Ellipsometric critical dimension metrology employing mid-infrared wavelengths for high-aspect-ratio channel hole module etch processes

2021 ◽  
Author(s):  
George A. Antonelli ◽  
Nick Keller ◽  
Troy Ribaudo ◽  
Franklin J. Wong ◽  
Wenmei Ming ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Critical Dimension ◽  
Mid Infrared ◽  
Infrared Wavelengths

scholarly journals High-aspect-ratio mushroom-like silica nanopillars immersed in air: epsilon-near-zero metamaterials mediated by a phonon-polaritonic anisotropy

RSC Advances ◽  
2019 ◽  
Vol 9 (29) ◽  
pp. 16431-16438
Author(s):  
Kota Ito ◽  
Yuri Yamada ◽  
Atsushi Miura ◽  
Hideo Iizuka
Keyword(s):  
Block Copolymers ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Self Assembly ◽  
Infrared Range ◽  
Mid Infrared ◽  
Zero Response ◽  
Epsilon Near Zero

High-aspect-ratio mushroom-like silica nanopillars fabricated from self-assembly of block-copolymers exhibit a uniaxial epsilon-near-zero response in the mid-infrared range.

X-ray critical dimension metrology solution for high aspect ratio semiconductor structures

2021 ◽  
Author(s):  
Matthew Wormington ◽  
Adam Ginsburg ◽  
Israel Reichental ◽  
Alex Dikopoltsev ◽  
Alex Krokhmal ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Critical Dimension ◽  
X Ray ◽  
Semiconductor Structures

Nanobridges formed through electron beam image reversal lithography for plasmonic mid-infrared resonators with high aspect ratio nanogaps

2019 ◽  
Vol 30 (42) ◽  
pp. 425302
Author(s):  
Landobasa Y M Tobing ◽  
Aaron D Mueller ◽  
Jinchao Tong ◽  
Dao Hua Zhang
Keyword(s):  
Electron Beam ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Mid Infrared ◽  
Beam Image ◽  
Image Reversal

UV Projection Scanner Performance in Thick Resists for High Aspect Ratio Cu Pillars

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000314-000337
Author(s):  
William Vis ◽  
Fabian Benthaus ◽  
Habib Hichri ◽  
Markus Arendt
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Numerical Aperture ◽  
Critical Dimension ◽  
Superior Performance ◽  
3D Integration ◽  
Full Field ◽  
Aspect Ratios ◽  
Advanced Packaging ◽  
Third Dimension

Integration in the third dimension is becoming increasingly more common in advanced packaging to overcome limitations in Moore's Law. One popular example for 3D Integration is Package-on-Package (PoP), where memory stacks are mounted above the processor. This approach requires tall, high density Cu pillars for interconnection around the processor. Ever increasing I/O requirements creates a need for Cu pillars with smaller critical dimension (CD) in thick resist. This creates high aspect ratio challenges for materials and equipment. For lithography tools, low NA projection systems are fundamentally well-suited to achieve high aspect ratio patterns, due to the inverse relationship between depth-of-focus (DOF) and Numerical Aperture (NA). However, the NA of low NA steppers is not low enough for thick resists. The full-field projection scanner with lower NA provides superior performance than the stepper counterpart at higher throughput and lower cost. This paper presents the high aspect ratio performance of the full-field UV projection scanner tool in various thick resists ranging from 50um to 300um film thickness. Aspect ratios as high as 20:1 are demonstrated for square vias with 1:1 pitch. Further, as feature resolution is only practical with alignment, the alignment of thick resists is also included.

scholarly journals Progress in nanoscale dry processes for fabrication of high-aspect-ratio features: How can we control critical dimension uniformity at the bottom?

2018 ◽  
Vol 57 (6S2) ◽  
pp. 06JA01 ◽  
Author(s):  
Kenji Ishikawa ◽  
Kazuhiro Karahashi ◽  
Tatsuo Ishijima ◽  
Sung Il Cho ◽  
Simon Elliott ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Critical Dimension

scholarly journals High Aspect Ratio Plasmonic Nanotrench Structures with Large Active Surface Area for Label-Free Mid-Infrared Molecular Absorption Sensing

2018 ◽  
Vol 1 (3) ◽  
pp. 1212-1218 ◽  
Author(s):  
Evgeniy Shkondin ◽  
Taavi Repän ◽  
Mohammad Esmail Aryaee Panah ◽  
Andrei V. Lavrinenko ◽  
Osamu Takayama
Keyword(s):  
Aspect Ratio ◽  
Surface Area ◽  
High Aspect Ratio ◽  
Active Surface ◽  
Active Surface Area ◽  
Label Free ◽  
Molecular Absorption ◽  
Mid Infrared

High-Aspect-Ratio Free-Standing Membrane Waveguides for Mid-Infrared Nanophotonics

2021 ◽  
Author(s):  
Marek Vlk ◽  
Anurup Datta ◽  
Sebastian Alberti ◽  
Astrid Aksnes ◽  
Ganapathy Senthil Murugan ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Free Standing ◽  
Mid Infrared
Sign in / Sign up

Export Citation Format

Share Document