Effect of annealing conditions on grain growth in the complex Ti1?xNbxC0.5N0.5 solid solutions

1982 ◽  
Vol 21 (5) ◽  
pp. 398-401 ◽  
Author(s):  
S. S. Ordan'yan ◽  
L. G. Maskhuliya ◽  
I. B. Panteleev
Keyword(s):  
Grain Growth ◽  
Solid Solutions ◽  
Annealing Conditions

scholarly journals Grain growth in Na0.5Bi0.5TiO3-based solid solutions

2019 ◽  
Vol 196 (1) ◽  
pp. 112-119
Author(s):  
L. Eglite ◽  
M. Antonova ◽  
E. Birks ◽  
M. Knite ◽  
M. Livinsh
Keyword(s):  
Grain Growth ◽  
Solid Solutions

Study of Micro-Texture during Recovery and Recrystallisation in Folded BCC and FCC Sheet Samples

2011 ◽  
Vol 702-703 ◽  
pp. 667-670 ◽  
Author(s):  
Harvinder Singh Ubhi ◽  
Hui Jiang
Keyword(s):  
Nickel Alloy ◽  
Grain Growth ◽  
Nickel Alloys ◽  
Ferritic Steel ◽  
Ferritic Alloy ◽  
Folding Process ◽  
Fibre Texture ◽  
Annealing Conditions ◽  
Ebsd Technique ◽  
Insight Into

The sheet folding process generates both tensile and compressive strains across the folded section, producing systematic strain and texture gradients. In this investigation the EBSD technique has been used to gain insight into this phenomenon in folded ferritic steel and nickel alloys, both in the as folded and after annealing conditions. As expected in the fcc material the {111} and {110} fibre texture components get reinforced in the tensile and compressive regions respectively, while the {110} and {111} components are reinforced in the bcc material during folding. After annealing at 600oC for 40 minutes the texture components formed during the folding process are retained despite the formation of new strain free grains. The new grains were found to be slightly larger in the tensile regions than in the compressed regions this was the case for both materials. However, in the mid-region of the section in the nickel alloy abnormal grain growth took place, while only recovery was observed in the ferritic alloy.

Recrystallization and Precipitation of β-Mg17Al12 Phase of the Cold-Rolled Mg-9Al-1Zn Alloy Strip during Isothermal Annealing

2014 ◽  
Vol 789 ◽  
pp. 336-343 ◽  
Author(s):  
Yan Bin Jiang ◽  
Zhi Hao Zhang ◽  
Lei Guan ◽  
Guo Yi Tang
Keyword(s):  
Grain Growth ◽  
Annealing Temperature ◽  
Isothermal Annealing ◽  
Competitive Behavior ◽  
Alloy Strip ◽  
High Deformation ◽  
Annealing Conditions ◽  
Mg17al12 Phase ◽  
Cold Rolled ◽  
Deformation Area

Effect of isothermal annealing on the microstructure evolution of the cold-rolled Mg-9Al-1Zn alloy strip was investigated. It is found that the competition between the precipitation of β-Mg17Al12 phase and recrystallization of α-Mg matrix occur under the conditions of various annealing temperature and time. At a low annealing temperature (523K), the β-Mg17Al12 particles precipitate preferentially at locally high deformation area and grow into the lamellar-cluster with an increase in the annealing time, retarding the recrystallization of α-Mg matrix. With raising the annealing temperature (573~623K), both the precipitation of β-Mg17Al12 particles and recrystallization of α-Mg matrix take place. Both recrystallization and grain growth are prone to proceed without precipitation of β-Mg17Al12 particles when the annealing temperature is 673K. A mechanism for the competitive behavior between the precipitation of β-Mg17Al12 phase and recrystallization of α-Mg matrix at various annealing conditions is discussed.

Nucleation and Grain Growth Kinetics of Amorphous to Nanocrystalline Ceria Solid Solutions

2007 ◽  
Vol 558-559 ◽  
pp. 1339-1344 ◽  
Author(s):  
Jennifer L.M. Rupp ◽  
Barbara Scherrer ◽  
Ludwig J. Gauckler
Keyword(s):  
Thin Films ◽  
Grain Growth ◽  
Solid Solutions ◽  
Growth Kinetics ◽  
Scanning Calorimetry ◽  
Heating Chamber ◽  
Nanocrystalline Ceria ◽  
Average Grain Size ◽  
Grain Growth Kinetics ◽  
Kinetics Of

Nanocrystalline ceria-based thin films are of potential interest for use as gas-sensing layers and electrolytes in micro-Solid Oxide Fuel Cells (micro-SOFC) used for energy supply of next generation portables. In these devices the thin films have to be operated at intermediate to high temperatures (500 - 1000 °C) to be sufficiently high electrical conductive. However, only little is known on the nucleation and grain growth kinetics of pure ceria and its solid solutions when present as nanocrystalline thin film microstructures (average grain size < 100 nm). In this study amorphous, dense and crack-free CeO2 and Ce0.8Gd0.2O1.9-x thin films have been deposited by spray pyrolysis on sapphire. These films were crystallized to biphasic amorphous-nanocrystalline and fully nanocrystalline microstructures upon annealing with respect to time, temperature, heating rate and doping. Nucleation and grain growth kinetics were studied by differential scanning calorimetry, Xray diffraction analysis with in-situ heating chamber and scanning electron microscopy.

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

2003 ◽  
Vol 766 ◽  
Author(s):  
G. Steinlesberger ◽  
M. Engelhardt ◽  
G. Schindler ◽  
W. Steinhögl ◽  
M. Traving ◽  
...  
Keyword(s):  
Grain Size ◽  
Electrical Resistivity ◽  
Size Effect ◽  
Grain Boundaries ◽  
Grain Growth ◽  
Growth Process ◽  
Microstructural Change ◽  
Thermal Treatments ◽  
Annealing Conditions ◽  
Damascene Interconnects

AbstractThe influence of different annealing conditions on the electrical resistivity of copper damascene interconnects with lateral dimensions down to sub-50 nm was studied. Different thermal treatments after copper plating as well as annealing processes in addition to the final anneal step were carried out in order to study the microstructural change of copper damascene lines. It was found that rapid thermal annealing (RTA) at high temperatures (600°C) leads to an enlargement of the Cu grains by a factor of 2 for wide lines, whereas a significant impact of annealing on the median grain size of ultrafine lines was not observed. This is attributed to the geometrical limitation of the grain growth process. As a result, the size effect in Cu nano-interconnects which is mainly determined by grain boundaries acting as scattering sites for electrons cannot be reduced significantly by using thermal treatments.

Effects of Annealing Conditions on the Crystallization and Grain Growth of Metastable Ge2Sb2Te5

2005 ◽  
Vol 44 (1A) ◽  
pp. 326-327 ◽  
Author(s):  
Yu Jin Park ◽  
Jeong Yong Lee ◽  
Min Soo Youm ◽  
Yong Tae Kim
Keyword(s):  
Grain Growth ◽  
Annealing Conditions
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