Automatic computer-aided system of simulating solder joint formation

1999 ◽  
Author(s):  
Xiujuan Zhao ◽  
Chunqing Wang ◽  
Guanqun Zheng ◽  
Gouzhong Wang ◽  
Shiqin Yang
Keyword(s):  
Solder Joint ◽  
Joint Formation ◽  
Automatic Computer ◽  
Computer Aided

An automatic Computer-Aided Diagnosis system based on the Multimodal fusion of Breast Cancer (MF-CAD)

2021 ◽  
Vol 69 ◽  
pp. 102914
Author(s):  
Raouia Mokni ◽  
Norhene Gargouri ◽  
Alima Damak ◽  
Dorra Sellami ◽  
Wiem Feki ◽  
...  
Keyword(s):  
Breast Cancer ◽  
Computer Aided Diagnosis ◽  
Multimodal Fusion ◽  
Diagnosis System ◽  
Automatic Computer ◽  
Computer Aided ◽  
Aided Diagnosis

Automatic computer‐aided analysis of optic disc pallor in fundus photographs

2018 ◽  
Vol 97 (4) ◽  
pp. e519-e525 ◽  
Author(s):  
Hee Kyung Yang ◽  
Ji Eun Oh ◽  
Sang Beom Han ◽  
Kwang Gi Kim ◽  
Jeong‐Min Hwang
Keyword(s):  
Optic Disc ◽  
Automatic Computer ◽  
Computer Aided Analysis ◽  
Computer Aided ◽  
Fundus Photographs

scholarly journals Automatic computer-aided caries detection from dental x-ray images using intelligent level set

2018 ◽  
Vol 77 (21) ◽  
pp. 28843-28862 ◽  
Author(s):  
Abdolvahab Ehsani Rad ◽  
Mohd Shafry Mohd Rahim ◽  
Hoshang Kolivand ◽  
Alireza Norouzi
Keyword(s):  
Level Set ◽  
Caries Detection ◽  
Automatic Computer ◽  
X Ray ◽  
Computer Aided

The Effects of Electromigration to the Solder Joint Formation: A Comparison Between 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu Lead Free Solder

2012 ◽  
Vol 622-623 ◽  
pp. 195-199 ◽  
Author(s):  
M.A.A. Mohd Salleh ◽  
A.R. Nik Nurhidayatul Suhada ◽  
Flora Somidin ◽  
Rafezi Ahmad Khairel ◽  
C.S. Lee ◽  
...  
Keyword(s):  
Solder Joint ◽  
Room Temperature ◽  
Solder Joints ◽  
Research Work ◽  
Cathode Region ◽  
Lead Free ◽  
Lead Free Solder ◽  
Joint Formation ◽  
Current Stress ◽  
Free Solder

Electromigration effects on the solder joint formation of 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu lead-free solder with Cu electroplated Ni layer wire were investigated. The electromigration effects on the solder joints were studied after current density stressing at 1 x 103 A/cm2 in room temperature for 0 h, 120 h, and 240 h. The research work found that intermetallic compound (IMC) formation on the joint is increases for both solders with longer period of current stress applied. Higher IMC thickness growth in 99.3Sn-0.7Cu solder joint compared to 99.3Sn-0.7Cu is detected and both anode regions of the solder joints show higher IMC thickness growth compared to cathode region. Experimental results show 99.3Sn-0.7Cu solder joint is more prone to failure under current stress compared to 96.5Sn-3.0Ag-0.5Cu solder joint with thicker IMC which translates to higher brittleness.

Solder Joint Formation in Surface Mount Technology—Part II: Design

1990 ◽  
Vol 112 (3) ◽  
pp. 219-222 ◽  
Author(s):  
S. M. Heinrich ◽  
N. J. Nigro ◽  
A. F. Elkouh ◽  
P. S. Lee
Keyword(s):  
Surface Tension ◽  
Solder Joint ◽  
Solder Joints ◽  
Cross Sectional Area ◽  
Surface Mount Technology ◽  
Sectional Area ◽  
Cross Sectional ◽  
Joint Formation ◽  
Surface Mount ◽  
Surface Tension Model

In this paper dimensionless design curves relating fillet height and length to joint cross-sectional area are presented for surface-mount solder joints. Based on an analytical surface tension model, the advantage of these dimensionless curves is that they may be used for arbitrary values of solder density and surface tension. The range of applicability of previously developed approximate formulae for predicting joint dimensions is also investigated. A simple example problem is included to illustrate the use of both the design curves and the approximate formulae.

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