vol 318 ◽  
Author(s):  
Hsin-Fu Wang ◽  
William W. Gerberich ◽  
Jim E. Angelo ◽  
Mike J. Mills

ABSTRACTThe fracture energy of Ti/Al203 composite interfaces has been determined by four point bending tests of sandwich specimens for different thicknesses of metal interlayers at 900°C. The interfacial fracture was found to be brittle. An intermetallic reaction product (Ti3Al) was produced at the interface after the diffusion bonding process. When the metal interlayer is thicker, there is more plastic energy dissipation in the metal during the fracture process. Therefore, the interfacial fracture energy increases. This can be seen from the fact that there is a larger plastic zone size with increasing thickness of the metal interlayer. The measured interfacial fracture energy Ti/Al203 ranges from 9.6 J/m2to 45.1 J/m2. The intrinsic interfacial fracture energy is obtained to be 0.26 J/m2. The embrittlement of the interface after the diffusion bonding process causes this value to be smaller than work of adhesion for Ti/Al203 (2.0 J/m2).


1995 ◽  
Vol 10 (9) ◽  
pp. 2367-2373 ◽  
Author(s):  
Hsin-Fu Wang ◽  
William W. Gerberich ◽  
Jim E. Angelo

The interfacial fracture energy of Ti/Al2O3 composites was measured with and without a diffusion barrier at different bonding temperatures by using four-point bending tests. It was found that the interfacial fracture energy increases with increasing bonding temperature up to 950 °C. When the bonding temperature was further raised to 1000 °C, the interfacial fracture energy drops. The decrease of the interfacial fracture energy is due to the formation of the continuous intermetallic compound, Ti3Al, at the interface between Ti and Al2O3. By using a diffusion barrier, the interfacial fracture energy decreases from 25.4 to near O J/m2 and 32.9 to 8.7 J/m2 for applied bonding temperatures of 800 and 900 °C, respectively. This is because the diffusion barrier reduced the diffusion of Al across the interface and into the Ti, thereby preventing a strong chemical bond at the interface. For the composite bonded at 900 °C, the crack propagation was found to occur at the interface between the Ti and Al2O3. The interfacial failure was found to be in the Ti3Al reaction layer for the composite processed at 1000 °C. With a diffusion barrier, the crack propagation path follows several interfaces. Evaluation of the processing temperature on the mechanical properties of the Ti was also obtained by using a nanoindentation technique.


2001 ◽  
Vol 682 ◽  
Author(s):  
J.Y. Song ◽  
Jin Yu

ABSTRACTThe interfacial fracture energies of flexible Cu/Cr/Polyimide system were deduced from the T peel test. The T peel strength and peel angle were strongly affected by the metal thickness and the biased rf plasma power density of the polyimide pretreatment. The plastic bending works of metal and polyimide dissipated during peel test were estimated from the direct measurement of maximum root curvatures using the elastoplastic beam analysis. The interfacial fracture energy between Cr and polyimide increased with the rf plasma power density and saturated, but was pretty much independent of the metal film thickness and the peel angle.


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