Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

2003 ◽  
Vol 766 ◽  
Author(s):  
G. Steinlesberger ◽  
M. Engelhardt ◽  
G. Schindler ◽  
W. Steinhögl ◽  
M. Traving ◽  
...  
Keyword(s):  
Grain Size ◽  
Electrical Resistivity ◽  
Size Effect ◽  
Grain Boundaries ◽  
Grain Growth ◽  
Growth Process ◽  
Microstructural Change ◽  
Thermal Treatments ◽  
Annealing Conditions ◽  
Damascene Interconnects

AbstractThe influence of different annealing conditions on the electrical resistivity of copper damascene interconnects with lateral dimensions down to sub-50 nm was studied. Different thermal treatments after copper plating as well as annealing processes in addition to the final anneal step were carried out in order to study the microstructural change of copper damascene lines. It was found that rapid thermal annealing (RTA) at high temperatures (600°C) leads to an enlargement of the Cu grains by a factor of 2 for wide lines, whereas a significant impact of annealing on the median grain size of ultrafine lines was not observed. This is attributed to the geometrical limitation of the grain growth process. As a result, the size effect in Cu nano-interconnects which is mainly determined by grain boundaries acting as scattering sites for electrons cannot be reduced significantly by using thermal treatments.

scholarly journals Dome Concordia ice microstructure: impurities effect on grain growth

2002 ◽  
Vol 35 ◽  
pp. 552-558 ◽  
Author(s):  
Jérôme Weiss ◽  
Jérôme Vidot ◽  
Michel Gay ◽  
Laurent Arnaud ◽  
Paul Duval ◽  
...  
Keyword(s):  
Grain Size ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Grain Growth ◽  
Growth Process ◽  
Boundary Energy ◽  
Ice Core ◽  
Dust Particles ◽  
The Holocene ◽  
Average Grain Size

AbstractWe present a detailed analysis of the microstructure in the shallow part (100–580m) of the European Project for Ice Coring in Antarctica (EPICA) ice core at Dome Concordia. In the Holocene ice, the average grain-size increases with depth. This is the normal grain-growth process driven by a reduction of the total grain-boundary energy. Deeper, associated with the Holocene–Last Glacial Maximum (LGM) climatic transition, a sharp decrease of the average grain-size is observed. to explain modifications to the microstructure with climatic change, we discuss the role of soluble and insoluble (microparticles) impurities in the grain-growth process of Antarctic ice, coupled with an analysis of the pinning of grain boundaries by microparticles. Our data indicate that high soluble impurity content does not necessarily imply a slowing-down of grain-growth kinetics, whereas the pinning of grain boundaries by dust particles located along the boundaries does explain modifications to the microstructure (small grain-sizes; change in grain-size distributions, etc.) observed in volcanic ash layers or dusty LGM ice.Moreover, classical mean-field models of grain-boundary pinning are in good quantitative agreement with the evolution of grain-size along the EPICA ice core. This suggests a major role for dust in the modification of shallow polar ice microstructure.

Superplasticity and Microstructural Evolution of a Large-Grained Mg Alloy

2000 ◽  
Author(s):  
Yi Liu ◽  
Kelly Shue ◽  
Xin Wu ◽  
Zhicheng Li ◽  
Yongbo Xu
Keyword(s):  
Grain Size ◽  
Electron Microscope ◽  
Strain Rate ◽  
Grain Boundaries ◽  
Grain Growth ◽  
Large Angle ◽  
Dislocation Creep ◽  
Rate Dependent ◽  
Average Grain Size ◽  
Elongation To Failure

Abstract Commercial Mg-3Al-Zn alloys (AZ31) with initial large grains (∼250μm) has been found superplastic at a strain rate of 0.5×10−2s−1 and at 350–500 C. The maximum elongation to failure of 170% at 500°C was obtained. Scanning electron microscope observations with electron back-scattering diffraction technique (SEM-EBSD) indicate that during deformation significant grain size reduction occurred, the average grain size reduced from about 250μm before deformation to about 50μm after deformation at temperatures from 300 C to 400°C, it reduced to about 100μm if deformed at above 400°C. The observed grain refinement at lower temperature and grain growth at higher temperature during the superplastic deformation is believed to be the result of the competing processes between dynamic recrystallization and dynamic grain growth, which are temperature and strain rate dependent. Transmission electron microscope (TEM) observations indicates that most of the grain boundaries are large-angle grain boundaries, though small amount of small-angle grain boundaries are also observed. The density of dislocations in the grains is very low in these superplasticlly deformed samples. It is evident that grain boundary played a role as the source and sink of the dislocation, being responsible for combined dislocation creep and diffusional creel. Therefore, the very large elongation obtained at the very high strain rates and high temperatures is attributed to dynamic dislocation hardening, recovery and recrystallization.

scholarly journals A brief overview on grain growth of bulk electrodeposited nanocrystalline nickel and nickel-iron alloys

2019 ◽  
Vol 58 (1) ◽  
pp. 98-106
Author(s):  
Haitao Ni ◽  
Jiang Zhu ◽  
Zhaodong Wang ◽  
Haiyang Lv ◽  
Yongyao Su ◽  
...  
Keyword(s):  
Grain Size ◽  
Grain Boundary ◽  
Grain Growth ◽  
Growth Process ◽  
Boundary Migration ◽  
Thermal Conditions ◽  
Iron Alloys ◽  
Nanocrystalline Nickel ◽  
Nickel Iron ◽  
Average Grain Size

Abstract This review focuses on grain growth behaviors and the underlying mechanisms of bulk electrodeposited nanocrystalline nickel and nickel-iron alloys. Effects of some important factors on grain growth are described. During thermal-induced grain growth process, grain boundary migration plays a key role. For similar thermal conditions, due to grain boundary mobility with solute drag, limited grain growth occurs in nanocrystalline alloys, as compared to pure metals. Nonetheless, in the case of stress-induced grain growth process, there are a variety of mechanisms in samples having various deformation histories. As an example the grain growth of nanocrystalline nickel and Ni-20%Fe alloy with nearly the same grain-size distribution and average grain size is compared in this paper. Thermal analysis indicates nanocrystalline nickel is much more prone to rapid grain growth than nanocrystalline Ni-20%Fe alloy. Nevertheless, grain growth of nanocrystalline Ni-20%Fe is found to be more pronounced than nanocrystalline nickel during rolling deformation.

scholarly journals EBSD characterization of the effect of welding parameters on HAZ of AISI409

2012 ◽  
Vol 48 (1) ◽  
pp. 115-121 ◽  
Author(s):  
E. Ranjbarnodeha ◽  
S. Weissb ◽  
S. Hankeb ◽  
A. Fischerb
Keyword(s):  
Grain Size ◽  
Grain Boundaries ◽  
Grain Growth ◽  
Welding Parameters ◽  
Final State ◽  
Ferritic Stainless Steels ◽  
Stress Relieving ◽  
Complete Recrystallization ◽  
Local Misorientation

One of the main problems during the welding of ferritic stainless steels is severe grain growth in the heat affected zone (HAZ). In the present study, microstructural characteristics of tungsten inert gas (TIG) welded AISI409 ferritic stainless steel were investigated. The effect of the welding parameters on grain size? local misorientation and low angle grain boundaries was studied. It was found that the base metal was partly in recrystallization state. Complete recrystallization followed by severe grain growth occurs after joining process due to welding heating cycle. A decrease in the number of low angle grain boundaries in HAZ was observed. Nevertheless, the welding plastic strain increases the density of local misorientation and low angle grain boundaries. This investigation shows that the final state of strain is the result of the competition between welding plastic strains and stress relieving from recrystallization but the decisive factor in determining the grain size in HAZ is heat input.

Properties of Copper-Based Composite Reinforced with Al2O3 Particles of Different Size

2014 ◽  
Vol 875-877 ◽  
pp. 318-323
Author(s):  
Viseslava Rajkovic ◽  
Dusan Bozic ◽  
Jelena Stasic ◽  
Milan T. Jovanovic ◽  
Huai Wen Wang
Keyword(s):  
Grain Size ◽  
Grain Boundaries ◽  
Grain Growth ◽  
Synergetic Effect ◽  
Copper Matrix ◽  
High Energy ◽  
Inert Gas ◽  
Al2o3 Powder ◽  
Al Powder ◽  
Al2o3 Particles

Copper matrix was simultaneously reinforced with nano- and micro-sized Al2O3 particles via high-energy milling of the mixture of inert gas-atomized prealloyed Cu-1 wt.% Al powder and 0.6 wt.% commercial Al2O3 powder. At the maximum of microhardness (2400 MPa) the grain size reaches the smallest value as a result of the synergetic effect of nano- and micro-sized Al2O3 particles. The relatively low decrease in microhardness during HTE may be explained by grain growth which is retarded by Al2O3 nano-sized particles precipitated at the grain boundaries.

Atomic structural variations of [0001]-tilt grain boundaries during ZnO grain growth occurred by thermal treatments

2011 ◽  
Vol 257 (11) ◽  
pp. 4817-4820 ◽  
Author(s):  
J.M. Yuk ◽  
J.Y. Lee ◽  
Zonghoon Lee ◽  
Y.S. No ◽  
T.W. Kim ◽  
...  
Keyword(s):  
Grain Boundaries ◽  
Grain Growth ◽  
Thermal Treatments ◽  
Structural Variations

Abnormal Grain Growth in Electrochemically Deposited Cu Films

2004 ◽  
Vol 467-470 ◽  
pp. 1339-1344 ◽  
Author(s):  
Matthias Militzer ◽  
P. Freundlich ◽  
D. Bizzotto
Keyword(s):  
Grain Size ◽  
Grain Boundaries ◽  
Grain Growth ◽  
Experimental Studies ◽  
Abnormal Grain Growth ◽  
Grain Structure ◽  
Additive Concentration ◽  
Organic Additives ◽  
Plating Bath ◽  
Cu Films

Cu interconnects are essential in advanced integrated circuits to minimize the RC delay. In manufacturing these devices, Cu is deposited electrochemically using a plating bath containing organic additives. The as-deposited nanocrystalline Cu films undergo self-annealing at room temperature to form a micronsized grain structure by abnormal grain growth. Systematic experimental studies of self-annealing kinetics on model Cu films deposited on a Au substrate suggest that the rate of grain size evolution depends primarily on the initial grain size of the asdeposited film. A model for the observed abnormal grain growth process is proposed. Assuming that desorption of the organic additives leads to mobile grain boundaries, the onset of abnormal grain growth is attributed to a sufficiently low additive concentration such that a full coverage of all grain boundaries cannot be maintained. The incubation time of abnormal growth is then a logarithmic function of the initial grain size. The probability to find a growing grain is proportional to the number of grains per unit volume. This assumption is seen to be in good agreement with the experimental observations for subsequent abnormal grain growth rates. The limitations of the proposed model and the challenges to obtain further insight into the complex microstructure mechanisms during self-annealing are delineated.

Grain size effect on electrical resistivity of bulk nanograined Bi 2 Te 3 material

2015 ◽  
Vol 99 ◽  
pp. 175-179 ◽  
Author(s):  
Oleg Ivanov ◽  
Oxana Maradudina ◽  
Roman Lyubushkin
Keyword(s):  
Grain Size ◽  
Electrical Resistivity ◽  
Size Effect ◽  
Grain Size Effect
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