Color-Imaging Ellipsometer: High-Speed Characterization of In-Plane Distribution of Film Thickness at Nano-Scale

2001 ◽  
Vol 40 (Part 1, No. 2A) ◽  
pp. 877-880 ◽  
Author(s):  
Daisuke Tanooka ◽  
Eiki Adachi ◽  
Kuniaki Nagayama
Keyword(s):  
Film Thickness ◽  
High Speed ◽  
Color Imaging ◽  
Nano Scale ◽  
Plane Distribution

Fabrication and characterization of novel high-speed InGaAs/InP uni-traveling-carrier photodetector for high responsivity

2015 ◽  
Vol 24 (10) ◽  
pp. 108506
Author(s):  
Qing-Tao Chen ◽  
Yong-Qing Huang ◽  
Jia-Rui Fei ◽  
Xiao-Feng Duan ◽  
Kai Liu ◽  
...  
Keyword(s):  
High Speed ◽  
High Responsivity ◽  
Fabrication And Characterization

Cryogenic Characterization of Nano-scale Bulk FinFETs

2020 ◽  
Author(s):  
Lin-Jie Fan ◽  
Jin-Shun Bi ◽  
Xue Fan ◽  
Gao-Bo Xu ◽  
Yan-Nan Xu ◽  
...  
Keyword(s):  
Nano Scale

scholarly journals Nano-scale actin-network characterization of fibroblast cells lacking functional Arp2/3 complex

2017 ◽  
Vol 197 (3) ◽  
pp. 312-321 ◽  
Author(s):  
Karen L. Anderson ◽  
Christopher Page ◽  
Mark F. Swift ◽  
Praveen Suraneni ◽  
Mandy E.W. Janssen ◽  
...  
Keyword(s):  
Fibroblast Cells ◽  
Actin Network ◽  
Nano Scale ◽  
Network Characterization

Characterization and Control of Copper CMP with Optoacoustic Metrology

2001 ◽  
Vol 671 ◽  
Author(s):  
Michael Gostein ◽  
Paul Lefevre ◽  
Alex A. Maznev ◽  
Michael Joffe
Keyword(s):  
Film Thickness ◽  
Spatial Resolution ◽  
Chemical Mechanical Polishing ◽  
High Spatial Resolution ◽  
Mechanical Polishing ◽  
Length Measurement ◽  
And Control ◽  
Non Destructive

ABSTRACTWe discuss applications of optoacoustic film thickness metrology for characterization of copper chemical-mechanical polishing (CMP). We highlight areas where the use of optoacoustics for CMP characterization provides data complementary to that obtained by other techniques because of its ability to directly measure film thickness with high spatial resolution in a rapid, non-destructive manner. Examples considered include determination of planarization length, measurement of film thickness at intermediate stages of polish, and measurement of arrays of metal lines.

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