Effects of Annealing Conditions on the Crystallization and Grain Growth of Metastable Ge2Sb2Te5

2005 ◽  
Vol 44 (1A) ◽  
pp. 326-327 ◽  
Author(s):  
Yu Jin Park ◽  
Jeong Yong Lee ◽  
Min Soo Youm ◽  
Yong Tae Kim
Keyword(s):  
Grain Growth ◽  
Annealing Conditions

Effect of annealing conditions on grain growth in the complex Ti1?xNbxC0.5N0.5 solid solutions

1982 ◽  
Vol 21 (5) ◽  
pp. 398-401 ◽  
Author(s):  
S. S. Ordan'yan ◽  
L. G. Maskhuliya ◽  
I. B. Panteleev
Keyword(s):  
Grain Growth ◽  
Solid Solutions ◽  
Annealing Conditions

Study of Micro-Texture during Recovery and Recrystallisation in Folded BCC and FCC Sheet Samples

2011 ◽  
Vol 702-703 ◽  
pp. 667-670 ◽  
Author(s):  
Harvinder Singh Ubhi ◽  
Hui Jiang
Keyword(s):  
Nickel Alloy ◽  
Grain Growth ◽  
Nickel Alloys ◽  
Ferritic Steel ◽  
Ferritic Alloy ◽  
Folding Process ◽  
Fibre Texture ◽  
Annealing Conditions ◽  
Ebsd Technique ◽  
Insight Into

The sheet folding process generates both tensile and compressive strains across the folded section, producing systematic strain and texture gradients. In this investigation the EBSD technique has been used to gain insight into this phenomenon in folded ferritic steel and nickel alloys, both in the as folded and after annealing conditions. As expected in the fcc material the {111} and {110} fibre texture components get reinforced in the tensile and compressive regions respectively, while the {110} and {111} components are reinforced in the bcc material during folding. After annealing at 600oC for 40 minutes the texture components formed during the folding process are retained despite the formation of new strain free grains. The new grains were found to be slightly larger in the tensile regions than in the compressed regions this was the case for both materials. However, in the mid-region of the section in the nickel alloy abnormal grain growth took place, while only recovery was observed in the ferritic alloy.

Recrystallization and Precipitation of β-Mg17Al12 Phase of the Cold-Rolled Mg-9Al-1Zn Alloy Strip during Isothermal Annealing

2014 ◽  
Vol 789 ◽  
pp. 336-343 ◽  
Author(s):  
Yan Bin Jiang ◽  
Zhi Hao Zhang ◽  
Lei Guan ◽  
Guo Yi Tang
Keyword(s):  
Grain Growth ◽  
Annealing Temperature ◽  
Isothermal Annealing ◽  
Competitive Behavior ◽  
Alloy Strip ◽  
High Deformation ◽  
Annealing Conditions ◽  
Mg17al12 Phase ◽  
Cold Rolled ◽  
Deformation Area

Effect of isothermal annealing on the microstructure evolution of the cold-rolled Mg-9Al-1Zn alloy strip was investigated. It is found that the competition between the precipitation of β-Mg17Al12 phase and recrystallization of α-Mg matrix occur under the conditions of various annealing temperature and time. At a low annealing temperature (523K), the β-Mg17Al12 particles precipitate preferentially at locally high deformation area and grow into the lamellar-cluster with an increase in the annealing time, retarding the recrystallization of α-Mg matrix. With raising the annealing temperature (573~623K), both the precipitation of β-Mg17Al12 particles and recrystallization of α-Mg matrix take place. Both recrystallization and grain growth are prone to proceed without precipitation of β-Mg17Al12 particles when the annealing temperature is 673K. A mechanism for the competitive behavior between the precipitation of β-Mg17Al12 phase and recrystallization of α-Mg matrix at various annealing conditions is discussed.

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

2003 ◽  
Vol 766 ◽  
Author(s):  
G. Steinlesberger ◽  
M. Engelhardt ◽  
G. Schindler ◽  
W. Steinhögl ◽  
M. Traving ◽  
...  
Keyword(s):  
Grain Size ◽  
Electrical Resistivity ◽  
Size Effect ◽  
Grain Boundaries ◽  
Grain Growth ◽  
Growth Process ◽  
Microstructural Change ◽  
Thermal Treatments ◽  
Annealing Conditions ◽  
Damascene Interconnects

AbstractThe influence of different annealing conditions on the electrical resistivity of copper damascene interconnects with lateral dimensions down to sub-50 nm was studied. Different thermal treatments after copper plating as well as annealing processes in addition to the final anneal step were carried out in order to study the microstructural change of copper damascene lines. It was found that rapid thermal annealing (RTA) at high temperatures (600°C) leads to an enlargement of the Cu grains by a factor of 2 for wide lines, whereas a significant impact of annealing on the median grain size of ultrafine lines was not observed. This is attributed to the geometrical limitation of the grain growth process. As a result, the size effect in Cu nano-interconnects which is mainly determined by grain boundaries acting as scattering sites for electrons cannot be reduced significantly by using thermal treatments.

Effect of Annealing Conditions on the Grain Size of Nanocrystalline Copper Thin Films

2008 ◽  
Vol 587-588 ◽  
pp. 483-487 ◽  
Author(s):  
Sonia Simões ◽  
Rosa Calinas ◽  
P.J. Ferreira ◽  
M. Teresa Vieira ◽  
Filomena Viana ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Grain Size ◽  
Grain Growth ◽  
Copper Substrate ◽  
Nanocrystalline Metals ◽  
Nanocrystalline Copper ◽  
Annealing Conditions ◽  
Transmission Electron ◽  
Average Grain Size

Nanocrystalline metals demonstrate a broad range of fascinating mechanical properties at the nanoscale, namely a significant increase in hardness and superior yield stress. In this regard, understanding grain growth in nanocrystalline metals is crucial, particularly because nano size grains are characterized by a high curvature, which results in a high driving force for grain growth. In this work, the effect of annealing conditions on grain size of copper nanocrystalline thin films was investigated. The nanocrystalline copper thin films were first deposited by d.c. magnetron sputtering on a copper substrate. The specimens were then annealed in vacuum at 100, 300 and 500°C from 10 minutes to 5 hours. Transmission electron microscopy observations revealed that the as-deposited thin films have a bimodal grain size distribution; an average grain size of 43±2nm and the presence of nanotwins. Abnormal grain growth was observed for some samples annealed. Increasing the annealing time induced significant grain growth and promoted twin formation in the larger grains. Finally, the hardness of these nanocrystalline Cu thin films was determined using atomic force microscope. The relation between mechanical properties, annealing conditions and grain size was analyzed.

KINETICS OF GRAIN NUCLEATION IN SUPERCOOLED QUASI-TWO-DIMENSIONAL Cu

2013 ◽  
Vol 27 (12) ◽  
pp. 1350082 ◽  
Author(s):  
YONGSOO CHOI
Keyword(s):  
Grain Growth ◽  
Isothermal Annealing ◽  
Growth Exponent ◽  
Dimensional System ◽  
Two Dimensional ◽  
Nucleation Kinetics ◽  
Annealing Conditions ◽  
Nucleation Model ◽  
Grain Growth Model ◽  
Kinetics Of

Grain nucleation kinetics of nanocrystalline Cu in a quasi-two-dimensional system was investigated using molecular dynamics. Nanoscale grains nucleate rapidly from supercooled Cu under isothermal annealing conditions. An Avrami exponent from the JMAK equation implies that the kinetics follows the continuous nucleation model. Observation of grain growth during the nucleation stage shows that the kinetics follows the classical grain growth model with a low growth exponent. The lower value of the exponent illustrates the rapid growth of grains during this stage. Using the growth exponent, the activation energy for nucleation in Cu was obtained and compared with the values obtained in earlier studies.

Grain Refinement in Titanium-Erbium Alloys

1974 ◽  
Vol 32 ◽  
pp. 522-523
Author(s):  
B. B. Rath ◽  
J. E. O'Neal ◽  
R. J. Lederich
Keyword(s):  
Electron Microscopy ◽  
Size Distribution ◽  
Grain Refinement ◽  
Grain Growth ◽  
Volume Fraction ◽  
Pure Titanium ◽  
Systematic Investigation ◽  
Second Phase ◽  
Titanium Matrix ◽  
Average Size

Addition of small amounts of erbium has a profound effect on recrystallization and grain growth in titanium. Erbium, because of its negligible solubility in titanium, precipitates in the titanium matrix as a finely dispersed second phase. The presence of this phase, depending on its average size, distribution, and volume fraction in titanium, strongly inhibits the migration of grain boundaries during recrystallization and grain growth, and thus produces ultimate grains of sub-micrometer dimensions. A systematic investigation has been conducted to study the isothermal grain growth in electrolytically pure titanium and titanium-erbium alloys (Er concentration ranging from 0-0.3 at.%) over the temperature range of 450 to 850°C by electron microscopy.

Microstructural characterization of a rapidly solidified Al-Fe-V-Si alloy for elevated temperature applications

1988 ◽  
Vol 46 ◽  
pp. 550-551
Author(s):  
R. E. Franck ◽  
J. A. Hawk ◽  
G. J. Shiflet
Keyword(s):  
High Temperature ◽  
Elevated Temperature ◽  
Grain Growth ◽  
Volume Fraction ◽  
Microstructural Characterization ◽  
Second Phase ◽  
Microstructural Stability ◽  
Elevated Temperature Strength ◽  
Temperature Applications

Rapid solidification processing (RSP) is one method of producing high strength aluminum alloys for elevated temperature applications. Allied-Signal, Inc. has produced an Al-12.4 Fe-1.2 V-2.3 Si (composition in wt pct) alloy which possesses good microstructural stability up to 425°C. This alloy contains a high volume fraction (37 v/o) of fine nearly spherical, α-Al12(Fe, V)3Si dispersoids. The improved elevated temperature strength and stability of this alloy is due to the slower dispersoid coarsening rate of the silicide particles. Additionally, the high v/o of second phase particles should inhibit recrystallization and grain growth, and thus reduce any loss in strength due to long term, high temperature annealing.The focus of this research is to investigate microstructural changes induced by long term, high temperature static annealing heat-treatments. Annealing treatments for up to 1000 hours were carried out on this alloy at 500°C, 550°C and 600°C. Particle coarsening and/or recrystallization and grain growth would be accelerated in these temperature regimes.

Effect of annealing conditions on structural transformation of ZnS thin film

2006 ◽  
Vol 2006 (suppl_23_2006) ◽  
pp. 287-292 ◽  
Author(s):  
T. Kryshtab ◽  
J. Palacios-Gómez ◽  
M. Mazin
Keyword(s):  
Thin Film ◽  
Structural Transformation ◽  
Annealing Conditions
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