OPDIMA: large-area CCD-based x-ray image sensor for spot imaging and biopsy control in mammography

Author(s):  
Stefan J. Thunberg ◽  
Hartmut Sklebitz ◽  
Bengt Ekdahl ◽  
Lothar Baetz ◽  
Anders Lundin ◽  
...  
Keyword(s):  
1998 ◽  
Author(s):  
Toshio Kameshima ◽  
Noriyuki Kaifu ◽  
Eiichi Takami ◽  
Masakazu Morishita ◽  
Tatsuya Yamazaki

Author(s):  
A. Kemna ◽  
W. Brockherde ◽  
B. Hosticka ◽  
E. Ozkan ◽  
F. Morales-Serrano ◽  
...  
Keyword(s):  

1998 ◽  
Author(s):  
Donald R. Ouimette ◽  
Sol Nudelman ◽  
Richard S. Aikens
Keyword(s):  
X Ray ◽  

2000 ◽  
Author(s):  
Jurgen H. Daniel ◽  
Brent S. Krusor ◽  
Raj B. Apte ◽  
Robert A. Street ◽  
Adela Goredema ◽  
...  

2007 ◽  
Vol 989 ◽  
Author(s):  
Manuela Vieira ◽  
Yuri Vygranenko ◽  
Miguel Fernandes ◽  
Paula Louro ◽  
Pedro Sanguino ◽  
...  

AbstractThis paper investigates a feasibility of using a large area image sensor with an optically addressed readout for medical X-ray diagnostic imaging. A device prototype comprises a multilayer glass/ZnO:Al/p (a-SiC:H)/i (a-Si:H)/ n (a-SiC:H)/ i(a-Si:H)/p (a-SiC:H)/ a SiNx/ITO structure coupled to a scintillator layer. Here, the p-i-n-i-p structure works in both sensing and switching modes depending on the biasing conditions. A numerical simulation is used to optimize the semiconductor layer thicknesses in order to achieve a photocurrent matching between back-to-back diodes in switching mode. The charge carrier transport within the p-i-n-i-p structure is also analyzed under different electric and optical biasing conditions. A physical model supports the results.


2001 ◽  
Vol 19 (4) ◽  
pp. 1219-1223 ◽  
Author(s):  
J. H. Daniel ◽  
B. Krusor ◽  
R. B. Apte ◽  
M. Mulato ◽  
K. Van Schuylenbergh ◽  
...  

2000 ◽  
Vol 657 ◽  
Author(s):  
J.H. Daniel ◽  
B. Krusor ◽  
R. Lau ◽  
J.P. Lu ◽  
Y. Wang ◽  
...  

ABSTRACTMicromachining has potential applications for large area image sensors and displays, but conventional MEMS technology, based on crystalline silicon wafers cannot be used. Instead, large area devices use deposited films on glass substrates. This presents many challenges for MEMS, both as regards materials for micro-machined structures and the integration with large area electronic devices. We are exploring the novel thick photoresist SU-8, as well as plating techniques for the fabrication of large area MEMS. As an example of its application, we have applied this MEMS technology to improve the performance of an amorphous silicon based image sensor array. SU-8 is explored as the structural material for the X-ray conversion screen and as a thick interlayer dielectric for the thin film readout electronics of the imager.


1997 ◽  
Vol 487 ◽  
Author(s):  
R. A. Street ◽  
R. B. Apte ◽  
S. E. Ready ◽  
R. L. Weisfield ◽  
P. Nylen

AbstractLarge area amorphous silicon image sensor arrays are important for x-ray medical imaging and document scanning as well as a variety of other applications where large sensor size is required. The paper first summarizes the present state of the flat panel x-ray imager technology, and compares the two main approaches for x-ray detection. We then describe the performance of a new, large area, high resolution, radiographic imager based on a single amorphous silicon array with 2304×3200 pixels, and an active area of 30×40 cm (12×1 6”).


2014 ◽  
Vol 9 (08) ◽  
pp. P08011-P08011 ◽  
Author(s):  
M S Kim ◽  
D U Kang ◽  
D H Lee ◽  
H Kim ◽  
G Cho ◽  
...  

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