Design and simulation of the surface shape control system for membrane mirror

2009 ◽  
Author(s):  
Gengsheng Zhang ◽  
Minxue Tang
Keyword(s):  
Control System ◽  
Shape Control ◽  
Surface Shape

Surface shape control of electrostatic stretching membrane mirror by multi-electrodes

2012 ◽  
Vol 20 (2) ◽  
pp. 344-351 ◽  
Author(s):  
张鹏 ZHANG Peng ◽  
金光 JIN Guang ◽  
张元 ZHANG Yuan ◽  
钟兴 ZHONG Xing
Keyword(s):  
Shape Control ◽  
Surface Shape

Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder

2011 ◽  
Vol 32 (10) ◽  
pp. 104010 ◽  
Author(s):  
Xianglong Zhu ◽  
Renke Kang ◽  
Zhigang Dong ◽  
Guang Feng
Keyword(s):  
Shape Control ◽  
Surface Shape

Development of Ultra-Precision Grinder for 300mm Wafers

2012 ◽  
Vol 565 ◽  
pp. 609-614 ◽  
Author(s):  
X.L. Zhu ◽  
Z.G. Dong ◽  
Ren Ke Kang ◽  
D.M. Guo
Keyword(s):  
Shape Control ◽  
State Of The Art ◽  
Surface Shape ◽  
Wafer Surface ◽  
Thickness Variation ◽  
Grinding Forces ◽  
Wafer Thickness ◽  
Ultra Precision ◽  
Total Thickness Variation ◽  
And Control

This study presents design of an ultra-precision wafer grinder which incorporates state-of-the-art automatic supervision and control system. The wafer grinder is characterized by wafer surface shape control, grinding forces and wafer thickness monitoring systems. The design provides a totally integrated solution to the ultra-precision grinder that is capable of grinding silicon wafers with surface roughness Ra<3 nm and total thickness variation<2µm/300mm.

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