Growth of semi-polar GaN-based light-emitting diodes grown on an patterned Si substrate

Author(s):  
Ching-Hsueh Chiu ◽  
Da-Wei Lin ◽  
Zhen-Yu Li ◽  
Shih-Chun Ling ◽  
Hao-Chung Kuo ◽  
...  
2012 ◽  
Vol 61 (17) ◽  
pp. 178503
Author(s):  
Liu Mu-Lin ◽  
Min Qiu-Ying ◽  
Ye Zhi-Qing

2011 ◽  
Vol 47 (7) ◽  
pp. 899-906 ◽  
Author(s):  
Ching-Hsueh Chiu ◽  
Chien-Chung Lin ◽  
Dong-Mei Deng ◽  
Da-Wei Lin ◽  
Jin-Chai Li ◽  
...  

2011 ◽  
Vol 47 (13) ◽  
pp. 765-767 ◽  
Author(s):  
A.-L. Bavencove ◽  
P. Gilet ◽  
A. Dussaigne ◽  
Le Si Dang ◽  
B. Martin ◽  
...  

2008 ◽  
Author(s):  
Zhanguo Li ◽  
Guojun Liu ◽  
Minghui You ◽  
Lin Li ◽  
Mei Li ◽  
...  

ACS Photonics ◽  
2018 ◽  
Vol 5 (4) ◽  
pp. 1453-1459 ◽  
Author(s):  
Moonsang Lee ◽  
Mino Yang ◽  
Keun Man Song ◽  
Sungsoo Park

Nanomaterials ◽  
2018 ◽  
Vol 8 (7) ◽  
pp. 543 ◽  
Author(s):  
Moonsang Lee ◽  
Hyunkyu Lee ◽  
Keun Song ◽  
Jaekyun Kim

We report forward tunneling characteristics of InGaN/GaN blue light emitting diodes (LEDs) on freestanding GaN detached from a Si substrate using temperature-dependent current–voltage (T-I-V) measurements. T-I-V analysis revealed that the conduction mechanism of InGaN/GaN LEDs using the homoepitaxial substrate can be distinguished by tunneling, diffusion and recombination current, and series resistance regimes. Their improved crystal quality, inherited from the nature of homoepitaxy, resulted in suppression of forward leakage current. It was also found that the tunneling via heavy holes in InGaN/GaN LEDs using the homoepitaxial substrate can be the main transport mechanism under low forward bias, consequentially leading to the improved forward leakage current characteristics.


1992 ◽  
Vol 31 (Part 2, No. 2A) ◽  
pp. L78-L81 ◽  
Author(s):  
Naoki Wada ◽  
Shinichi Yoshimi ◽  
Shiro Sakai ◽  
Chun Lin Shao ◽  
Masuo Fukui

2021 ◽  
Vol 2086 (1) ◽  
pp. 012191
Author(s):  
V V Lendyashova ◽  
K P Kotlyar ◽  
V O Gridchin ◽  
R R Reznik ◽  
A I Lihachev ◽  
...  

Abstract In modern optoelectronics, arrays or single nanowires (NWs) of III-N materials, in particular InGaN, separated from the original substrates are used to fabricate light-emitting diodes or single photon sources. This work describes a technology of separation super-dense arrays or arrays of partially-coalesced InGaN nanowires and single nanowires from a Si substrate by chemical etching in HF:HNO3 solution, which allows preserving the optical properties of the structure for further use.


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