Compensation for image retention in an amorphous silicon detector

1999 ◽  
Author(s):  
Sussan Pourjavid ◽  
Paul R. Granfors
1998 ◽  
Vol 507 ◽  
Author(s):  
J.T. Walton ◽  
M. Amman ◽  
G. Conti ◽  
W.S. Hong ◽  
P.N. Luke ◽  
...  

ABSTRACTApplication of amorphous silicon/crystalline silicon heterojunctions formed by RF sputter deposition and plasma enhanced chemical vapor deposition to the fabrication of nuclear radiation detectors is described. The performance of these heterojunctions as blocking contacts on highresisitivity p-type and n-type single crystal silicon and on lithium-ion compensated silicon (Si(Li)), which are commonly used in silicon detector fabrication, is presented. It is shown that an aluminum/amorphous-silicon contact on Si(Li) x-ray detectors results in about a factor of two reduction in the background counts when compared to a normal gold barrier contact.


1989 ◽  
Vol 149 ◽  
Author(s):  
S. Qureshi ◽  
V. Perez-Mendez ◽  
S. N. Kaplan ◽  
I. Fujieda ◽  
G. Cho

ABSTRACTTransient photoconductivity and ESR measurements were done to relate the ionized dangling bond density and the spin density of thick hydrogenated amorphous silicon (a-Si:H) detectors. We found that only a fraction (∼30–35%) of the total defect density as measured by ESR is ionized when the detector is biased into deep depletion. The measurements on annealed samples also show that this fraction is about 0.3. An explanation based on the shift of the Fermi energy is given. The measurements show that the time dependence of relaxation is a stretched exponential.


1999 ◽  
Vol 557 ◽  
Author(s):  
D. Caputo ◽  
G. De Cesare ◽  
A. Nascetti ◽  
F. Palma ◽  
M. Tucci

AbstractIn this work we demonstrate that radiation up to 2 μm induces photocurrent in a single junction amorphous silicon structure at room temperature. The absorber layer is a microcompensated film deposited using very low concentrations of dopant species. Device operation is based on optical excitation of thermal generated carriers from trap states toward valence and conduction band in the high electric field region of the structure. Transient and frequency response under different bias voltages and illuminations conditions are presented. The possibility to use the infrared sensor in low bit rate communication systems has been demostrated by including our detector in a front-end system and measuring its frequency responce.Quantum efficiency measurement have been reproduced with a numerical model, able to take into account sub-band gap absorption into single films. Model results indicate the presence of a large valence band tail and a high number of dangling bonds and shallow defects ascribed to the presence of dopant atoms.


2002 ◽  
Vol 57 (10) ◽  
pp. 902-907 ◽  
Author(s):  
W.P Hosch ◽  
C Fink ◽  
B Radeleff ◽  
A Kampschulte ◽  
G.W Kauffmann ◽  
...  

Author(s):  
Mauro Menichelli ◽  
Marco Bizzarri ◽  
Maurizio Boscardin ◽  
Mirco Caprai ◽  
Anna Paola Caricato ◽  
...  

Hydrogenated amorphous silicon (a-Si:H) can be produced by plasma-enhanced chemical vapour deposition (PECVD) of SiH4 (Silane) mixed with Hydrogen. The resulting material shows outstanding radiation resistance properties and can be deposited on a wide variety of different substrates. These devices have been used to detect many different kinds of radiation namely: MIPs, x-rays, neutrons and ions as well as low energy protons and alphas. However, MIP detection using planar diodes has always been difficult due to the unsatisfactory S/N ratio arising from a combination of high leakage current, high capacitance and a limited charge collection efficiency (50% at best for a 30 µm planar diode). To overcome these limitations the 3D-SiAm collaboration proposes to use a 3D detector geometry. The use of vertical electrodes allows for a small collection distance to be maintained while conserving a large detector thickness for charge generation. The depletion voltage in this configuration can be kept below 400 V with consequent reduction in the leakage current. In this paper, following a detailed description of the fabrication process, the results of the tests performed on the planar p-i-n structures made with ion implantation of the dopants and with carrier selective contacts will be illustrated.


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