Measurability analysis of the HAR structure in 3D memory by T-SAXS simulation

2021 ◽  
Author(s):  
Kaori Sasaki ◽  
Takaki Hashimoto ◽  
Yenting Kuo ◽  
Hiroshi Tsukada ◽  
Hiroyuki Tanizaki
Keyword(s):  
Measurability Analysis ◽  
3D Memory

Advances in 3D Memory and Logic Devices

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 000502-000538 ◽  
Author(s):  
Robert Patti
Keyword(s):  
3D Integration ◽  
Logic Devices ◽  
3D Memory

Tezzaron is continuing to push the level of 3D integration. The latest results of a new 1-4Gb 3D DRAM will be presented along with the plans (and possibly some results) of further integration with other 3D host logic devices. Additionally, results from several other recent 3D integrations will be reviewed.

RET for the wiring layer of a 3D memory

2006 ◽  
Author(s):  
Yung-Tin Chen ◽  
Paul Poon ◽  
Chris Petti ◽  
Vishnu Kamat ◽  
Apo Sezginer ◽  
...  
Keyword(s):  
3D Memory

3D memory matrix based on a composite memristor-diode crossbar for a neuromorphic processor

2018 ◽  
Vol 198 ◽  
pp. 1-7 ◽  
Author(s):  
Alexander Pisarev ◽  
Alexander Busygin ◽  
Sergey Udovichenko ◽  
Oleg Maevsky
Keyword(s):  
3D Memory

Status of 3D memory storage materials

1993 ◽  
Author(s):  
Gajendra D. Savant ◽  
Tomasz P. Jannson ◽  
Winston Ho
Keyword(s):  
Memory Storage ◽  
Storage Materials ◽  
3D Memory

Refinement of measurability analysis of the linearized gravitational field

1974 ◽  
Vol 5 (6) ◽  
pp. 749-755 ◽  
Author(s):  
Aileen M. McLoughlin ◽  
Gerrit J. Smith
Keyword(s):  
Gravitational Field ◽  
Measurability Analysis
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