An evaluation of a new side-wall-angle measurement technique for mask patterns by CD-SEM

2009 ◽  
Author(s):  
Hidemitsu Hakii ◽  
Isao Yonekura ◽  
Masashi Kawashita ◽  
Yosuke Kojima ◽  
Yoshifumi Sakamoto ◽  
...  
Keyword(s):  
Measurement Technique ◽  
Side Wall ◽  
Angle Measurement ◽  
Wall Angle

New CD-SEM metrology method for the side wall angle measurement using multiple detectors

2011 ◽  
Author(s):  
Hiroshi Fukaya ◽  
Tsutomu Murakawa ◽  
Soichi Shida ◽  
Masayuki Kuribara ◽  
Toshimichi Iwai ◽  
...  
Keyword(s):  
Side Wall ◽  
Angle Measurement ◽  
Wall Angle ◽  
Multiple Detectors

Reproducibility of a simplified Q-angle measurement technique

2010 ◽  
Vol 21 (2) ◽  
pp. 158-164 ◽  
Author(s):  
Jason D. Peeler ◽  
Jeff Leiter ◽  
Judy E. Anderson
Keyword(s):  
Measurement Technique ◽  
Angle Measurement ◽  
Q Angle

Optical alignment and tilt-angle measurement technique based on Lloyd’s mirror arrangement

1992 ◽  
Vol 17 (14) ◽  
pp. 1024 ◽  
Author(s):  
Huihua Kenny Chiang ◽  
Richard P. Kenan ◽  
Nile F. Hartman ◽  
Christopher J. Summers
Keyword(s):  
Measurement Technique ◽  
Tilt Angle ◽  
Angle Measurement ◽  
Optical Alignment

Modelling of side-wall angle for optical proximity correction for self-aligned double patterning

2012 ◽  
Author(s):  
Sylvain Moulis ◽  
Vincent Farys ◽  
Jérôme Belledent ◽  
Johann Foucher
Keyword(s):  
Side Wall ◽  
Wall Angle ◽  
Optical Proximity Correction ◽  
Double Patterning

Numerical Analysis of the Material Thickness Variation during Forming Process of Conical Mini-Parts

2014 ◽  
Vol 1036 ◽  
pp. 265-268
Author(s):  
Robert Stefanut Teaca ◽  
Gheorghe Brabie
Keyword(s):  
Side Wall ◽  
Zinc Alloy ◽  
Thickness Variation ◽  
Forming Process ◽  
Wall Angle ◽  
Material Thickness ◽  
Electrical Devices ◽  
Punch Radius ◽  
Copper Zinc ◽  
Material Fracture

Due to the trend of miniaturization on electrical devices, medical devices, and energy, etc., the need for micro and mini metal parts is increasing at a tremendous rate. In order to realize the potential of the mini-parts and take advantages from the mini-forming process, innovative modifications of the forming process must be developed. These modifications are particularly important with respect to the mini-parts forming, which offers an excellent opportunity to produce high accurate mini parts and to reduce manufacturing costs and time. However, severe modifications of the material thickness occur during forming of mini-parts. This paper presents a study concerning the material thickness variation during forming process of mini-parts. The main objective is to understand the material behaviour during forming of mini-parts. The material used in this analysis is copper - zinc alloy with anisotropic properties. During forming process of conical mini-parts, the material become very thin around the punch radius and become thicker at the upper end of the part. This phenomenon cause forming problems such: material fracture, wrinkling, part diameter variation, springback etc. There are multiple factors that affect the material thickness variation during forming process as: side wall angle, friction coefficient, punch radius, and punch speed. The Dynaform 5.9.1 software was used to simulate the forming process. The part obtained after each simulation was analyzed and measured to quantify material thickness variation on the final conical mini-part. To analyze the behaviour of the material during deep drawing process the obtained results for different conical mini-parts were compared. In the final part of this paper some conclusions regarding the material thickness variation during forming of conical mini-parts are presented.

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