Design of an APS CMOS image sensor for space applications using standard CAD tools and CMOS technology

Author(s):  
Jerome Goy ◽  
Bernard Courtois ◽  
Jean Michel Karam ◽  
Francis Pressecq
2005 ◽  
Vol 26 (5) ◽  
pp. 301-303 ◽  
Author(s):  
T.H. Hsu ◽  
Y.K. Fang ◽  
D.N. Yaung ◽  
S.G. Wuu ◽  
H.C. Chien ◽  
...  

2011 ◽  
Author(s):  
Xinyang Wang ◽  
Jan Bogaerts ◽  
Werner Ogiers ◽  
Gerd Beeckman ◽  
Guy Meynants

2021 ◽  
Author(s):  
Jun Long Zhang

A CMOS image sensor consists of a light sensing region that converts photonic energy to an electrical signal and a peripheral circuitry that performs signal conditioning and post-processing. This project investgates the principle and design of CMOS active image sensors. The basic concepts and principle of CMOS image sensors are investigated. The advantages of CMOS image sensors over charge-coupled device (CCD) image sensors are presented. Both passive pixel sensors (PPS) and acive pixel sensors (APS) are examined in detail. The noise of CMOS image sensors is investigated and correlated double sampling (CDS) techniques are examined. The design of APS arrays, CDS circuits and 8-bit analog to-digital converters in TSMC-0.18μm 1.8V CMOS technology is presented. The simulation results and layout of the designed CMOS image sensor are presented.


2021 ◽  
Vol 16 ◽  
pp. 626-632
Author(s):  
Aicha Menssouri ◽  
Karim El Khadiri ◽  
Ahmed Tahiri

This work aims to design and simulate an in-pixel Capacitive Transimpedance Amplifier (CTIA) and peripheral circuitry that ensures pixel reading. Each pixel circuit is composed of four transistors using 90nm CMOS technology with a supply voltage of 1.8 V and is part of an array of pixels that make up a CMOS image sensor with peripheral circuitry. Pixel output is sent to a delta difference sampling (DDS) circuit to filter reset voltages. The Gain Margin achieved for the in-pixel CTIA is 44dB and 91dB for the Phase Margin. We also present measured pixel parameters and give a comparison with prior work. The timing and readout circuitry is also described.


2005 ◽  
Vol 26 (9) ◽  
pp. 634-636 ◽  
Author(s):  
T.H. Hsu ◽  
Y.K. Fang ◽  
D.N. Yaung ◽  
S.G. Wuu ◽  
H.C. Chien ◽  
...  

2014 ◽  
Vol 2014 ◽  
pp. 1-6 ◽  
Author(s):  
Fang Tang ◽  
Amine Bermak ◽  
Abbes Amira ◽  
Mohieddine Amor Benammar ◽  
Debiao He ◽  
...  

Conventional two-step ADC for CMOS image sensor requires full resolution noise performance in the first stage single slope ADC, leading to high power consumption and large chip area. This paper presents an 11-bit two-step single slope/successive approximation register (SAR) ADC scheme for CMOS image sensor applications. The first stage single slope ADC generates a 3-bit data and 1 redundant bit. The redundant bit is combined with the following 8-bit SAR ADC output code using a proposed error correction algorithm. Instead of requiring full resolution noise performance, the first stage single slope circuit of the proposed ADC can tolerate up to 3.125% quantization noise. With the proposed error correction mechanism, the power consumption and chip area of the single slope ADC are significantly reduced. The prototype ADC is fabricated using 0.18 μm CMOS technology. The chip area of the proposed ADC is 7 μm × 500 μm. The measurement results show that the energy efficiency figure-of-merit (FOM) of the proposed ADC core is only 125 pJ/sample under 1.4 V power supply and the chip area efficiency is 84 k μm2·cycles/sample.


2021 ◽  
Author(s):  
Jun Long Zhang

A CMOS image sensor consists of a light sensing region that converts photonic energy to an electrical signal and a peripheral circuitry that performs signal conditioning and post-processing. This project investgates the principle and design of CMOS active image sensors. The basic concepts and principle of CMOS image sensors are investigated. The advantages of CMOS image sensors over charge-coupled device (CCD) image sensors are presented. Both passive pixel sensors (PPS) and acive pixel sensors (APS) are examined in detail. The noise of CMOS image sensors is investigated and correlated double sampling (CDS) techniques are examined. The design of APS arrays, CDS circuits and 8-bit analog to-digital converters in TSMC-0.18μm 1.8V CMOS technology is presented. The simulation results and layout of the designed CMOS image sensor are presented.


Sensors ◽  
2019 ◽  
Vol 19 (7) ◽  
pp. 1505 ◽  
Author(s):  
Woo-Tae Kim ◽  
Cheonwi Park ◽  
Hyunkeun Lee ◽  
Ilseop Lee ◽  
Byung-Geun Lee

This paper presents a high full well capacity (FWC) CMOS image sensor (CIS) for space applications. The proposed pixel design effectively increases the FWC without inducing overflow of photo-generated charge in a limited pixel area. An MOS capacitor is integrated in a pixel and accumulated charges in a photodiode are transferred to the in-pixel capacitor multiple times depending on the maximum incident light intensity. In addition, the modulation transfer function (MTF) and radiation damage effect on the pixel, which are especially important for space applications, are studied and analyzed through fabrication of the CIS. The CIS was fabricated using a 0.11 μm 1-poly 4-metal CIS process to demonstrate the proposed techniques and pixel design. A measured FWC of 103,448 electrons and MTF improvement of 300% are achieved with 6.5 μm pixel pitch.


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