A Deep UV Imaging System For Lithography And Process Development

1988 ◽  
Author(s):  
Paul Michaloski ◽  
Paul Dewa
Keyword(s):  
Process Development ◽  
Imaging System ◽  
Uv Imaging ◽  
Deep Uv

Deep UV Imaging of Galaxies in the Fornax Cluster

1996 ◽  
Vol 112 ◽  
pp. 431 ◽  
Author(s):  
Karen O'Neil ◽  
G. D. Bothun ◽  
Eric P. Smith ◽  
T. P. Stecher
Keyword(s):  
Uv Imaging ◽  
Deep Uv ◽  
Fornax Cluster

First demonstration and performance of AlGaN based focal plane array for deep-UV imaging

2009 ◽  
Author(s):  
J.-L. Reverchon ◽  
S. Bansropun ◽  
J. A. Robo ◽  
J. P. Truffer ◽  
E. Costard ◽  
...  
Keyword(s):  
Focal Plane ◽  
Focal Plane Array ◽  
Uv Imaging ◽  
Deep Uv ◽  
And Performance

A Transmission X-ray Microscope (TXM) for Non-destructive 3D Imaging of ICs at Sub-100 nm Resolution

2002 ◽  
Author(s):  
Steve Wang ◽  
Frederick Duewer ◽  
Shashidar Kamath ◽  
Christopher Kelly ◽  
Alan Lyon ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
Focused Ion Beam ◽  
Process Development ◽  
Imaging System ◽  
Ion Beam ◽  
Layer By Layer ◽  
X Ray ◽  
Submicron Structures

Abstract Xradia has developed a laboratory table-top transmission x-ray microscope, TXM 54-80, that uses 5.4 keV x-ray radiation to nondestructively image buried submicron structures in integrated circuits with at better than 80 nm 2D resolution. With an integrated tomographic imaging system, a series of x-ray projections through a full IC stack, which may include tens of micrometers of silicon substrate and several layers of Cu interconnects, can be collected and reconstructed to produce a 3D image of the IC structure at 100 nm resolution, thereby allowing the user to detect, localize, and characterize buried defects without having to conduct layer by layer deprocessing and inspection that are typical of conventional destructive failure analysis. In addition to being a powerful tool for both failure analysis and IC process development, the TXM may also facilitate or supplant investigations using scanning electron microscopy (SEM), transmission electron microscopy (TEM), and focused ion beam (FIB) tools, which generally require destructive sample preparation and a vacuum environment.

Label-free multi-spectral deep UV imaging of prostate cancer tissue

2021 ◽  
Author(s):  
Soheil Soltani ◽  
Ashkan Ojaghi ◽  
Adeboye O. Osunkoya ◽  
Francisco E. Robles
Keyword(s):  
Prostate Cancer ◽  
Cancer Tissue ◽  
Label Free ◽  
Uv Imaging ◽  
Prostate Cancer Tissue ◽  
Deep Uv

Diffractive/refractive (hybrid) UV-imaging system for minimally invasive metrology: design, performance, and application experiments

2012 ◽  
Vol 51 (12) ◽  
pp. 1982 ◽  
Author(s):  
René Reichle ◽  
Christof Pruss ◽  
Christopher Gessenhardt ◽  
Christof Schulz ◽  
Wolfgang Osten
Keyword(s):  
Minimally Invasive ◽  
Imaging System ◽  
Design Performance ◽  
Uv Imaging

scholarly journals A Novel Technique for Full-Field Deformation and Temperature Measurement by Ultraviolet Imaging: Experimental Design and Preliminary Results

Coatings ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 641
Author(s):  
Jingqing Zhang ◽  
Yong Shang ◽  
Xuehang Li ◽  
Yali Dong ◽  
Yanling Pei
Keyword(s):  
Temperature Field ◽  
Temperature Measurement ◽  
Bandpass Filter ◽  
Elevated Temperatures ◽  
Imaging System ◽  
Image Correlation ◽  
Measured Temperature ◽  
Field Calculation ◽  
Full Field ◽  
Uv Imaging

Synchronous measurement of full-field temperature and deformation at high temperature especially more than 1273 K is of much significance especially for part applications of turbine structures and materials. Non-contact optical methods attract more and more attention, however, current methods all face different challenges, such as strong light reflection on the surface of the specimen, disturbing radiation from environment, complex equipment setup, limited measured temperature not higher than 900 ℃ and so on. In this work, we develop an innovative technique to overcome some current problems. The measurement system employing an ultraviolet (UV) imaging system is composed of a scientific complementary metal oxide semiconductor (sCMOS) camera, a lens and a UV bandpass filter. The UV bandpass filter was used for thermal radiation elimination to acquire high quality images at elevated temperatures for deformation field calculation suitable for digital image correlation (DIC) method. The UV sensitive sCMOS camera without using active illumination was employed to collect enough UV radiation energy and eliminate the interference of the external ambient light, which is applicable for high accuracy temperature field measurement. Our system can realize the synchronous capture of image and temperature acquisition with passive UV imaging system at temperature not lower than 1473K. The feasibility of the method was verified through heating molybdenum (Mo) and Ni-based superalloy IC21 materials. The temperature fields of Mo measured by the established imaging system up to 1835 K with error less than 0.25% showed the effectiveness for temperature measurement. The estimated deformation and temperature field of Ni-based superalloy IC21 up to 1473 K with measured temperature error less than 0.5% demonstrated well the great potential of the UV imaging system in simultaneous measurement of temperature and deformation fields at elevated temperatures.

scholarly journals Status of backthinned AlGaN based focal plane arrays for deep-UV imaging

2017 ◽  
Author(s):  
J. P. Truffer ◽  
F. Semond ◽  
J. Y. Duboz ◽  
J. L. Reverchon ◽  
G. Lehoucq ◽  
...  
Keyword(s):  
Focal Plane ◽  
Focal Plane Arrays ◽  
Uv Imaging ◽  
Deep Uv
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