scholarly journals Ultrahigh thermal conductivity in isotope-enriched cubic boron nitride

Science ◽  
2020 ◽  
Vol 367 (6477) ◽  
pp. 555-559 ◽  
Author(s):  
Ke Chen ◽  
Bai Song ◽  
Navaneetha K. Ravichandran ◽  
Qiye Zheng ◽  
Xi Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
High Power ◽  
Room Temperature ◽  
Cubic Boron Nitride ◽  
Wide Bandgap ◽  
Boron Isotopes ◽  
Fundamental Interest ◽  
Boron Phosphide

Materials with high thermal conductivity (κ) are of technological importance and fundamental interest. We grew cubic boron nitride (cBN) crystals with controlled abundance of boron isotopes and measured κ greater than 1600 watts per meter-kelvin at room temperature in samples with enriched 10B or 11B. In comparison, we found that the isotope enhancement of κ is considerably lower for boron phosphide and boron arsenide as the identical isotopic mass disorder becomes increasingly invisible to phonons. The ultrahigh κ in conjunction with its wide bandgap (6.2 electron volts) makes cBN a promising material for microelectronics thermal management, high-power electronics, and optoelectronics applications.

scholarly journals Hybrid fillers of hexagonal and cubic boron nitride in epoxy composites for thermal management applications

RSC Advances ◽  
2019 ◽  
Vol 9 (13) ◽  
pp. 7388-7399 ◽  
Author(s):  
Yuyuan Zhang ◽  
Wei Gao ◽  
Yujing Li ◽  
Dehe Zhao ◽  
Hong Yin
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Synergistic Effect ◽  
Thermal Management ◽  
Cubic Boron Nitride ◽  
Polymeric Composites ◽  
Epoxy Composites ◽  
Hybrid Fillers

The synergistic effect of h-BN/c-BN/EP on the enhancement of thermal conductivity of polymeric composites has been demonstrated.

Status of β-SiC, Diamond and C-BN Semiconductors; Comparison of a Si Power Fet to a Hypothetical Diamond Fet

1989 ◽  
Vol 162 ◽  
Author(s):  
Richard Koba ◽  
William Russell
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Boron Nitride ◽  
Cubic Boron Nitride ◽  
Dielectric Strength ◽  
Wide Bandgap ◽  
Low Dielectric Constant ◽  
Great Promise ◽  
Low Dielectric ◽  
High Dielectric

ABSTRACTMonocrystalline β-SiC, diamond and cubic boron nitride (c-BN) are the three ultimate semiconductors. These materials show great promise as active semiconductors for power electronics because of their wide bandgap, the existence of substitutional dopants, their high dielectric strength, their low dielectric constant, and their high thermal conductivity. To illustrate their superiority, a conventional Si.power FET is compared to a theoretical diamond FET. By assuming the diamond FET can operate hotter and at a higher voltage, it is calculated that the diamond FET should deliver up to 35 times more power-to-load than the Si FET.

Cubic Boron Nitride as a New Semiconductor for Optoelectronics: Luminescence Properties and Potentialities

1989 ◽  
Vol 162 ◽  
Author(s):  
Koh Era ◽  
Osamu Mishima
Keyword(s):  
High Pressure ◽  
High Temperature ◽  
Boron Nitride ◽  
Room Temperature ◽  
Cubic Boron Nitride ◽  
Visible Region ◽  
Vibrational Structure ◽  
Luminescence Properties ◽  
Optoelectronic Applications ◽  
P Type

ABSTRACTIn cubic boron nitride made by high pressure and high temperature technique in our institute, we have found three luminescence bands in the ultraviolet and the short visible region at room temperature by cathode-ray excitation. They are: a band having vibrational structure and ascribable to undoped state of the crystal, a band ascribable to p-type doping and a band ascribable to n-type doping. Discussion is made on differences between the injection luminescence and the cathodoluminescence. Potentialities and difficulties in realizing the potentialities of cBN for optoelectronic applications are discussed.

Vapor grown carbon fiber reinforced aluminum composites with very high thermal conductivity

1995 ◽  
Vol 10 (2) ◽  
pp. 247-250 ◽  
Author(s):  
Jyh-Ming Ting ◽  
Max L. Lake
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
Thermal Management ◽  
Room Temperature ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Aluminum Metal ◽  
Aluminum Metal Matrix Composite ◽  
New Material ◽  
Very High

The first use of continuous vapor grown carbon fiber (VGCF) as reinforcement in aluminum metal matrix composite (Al MMC) is reported. Al MMC represents a new material for thermal management in high-power, high-density electronic devices. Due to the ultrahigh thermal conductivity of VGCF, 1950 W/m-K at room temperature, VGCF-reinforced Al MMC exhibits excellent thermal conductivity that cannot be achieved by using any other carbon fiber as reinforcement. An unprecedented high thermal conductivity of 642 W/m-K for Al MMC was obtained by using 36.5% of VGCF.

Thermal Conductivity Measurement of Individual Polythiophene Nanofibers With Suspended Micro-Resistance Thermometer Devices

2012 ◽  
Author(s):  
Sally A. McMenamin ◽  
Annie Weathers ◽  
Virendra Singh ◽  
Michael T. Pettes ◽  
Baratunde A. Cola ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Room Temperature ◽  
Defect Density ◽  
Conductivity Measurement ◽  
Polymer Chains ◽  
High Thermal Conductivity ◽  
Resistance Thermometer ◽  
Aligned Nanofibers ◽  
Measured Thermal Conductivity

High thermal conductivity, comparable to that of a metal, has been observed in some stretched polyethylene nanofibers due to a decrease in defect density with the alignment of the polymer chains. Such high thermal conductivity may be useful for thermal management applications such as thermal adhesives made of aligned nanofibers. Polythiophene (Pth) is a conducting polymer that can be synthesized electrochemically as aligned nanofiber forests without the need for stretching individual fibers. Here we report the thermal conductivity of individual suspended Pth nanofibers synthesized electrochemically and measured with the use of a microfabricated device in the temperature range of 80 K to 375 K. The measured thermal conductivity increases with temperature. For three single suspended Pth nanofibers with a diameter on the order of 200 nm, the room temperature value between 0.6 and 0.8 W/m K is about four-fold higher than that reported for Pth thin films and comparable to that reported for binder-filler thermal adhesives.

scholarly journals Room-temperature single photon emitters in cubic boron nitride nanocrystals

2020 ◽  
Vol 10 (4) ◽  
pp. 843
Author(s):  
Gabriel I. López-Morales ◽  
Aziza Almanakly ◽  
Sitakanta Satapathy ◽  
Nicholas V. Proscia ◽  
Harishankar Jayakumar ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Room Temperature ◽  
Single Photon ◽  
Cubic Boron Nitride ◽  
Single Photon Emitters

Antimicrobial hexagonal boron nitride nanoplatelet composites for the thermal management of medical electronic devices

2019 ◽  
Vol 3 (11) ◽  
pp. 2455-2462 ◽  
Author(s):  
Si-Wei Xiong ◽  
Pan Zhang ◽  
Yu Xia ◽  
Pei-Gen Fu ◽  
Jing-Gang Gai
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Hexagonal Boron Nitride ◽  
Electronic Devices ◽  
E Coli ◽  
Thermally Conductive ◽  
Medical Electronic

We developed a thermally conductive and antimicrobial QACs@h-BN/LLDPE composites for thermal management of medically electronic devices, it was approximately 100% against both E. coli and S. aureus and its thermal conductivity can reach 1.115 W m−1 K−1.

Flexible polyurethane/boron nitride composites with enhanced thermal conductivity

2019 ◽  
Vol 32 (3) ◽  
pp. 324-333 ◽  
Author(s):  
Ting Fei ◽  
Yanbao Li ◽  
Baocheng Liu ◽  
Chengbo Xia
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
High Stability ◽  
Heat Dissipation ◽  
Thermoplastic Polyurethane ◽  
Thermally Conductive ◽  
Mechanical Bending ◽  
Flexible Polyurethane ◽  
Enhanced Thermal Conductivity

Polymer-based composites with high thermal conductivity have great potential application as thermal management materials. This study was devoted to improving the thermal conductivity of the flexible thermoplastic polyurethane (TPU) by employing boron nitride (BN) as heat filler. We prepared flexible and thermally conductive TPU/BN composite via solution mixing and hot pressing. The thermal conductivity of the TPU/BN composite with 50 wt% BN (32.6 vol%) reaches 3.06 W/m·K, approximately 1290% enhancement compared to that of pure TPU (0.22 W/m·K). In addition, the thermal conductivity of our flexible TPU/BN composite with 30 wt% BN is almost not varied (a decrease of only 2.5%) after 100 cycles of mechanical bending, which indicates the high stability of heat conduction of our flexible TPU/BN composite under mechanical bending. The maximum tensile strength of the TPU/BN composite with 5 wt% BN is 48.9 MPa, 14% higher than that of pure TPU (43.2 MPa). Our flexible and highly thermally conductive TPU/BN composites show promise for heat dissipation in various applications in the electronics field.

Room-temperature Repeatedly Processable Baroplastic/Boron Nitride Thermal Management Composite

2021 ◽  
Author(s):  
Jia-Ning Qiao ◽  
Yu Fan Hu ◽  
Xu Ji ◽  
Jian-Hua Tang ◽  
Jun Lei ◽  
...  
Keyword(s):  
High Temperature ◽  
Boron Nitride ◽  
Thermal Degradation ◽  
Energy Saving ◽  
Thermal Management ◽  
Room Temperature ◽  
High Repeatability

Baroplastics show great superiorities over common polymers that are processed at high temperature, such as energy-saving, less thermal degradation, high repeatability and durability, etc. In this work, we synthesized a...

Sign in / Sign up

Export Citation Format

Share Document