Nanomechanical torque magnetometry of an individual aggregate of ∼350 nanoparticles

2015 ◽  
Vol 93 (11) ◽  
pp. 1252-1256 ◽  
Author(s):  
T. Firdous ◽  
D. Vick ◽  
M. Belov ◽  
F. Fani Sani ◽  
A. McDermott ◽  
...  
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Magnetic Hysteresis ◽  
High Stress ◽  
Magnetic Torque ◽  
Membrane Area ◽  
Torque Magnetometry ◽  
Resonant Modes ◽  
Micromagnetic Modeling ◽  
Supporting Membrane

The measurements of magnetic hysteresis for aggregates of nanoparticles deposited on a surface are reported. Magnetite nanoparticles derived from magnetotactic bacteria are studied using nanomechanical torque magnetometry. The nanoparticles are deposited on high-stress Si3N4 membranes, to allow inspection by electron microscopy, followed by focused ion-beam milling of torsional resonators precisely located to capture selected aggregates within the membrane area. Torque magnetometry is performed using the resonators. We investigate also the magnetic torque-driven AC resonant modes of the modified supporting membrane. The observations are compared to numerical simulations of the mechanical modes, and to micromagnetic modeling of the hysteresis of a specific measured cluster of ∼350 nanoparticles.

scholarly journals Nanoscale earthquake records preserved in plagioclase microfractures from the lower continental crust

Solid Earth ◽  
2021 ◽  
Vol 12 (4) ◽  
pp. 959-969
Author(s):  
Arianne J. Petley-Ragan ◽  
Oliver Plümper ◽  
Benoit Ildefonse ◽  
Bjørn Jamtveit
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
High Stress ◽  
Peak Stress ◽  
Wall Rock ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Stress Conditions ◽  
Plagioclase Feldspar ◽  
Fluid Infiltration

Abstract. Seismic faulting causes wall rock damage, which is driven by both mechanical and thermal stress. In the lower crust, co-seismic damage increases wall rock permeability, permits fluid infiltration and triggers metamorphic reactions that transform rock rheology. Wall rock microstructures reveal high-stress conditions near earthquake faults; however, there is limited documentation on the effects of a thermal pulse coupled with fluid infiltration. Here, we present a transmission electron microscopy study of co-seismic microfractures in plagioclase feldspar from lower crustal granulites from the Bergen Arcs, Western Norway. Focused ion beam foils are collected 1.25 mm and 1.8 cm from a 1.3 mm thick eclogite facies pseudotachylyte vein. Dislocation-free plagioclase and K-feldspar aggregates in the microfractures record a history of fluid introduction and recovery from a short-lived high-stress state caused by slip along the nearby fault. The feldspar aggregates retain the crystallographic orientation of their host and are elongated subparallel to the pseudotachylyte. We propose that plagioclase partially amorphized along the microfractures at peak stress conditions followed by repolymerization to form dislocation-free grain aggregates. Repolymerization and recrystallization were enhanced by the infiltration of fluids that transported Ca and K into the microfractures. Subsequent cooling led to exsolution of intermediate plagioclase compositions and the formation of the Bøggild–Huttenlocher intergrowth in the grains from the fracture closest to the pseudotachylyte. Our findings provide unequivocal evidence that the introduction of fluids in the microfractures occurred within the timescale of the thermal perturbation, prompting rapid annealing of damaged wall rock soon after earthquake rupture.

scholarly journals Nano-scale earthquake records preserved in plagioclase microfractures from the lower continental crust

2020 ◽  
Author(s):  
Arianne J. Petley-Ragan ◽  
Oliver Plumper ◽  
Benoit Ildefonse ◽  
Bjørn Jamtveit
Keyword(s):  
Focused Ion Beam ◽  
Slip Surface ◽  
Ion Beam ◽  
High Stress ◽  
Peak Stress ◽  
Wall Rock ◽  
Stress Conditions ◽  
Plagioclase Feldspar ◽  
Fault Surface ◽  
Lower Crustal

Abstract. Seismic faulting causes wall rock damage driven by both mechanical stress and thermal energy. In the lower crust, coseismic damage has important implications for wall rock permeability, the progress of subsequent fluid-driven metamorphic reactions, and rock rheology. Wall rock microstructures reveal high-stress conditions near the slip surface during lower crustal earthquakes, however, there is limited documentation on the thermal effect. Here, we present a transmission electron microscopy study of coseismic microfractures in plagioclase feldspar from lower crustal granulites from the Bergen Arcs, Western Norway. Focused ion beam foils are collected 1.25 mm and 1.8 cm from a 2 mm thick eclogite facies pseudotachylyte vein. Dislocation-free plagioclase aggregates fill the microfractures and record a history of recovery from a short-lived high stress-temperature (σ-T) state caused by seismic slip and frictional melting along the nearby fault surface. The plagioclase aggregates retain the crystallographic orientation of the host rock and shape preferred orientation relative to the fault slip surface. We propose that plagioclase partially amorphized along the microfractures at peak stress conditions followed by repolymerization to form dislocation-free grain aggregates within the timeframe of pseudotachylyte formation. The heat from the slip surface dissipated into the wall rock causing a short-lived temperature peak. Subsequent cooling led to exsolution of intermediate plagioclase compositions by spinodal decomposition within a few millimeters distance to the fault surface. Our findings provide microstructural evidence for the high σ-T conditions that are expected in the proximity of seismic faults, highlighting the importance of micro- and nanostructures for the understanding of earthquakes ruptures.

Thermal Cycling Study of Quilt Packaging

2015 ◽  
Vol 137 (2) ◽  
Author(s):  
M. Ashraf Khan ◽  
Quanling Zheng ◽  
David Kopp ◽  
Wayne Buckhanan ◽  
Jason M. Kulick ◽  
...  
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
High Stress ◽  
Ball Grid Arrays ◽  
Silicon Chips ◽  
Critical Stresses ◽  
Test Conditions ◽  
Large Numbers ◽  
Metallurgical Bonding ◽  
Quilt Packaging

The continued progress of micro-electronics often requires functionality that is spread across multiple chips. This need has led to the development of a variety of alternative chip-packaging technologies that offer increased speed and bandwidth, with lower losses, in an increasing number of interchip interconnects. One recent alternative is quilt packaging® (QP), which has already shown promise from a performance perspective. The geometry of QP is essentially lateral: large numbers of ultrawide-bandwidth interchip interconnects (superconnects) are made directly by nodules fabricated along the edges of adjacent chips. Metallurgical bonding of the nodules creates a system in the form of a “quilt” of separately manufactured chips. This new interconnect geometry is subject to stresses that are different from more conventional schemes. For example, the thermal stress that causes fatigue and lead to failure in ball grid arrays is essentially shear stress, whereas the most critical stresses in QP are tensile and compressive. This paper describes studies of fatigue failure in QP, with attention to critical high-stress regions previously identified by finite-element modeling. Nodules were fabricated on silicon chips, and both single and quilted chips were thermally cycled up to 1000 times over a range of − 55 °C to 125 °C. Scanning electron microscopy (SEM) was used to detect mechanical failure. Focused-ion-beam cross-sectioning was used to expose the critical interior interfaces of QP structures for SEM examination. QP superconnects were found to be robust under all the test conditions evaluated.

Nanocomposite Polyurethane Foams Via POSS Blends

2002 ◽  
Vol 733 ◽  
Author(s):  
Brock McCabe ◽  
Steven Nutt ◽  
Brent Viers ◽  
Tim Haddad
Keyword(s):  
High Temperature ◽  
Sample Preparation ◽  
Room Temperature ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Polyurethane Foams ◽  
Development Projects ◽  
Polymer Systems ◽  
Polyurethane Resin ◽  
Military Development

AbstractPolyhedral Oligomeric Silsequioxane molecules have been incorporated into a commercial polyurethane formulation to produce nanocomposite polyurethane foam. This tiny POSS silica molecule has been used successfully to enhance the performance of polymer systems using co-polymerization and blend strategies. In our investigation, we chose a high-temperature MDI Polyurethane resin foam currently used in military development projects. For the nanofiller, or “blend”, Cp7T7(OH)3 POSS was chosen. Structural characterization was accomplished by TEM and SEM to determine POSS dispersion and cell morphology, respectively. Thermal behavior was investigated by TGA. Two methods of TEM sample preparation were employed, Focused Ion Beam and Ultramicrotomy (room temperature).

An Study of Influence of Imperfections on the Delamination of Diamond-Like Carbon Films

2002 ◽  
Vol 719 ◽  
Author(s):  
Myoung-Woon Moon ◽  
Kyang-Ryel Lee ◽  
Jin-Won Chung ◽  
Kyu Hwan Oh
Keyword(s):  
Cross Sections ◽  
Focused Ion Beam ◽  
Imaging System ◽  
Ion Beam ◽  
Carbon Films ◽  
Diamond Like Carbon ◽  
Glass Substrates ◽  
Atomic Force ◽  
Initiation And Propagation

AbstractThe role of imperfections on the initiation and propagation of interface delaminations in compressed thin films has been analyzed using experiments with diamond-like carbon (DLC) films deposited onto glass substrates. The surface topologies and interface separations have been characterized by using the Atomic Force Microscope (AFM) and the Focused Ion Beam (FIB) imaging system. The lengths and amplitudes of numerous imperfections have been measured by AFM and the interface separations characterized on cross sections made with the FIB. Chemical analysis of several sites, performed using Auger Electron Spectroscopy (AES), has revealed the origin of the imperfections. The incidence of buckles has been correlated with the imperfection length.

Low Energy Ar Ion Milling of FIB TEM Specimens from 14 nm and Future FinFET Technologies

2018 ◽  
Author(s):  
C.S. Bonifacio ◽  
P. Nowakowski ◽  
M.J. Campin ◽  
M.L. Ray ◽  
P.E. Fischione
Keyword(s):  
Field Effect Transistor ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Specimen Preparation ◽  
Ion Milling ◽  
Transmission Electron ◽  
High Resolution Tem ◽  
Effect Transistor ◽  
20 Nm ◽  
Argon Ion

Abstract Transmission electron microscopy (TEM) specimens are typically prepared using the focused ion beam (FIB) due to its site specificity, and fast and accurate thinning capabilities. However, TEM and high-resolution TEM (HRTEM) analysis may be limited due to the resulting FIB-induced artifacts. This work identifies FIB artifacts and presents the use of argon ion milling for the removal of FIB-induced damage for reproducible TEM specimen preparation of current and future fin field effect transistor (FinFET) technologies. Subsequently, high-quality and electron-transparent TEM specimens of less than 20 nm are obtained.

Automated Diagonal Slice and View Solution for 3D Device Structure Analysis

2018 ◽  
Author(s):  
Sang Hoon Lee ◽  
Jeff Blackwood ◽  
Stacey Stone ◽  
Michael Schmidt ◽  
Mark Williamson ◽  
...  
Keyword(s):  
Cross Section ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Image Data ◽  
Planar Surface ◽  
Device Structure ◽  
Cross Sectional ◽  
Device Structures ◽  
The Cross ◽  
Planar Analysis

Abstract The cross-sectional and planar analysis of current generation 3D device structures can be analyzed using a single Focused Ion Beam (FIB) mill. This is achieved using a diagonal milling technique that exposes a multilayer planar surface as well as the cross-section. this provides image data allowing for an efficient method to monitor the fabrication process and find device design errors. This process saves tremendous sample-to-data time, decreasing it from days to hours while still providing precise defect and structure data.

Novel Approach of Improving Secondary Electron Detector in FIB System

2018 ◽  
Author(s):  
Steve Wang ◽  
Jim McGinn ◽  
Peter Tvarozek ◽  
Amir Weiss
Keyword(s):  
Integrated Circuit ◽  
Secondary Electron ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Vital Role ◽  
Electron Detector ◽  
System A ◽  
Novel Approach

Abstract Secondary electron detector (SED) plays a vital role in a focused ion beam (FIB) system. A successful circuit edit requires a good effective detector. Novel approach is presented in this paper to improve the performance of such a detector, making circuit altering for the most advanced integrated circuit (IC) possible.

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