Platinum silicide formation during pulsed laser annealing prepared by pulsed laser deposition

2000 ◽  
Author(s):  
Meicheng Li ◽  
Xuekang Chen ◽  
Jing Wang ◽  
Jianping Yang ◽  
Gan Wu ◽  
...  
2001 ◽  
Vol 72 (1) ◽  
pp. 85-87 ◽  
Author(s):  
Mei Cheng Li ◽  
Xuekang Chen ◽  
Wei Cai ◽  
Jinghua Yin ◽  
Jianping Yang ◽  
...  

2006 ◽  
Vol 910 ◽  
Author(s):  
Sherif Sedky ◽  
Ibrahim ElDeftar ◽  
Omar Mortagy

AbstractThe main objective of this work is to investigate the possibility of combining pulsed laser deposition (PLD) and pulsed laser annealing to realize p-type Si1-xGex thin films suitable for post-processing MEMS on top of standard pre-fabricated driving electronics. The main advantage of this approach is that the substrate is kept at a CMOS backend compatible temperature throughout the deposition and thus the MEMS integration process will have no thermal impact on the underlying electronics. In addition, it is demonstrated that PLD Si1-xGex has good adhesion to SiO2 and accordingly there is no need for a silicon nucleation which is the case for LPCVD and PECVD. Furthermore, this technique is much more economical than CVD as it does don't imply using expensive gas precursors such as germane and silane.


2010 ◽  
Vol 87 (12) ◽  
pp. 2540-2543 ◽  
Author(s):  
Hou-Yu Chen ◽  
Chia-Yi Lin ◽  
Chien-Chao Huang ◽  
Chao-Hsin Chien

2011 ◽  
Vol 158 (8) ◽  
pp. H840 ◽  
Author(s):  
Hou-Yu Chen ◽  
Chia-Yi Lin ◽  
Min-Cheng Chen ◽  
Chien-Chao Huang ◽  
Chao-Hsin Chien

2004 ◽  
Vol 16 (1) ◽  
pp. 40-45 ◽  
Author(s):  
C. F. Tan ◽  
X. Y. Chen ◽  
Y. F. Lu ◽  
Y. H. Wu ◽  
B. J. Cho ◽  
...  

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