Estimation of the Interfacial Fracture Energy of Metal/Polymer System in Microelectronic Packaging
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ABSTRACTThe interfacial fracture energies of flexible Cu/Cr/Polyimide system were deduced from the T peel test. The T peel strength and peel angle were strongly affected by the metal thickness and the biased rf plasma power density of the polyimide pretreatment. The plastic bending works of metal and polyimide dissipated during peel test were estimated from the direct measurement of maximum root curvatures using the elastoplastic beam analysis. The interfacial fracture energy between Cr and polyimide increased with the rf plasma power density and saturated, but was pretty much independent of the metal film thickness and the peel angle.
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