Realization of practical attenuated phase-shift mask with high-transmission KrF excimer laser exposure

1999 ◽  
Author(s):  
Nobuhito Toyama ◽  
Hiroyuki Miyashita ◽  
Yasutaka Morikawa ◽  
Hiroshi Fujita ◽  
Kazuya Iwase ◽  
...  
1999 ◽  
Vol 38 (Part 1, No. 5A) ◽  
pp. 2686-2693 ◽  
Author(s):  
Shuji Nakao ◽  
Akihiro Nakae ◽  
Atsumi Yamaguchi ◽  
Kouichirou Tsujita ◽  
Wataru Wakamiya

1987 ◽  
Vol 101 ◽  
Author(s):  
I. Higashikawa ◽  
M. Nonaka ◽  
T. Sato ◽  
M. Nakase ◽  
S. Ito ◽  
...  

ABSTRACTA KrF excimer laser exposure method has been developed for laboratory use, which employs 10 to 1 achromatic projection lens of 0.37 NA and 5x5 mm field size , and a TTL alignment system using the double diffraction method, which was realized by the use,of the achromatic lens. Novolak type mid-UV resists, such as AZ-5214 and PR-1024, were best suited for use in 248 nm exposure, considering the sensitivity and etching resistance from a practical viewpoint, and an additional post exposure baking process also improved the resist profile. The dependences of the exposure characteristics on the energy density per pulse and pulse frequency of these resists were not observed in the region of the practical exposure conditions. An alignment precision of x±30-= 0.2 μm was achieved for the alignment mark consisting of poly Si pattern. Thus, a 0.3 μm line and space pattern was realized by using tri-level resist process and a 0.2 μm gate pattern was successfully fabricated on the coplanar pattern with a 0.4 μm step.


1999 ◽  
Vol 558 ◽  
Author(s):  
Chang-Ho Oh ◽  
Mitsuru Nakata ◽  
Masakiyo Matsumura

ABSTRACTWe have proposed a new excimer-laser crystallization system based on an optical projection concept. In the proposed system, a collimated excimer-laser light pulse is irradiated to Si thin-films on a glassy substrate, through a phase-shift mask and an optical lens system. Using oneand two-dimensional phase-shift masks, we have examined feasibility of the proposed method.


1995 ◽  
Vol 390 ◽  
Author(s):  
Hua Li ◽  
Janet K. Lumpp

ABSTRACTFabrication of metal lines on aluminum nitride (AIN) ceramic is important for application of AIN as a microcircuit board. An Al line can be made directly from AIN by excimer laser exposure. All lines in this paper were written by pulsed KrF excimer laser (248 nm) in air and vacuum at different scan speeds with a constant laser energy. The morphology of the Al lines was observed by optical and scanning electron microscopies. The lines become more metallic when the scan speed decreases. Consequently the resistance, measured by the four-point probe technique, decreased to a minimum value in the scan speed range of 400 μm/s to 900 μm/s for the samples made in air. The resistance of Al lines written in air is greater than that in vacuum because of oxidation. The samples made in air with scan speed lower than 400 μm/s were heavily oxidized. SAXPS spectra showed a strong oxidation state and that the excimer laser exposure depletes nitrogen from AMN. The Al lines produced by laser-induced decomposition of AMN board are being evaluated as catalysts for laser assisted CVD and conventional electroless plating. The oxidation layer on the surface of Al lines may effect the adhesion between the Al lines and the deposited or plated metal.


1997 ◽  
Author(s):  
Yuko Seki ◽  
Jun Ushioda ◽  
Takashi Saito ◽  
Katsumi Maeda ◽  
Kaichiro Nakano ◽  
...  

1997 ◽  
Vol 36 (Part 1, No. 12B) ◽  
pp. 7488-7493 ◽  
Author(s):  
Keisuke Nakazawa ◽  
Masaya Uematsu ◽  
Toshio Onodera ◽  
Kazuya Kamon ◽  
Tohru Ogawa ◽  
...  

1999 ◽  
Author(s):  
Robert J. Socha ◽  
Xuelong Shi ◽  
Ken C. Holman ◽  
Mircea V. Dusa ◽  
Will Conley ◽  
...  

2006 ◽  
Author(s):  
Michael Hibbs ◽  
Satoru Nemoto ◽  
Toru Komizo

2016 ◽  
Author(s):  
Thomas Faure ◽  
Yoshifumi Sakamoto ◽  
Yusuke Toda ◽  
Karen Badger ◽  
Kazunori Seki ◽  
...  

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