Thermal Cycling Study of Quilt Packaging

2015 ◽  
Vol 137 (2) ◽  
Author(s):  
M. Ashraf Khan ◽  
Quanling Zheng ◽  
David Kopp ◽  
Wayne Buckhanan ◽  
Jason M. Kulick ◽  
...  

The continued progress of micro-electronics often requires functionality that is spread across multiple chips. This need has led to the development of a variety of alternative chip-packaging technologies that offer increased speed and bandwidth, with lower losses, in an increasing number of interchip interconnects. One recent alternative is quilt packaging® (QP), which has already shown promise from a performance perspective. The geometry of QP is essentially lateral: large numbers of ultrawide-bandwidth interchip interconnects (superconnects) are made directly by nodules fabricated along the edges of adjacent chips. Metallurgical bonding of the nodules creates a system in the form of a “quilt” of separately manufactured chips. This new interconnect geometry is subject to stresses that are different from more conventional schemes. For example, the thermal stress that causes fatigue and lead to failure in ball grid arrays is essentially shear stress, whereas the most critical stresses in QP are tensile and compressive. This paper describes studies of fatigue failure in QP, with attention to critical high-stress regions previously identified by finite-element modeling. Nodules were fabricated on silicon chips, and both single and quilted chips were thermally cycled up to 1000 times over a range of − 55 °C to 125 °C. Scanning electron microscopy (SEM) was used to detect mechanical failure. Focused-ion-beam cross-sectioning was used to expose the critical interior interfaces of QP structures for SEM examination. QP superconnects were found to be robust under all the test conditions evaluated.

2005 ◽  
Vol 872 ◽  
Author(s):  
John M. Maloney ◽  
Sara A. Lipka ◽  
Samuel P. Baldwin

AbstractLow pressure chemical vapor deposition (LPCVD) and plasma enhanced chemical vapor deposition (PECVD) silicon oxide and silicon nitride films were implanted subcutaneously in a rat model to study in vivo behavior of the films. Silicon chips coated with the films of interest were implanted for up to one year, and film thickness was evaluated by spectrophotometry and sectioning. Dissolution rates were estimated to be 0.33 nm/day for LPCVD silicon nitride, 2.0 nm/day for PECVD silicon nitride, and 3.5 nm/day for PECVD silicon oxide. A similar PECVD silicon oxide dissolution rate was observed on a silicon oxide / silicon nitride / silicon oxide stack that was sectioned by focused ion beam etching. These results provide a biostability reference for designing implantable microfabricated devices that feature exposed ceramic films.


Microscopy ◽  
2020 ◽  
Author(s):  
Yuki Mizutani ◽  
Mika Yamashita ◽  
Rie Hashimoto ◽  
Toru Atsugi ◽  
Akemi Ryu ◽  
...  

Abstract Senile lentigo or age spots are hyperpigmented macules of skin that commonly develop following long-term exposure to ultraviolet radiation. This condition is caused by accumulation of large numbers of melanosomes (melanin granules) produced by melanocytes within neighboring keratinocytes. However, there is still no consensus regarding the melanosome transfer mechanism in senile lentigo. To date, most pathohistological studies of skin have been two-dimensional and do not provide detailed data on the complex interactions of the melanocyte–keratinocyte network involved in melanosome transfer. We performed a three-dimensional reconstruction of the epidermal microstructure in senile lentigo using three different microscopic modalities to visualize the topological melanocyte–keratinocyte relationship and melanosome distribution. Confocal laser microscopy images showed that melanocyte dendritic processes are more frequently branched and elongated in senile lentigo skin than in normal skin. Serial transmission electron micrographs showed that dendritic processes extend into intercellular spaces between keratinocytes. Focused ion beam-scanning electron micrographs showed that dendritic processes in senile lentigo encircle adjacent keratinocytes and accumulate large numbers of melanosomes. Moreover, melanosomes transferred to keratinocytes are present not only in the supranuclear area but throughout the perinuclear area except on the basal side. The use of these different microscopic methods helped to elucidate the three-dimensional morphology and topology of melanocytes and keratinocytes in senile lentigo. We show that the localization of melanosomes in dendritic processes to the region encircling recipient keratinocytes contributes to efficient melanosome transfer in senile lentigo.


2015 ◽  
Vol 93 (11) ◽  
pp. 1252-1256 ◽  
Author(s):  
T. Firdous ◽  
D. Vick ◽  
M. Belov ◽  
F. Fani Sani ◽  
A. McDermott ◽  
...  

The measurements of magnetic hysteresis for aggregates of nanoparticles deposited on a surface are reported. Magnetite nanoparticles derived from magnetotactic bacteria are studied using nanomechanical torque magnetometry. The nanoparticles are deposited on high-stress Si3N4 membranes, to allow inspection by electron microscopy, followed by focused ion-beam milling of torsional resonators precisely located to capture selected aggregates within the membrane area. Torque magnetometry is performed using the resonators. We investigate also the magnetic torque-driven AC resonant modes of the modified supporting membrane. The observations are compared to numerical simulations of the mechanical modes, and to micromagnetic modeling of the hysteresis of a specific measured cluster of ∼350 nanoparticles.


Solid Earth ◽  
2021 ◽  
Vol 12 (4) ◽  
pp. 959-969
Author(s):  
Arianne J. Petley-Ragan ◽  
Oliver Plümper ◽  
Benoit Ildefonse ◽  
Bjørn Jamtveit

Abstract. Seismic faulting causes wall rock damage, which is driven by both mechanical and thermal stress. In the lower crust, co-seismic damage increases wall rock permeability, permits fluid infiltration and triggers metamorphic reactions that transform rock rheology. Wall rock microstructures reveal high-stress conditions near earthquake faults; however, there is limited documentation on the effects of a thermal pulse coupled with fluid infiltration. Here, we present a transmission electron microscopy study of co-seismic microfractures in plagioclase feldspar from lower crustal granulites from the Bergen Arcs, Western Norway. Focused ion beam foils are collected 1.25 mm and 1.8 cm from a 1.3 mm thick eclogite facies pseudotachylyte vein. Dislocation-free plagioclase and K-feldspar aggregates in the microfractures record a history of fluid introduction and recovery from a short-lived high-stress state caused by slip along the nearby fault. The feldspar aggregates retain the crystallographic orientation of their host and are elongated subparallel to the pseudotachylyte. We propose that plagioclase partially amorphized along the microfractures at peak stress conditions followed by repolymerization to form dislocation-free grain aggregates. Repolymerization and recrystallization were enhanced by the infiltration of fluids that transported Ca and K into the microfractures. Subsequent cooling led to exsolution of intermediate plagioclase compositions and the formation of the Bøggild–Huttenlocher intergrowth in the grains from the fracture closest to the pseudotachylyte. Our findings provide unequivocal evidence that the introduction of fluids in the microfractures occurred within the timescale of the thermal perturbation, prompting rapid annealing of damaged wall rock soon after earthquake rupture.


2021 ◽  
Vol 2103 (1) ◽  
pp. 012112
Author(s):  
Polina Afonicheva ◽  
Denis Lebedev ◽  
Anton Bukatin ◽  
Ivan Mukhin ◽  
Anatoly Evstrapov

Abstract We developed a technique for fabrication microfluidic silicon-glass chips with a system of nanochannels connecting two microchannel using traditional optical lithography and a focused ion beam. To investigate the transport phenomena in the nanochannels we experimentally studied their ion conductivity and using optical microscopy confirmed the existence of the diffusion flow through them. The developed method allows us to create systems of nanochannels with on-purpose geometry and controlled sizes. Devices with such nanochannels can be applied in the creation of biosensor devices and for genetic studies.


2020 ◽  
Author(s):  
Arianne J. Petley-Ragan ◽  
Oliver Plumper ◽  
Benoit Ildefonse ◽  
Bjørn Jamtveit

Abstract. Seismic faulting causes wall rock damage driven by both mechanical stress and thermal energy. In the lower crust, coseismic damage has important implications for wall rock permeability, the progress of subsequent fluid-driven metamorphic reactions, and rock rheology. Wall rock microstructures reveal high-stress conditions near the slip surface during lower crustal earthquakes, however, there is limited documentation on the thermal effect. Here, we present a transmission electron microscopy study of coseismic microfractures in plagioclase feldspar from lower crustal granulites from the Bergen Arcs, Western Norway. Focused ion beam foils are collected 1.25 mm and 1.8 cm from a 2 mm thick eclogite facies pseudotachylyte vein. Dislocation-free plagioclase aggregates fill the microfractures and record a history of recovery from a short-lived high stress-temperature (σ-T) state caused by seismic slip and frictional melting along the nearby fault surface. The plagioclase aggregates retain the crystallographic orientation of the host rock and shape preferred orientation relative to the fault slip surface. We propose that plagioclase partially amorphized along the microfractures at peak stress conditions followed by repolymerization to form dislocation-free grain aggregates within the timeframe of pseudotachylyte formation. The heat from the slip surface dissipated into the wall rock causing a short-lived temperature peak. Subsequent cooling led to exsolution of intermediate plagioclase compositions by spinodal decomposition within a few millimeters distance to the fault surface. Our findings provide microstructural evidence for the high σ-T conditions that are expected in the proximity of seismic faults, highlighting the importance of micro- and nanostructures for the understanding of earthquakes ruptures.


2002 ◽  
Vol 733 ◽  
Author(s):  
Brock McCabe ◽  
Steven Nutt ◽  
Brent Viers ◽  
Tim Haddad

AbstractPolyhedral Oligomeric Silsequioxane molecules have been incorporated into a commercial polyurethane formulation to produce nanocomposite polyurethane foam. This tiny POSS silica molecule has been used successfully to enhance the performance of polymer systems using co-polymerization and blend strategies. In our investigation, we chose a high-temperature MDI Polyurethane resin foam currently used in military development projects. For the nanofiller, or “blend”, Cp7T7(OH)3 POSS was chosen. Structural characterization was accomplished by TEM and SEM to determine POSS dispersion and cell morphology, respectively. Thermal behavior was investigated by TGA. Two methods of TEM sample preparation were employed, Focused Ion Beam and Ultramicrotomy (room temperature).


2002 ◽  
Vol 719 ◽  
Author(s):  
Myoung-Woon Moon ◽  
Kyang-Ryel Lee ◽  
Jin-Won Chung ◽  
Kyu Hwan Oh

AbstractThe role of imperfections on the initiation and propagation of interface delaminations in compressed thin films has been analyzed using experiments with diamond-like carbon (DLC) films deposited onto glass substrates. The surface topologies and interface separations have been characterized by using the Atomic Force Microscope (AFM) and the Focused Ion Beam (FIB) imaging system. The lengths and amplitudes of numerous imperfections have been measured by AFM and the interface separations characterized on cross sections made with the FIB. Chemical analysis of several sites, performed using Auger Electron Spectroscopy (AES), has revealed the origin of the imperfections. The incidence of buckles has been correlated with the imperfection length.


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