Equilibrium decomposition pressures of the compounds Cs2ZrCl6 and Cs2HfCl6 and X-ray identification of Na2HfCl6, K2HfCl6, and Cs2HfCl6

1983 ◽  
Vol 61 (9) ◽  
pp. 2183-2188 ◽  
Author(s):  
G. J. Kipouros ◽  
S. N. Flengas

The chemical equilibria representing the reactions[Formula: see text]and[Formula: see text]were investigated by direct vapour pressure measurements and thermodynamic data such as free energies and enthalpies of reaction have been calculated. The X-ray powder patterns of the compounds Na2HfCl6, K2HfCl6, and Cs2HfCl6 are also reported.With reference to the separation of Hf from Zr by a recently developed process based on the selective reactivity of ZrCl4 and HfCl4 vapours with alkali chlorides, it is shown that the efficiency of alkali chlorides as separating agents increases in the order CsCl → LiCl → NaCl → KCl.

1981 ◽  
Vol 59 (6) ◽  
pp. 990-995 ◽  
Author(s):  
G. J. Kipouros ◽  
S. N. Flengas

The chemical equilibria representing the reactions[Formula: see text]and[Formula: see text]were investigated by direct vapour pressure measurements and thermodynamic data such as free energies and enthalpies of reaction have been calculated.With reference to the separation of Hf from Zr by a recently developed process based on the selective reactivity of ZrCl4 and HfCl4, vapours with alkali chlorides, it is shown that the efficiency of alkali chlorides as separating agents increases in the order of LiCl → NaCl → KCl.


1978 ◽  
Vol 56 (11) ◽  
pp. 1549-1554 ◽  
Author(s):  
G. J. Kipouros ◽  
S. N. Flengas

The chemical equilibria representing the reactions[Formula: see text]and[Formula: see text]were investigated by direct vapour pressure measurements. The thermodynamic data for these reactions, such as free energies and enthalpies of reaction, have been calculated. With reference to the separation of Hf from Zr by a recently developed process based on the selective reactivity of ZrCI4 and HfCl4 vapours with alkali chlorides, it is shown that KCl is a better separating agent than LiCl.


1971 ◽  
Vol 24 (12) ◽  
pp. 2487 ◽  
Author(s):  
CW Childs ◽  
RF Platford

Isopiestic vapour pressure measurements have been made on the systems H2O-NaCl-Na2SO4 and H2O-NaCl-MgSO4 at 15� and 0�. Excess free energies of mixing the aqueous salts hare been calculated for various ionic strengths, and the results have been compared with those previously obtained at 25�. ��� Within experimental uncertainty the excess free energies of mixing of aqueous NaCl with aqueous Na2SO4 are the same at 0�, 15�, and 25�. However, the excess free energy of mixing aqueous NaCl with aqueous MgSO4 shows differences which may be just larger than experimental uncertainty over the same temperature range.


1977 ◽  
Vol 30 (6) ◽  
pp. 1241 ◽  
Author(s):  
PP Singh ◽  
BR Sharma ◽  
KS Sidhu

This paper deals with isothermal total vapour pressure measurements on methanol (B)+pyridine (A), methanol (B)+β-picoline (A), methanol (B)+N,N-dimethylformamide (A) over the whole range of composition at 303.15 K and the excess Gibbs free energies are evaluated. The data have been analysed in terms of a r-mer-r-mer model of interaction. The equilibrium constants for the various association reactions are evaluated and the enthalpy changes ΔH�l involved in the ABx and A2B molecular species of A and B have also been computed.


1997 ◽  
Vol 504 ◽  
Author(s):  
S. C. Choi ◽  
K. H. Kim ◽  
H-J. Jung ◽  
C. N. Whang ◽  
S. K. Koha

ABSTRACTPolyimide films are modified by ion assisted reaction method using various ion beams in various gases environments. Amount of ion and blown gases rate were changed from 5 × 1014 to 1 × 1017 and from 0 to 8 sccm, respectively. Wetting angles between water and polyimide films modified by Ar+ ion without oxygen blowing decrease from 67° to 400° and surface free energies increase from 46 to 64 dyne/cm2. Wetting angle of polyimide films modified by Ar+ ion in an oxygen environment decreases to 12° and surface free energy increases to 72 dyne/cm2. The lowest wetting angle was obtained by oxygen ion irradiation in the oxygen gas environment and its value was 7°. In the case of polyimide film modified by Ar+ ions in an oxygen environment, the wetting angle increases up to 65° when it kept in air and that increases up to 46° when it kept in water after 5 day. In the case of polyimide film modified by O2+ ion in oxygen environment, however, the wetting angle of polyimide film dose not increase. X-ray photoelectron analysis shows that the chemical bonds between polyimide components are severed by ion irradiation and hydrophilic groups such as CO and C=O are formed by the reaction between newly formed radicals and blown oxygen. It was found that adhesion between Cu and polyimide modified by ion assisted reaction was improved. The main reason of the enhanced adhesion is due to the reaction between Cu and C-O or C=O groups formed by ion assisted reaction on the polyimide surface.


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