Industrial-grade custom tool for ultrafast laser microwelding of dissimilar materials (glass to metal)

Author(s):  
Dimitris Karnakis ◽  
Etienne Pelletier ◽  
Daniel Arnaldo del Cerro ◽  
Riccardo Geremia ◽  
David Grant
2007 ◽  
Vol 18 (12) ◽  
pp. 46 ◽  
Author(s):  
Takayuki Tamaki ◽  
Wataru Watanabe ◽  
Kazuyoshi Itoh

Sensors ◽  
2019 ◽  
Vol 19 (8) ◽  
pp. 1801 ◽  
Author(s):  
Sungil Kim ◽  
Jaesoon Park ◽  
Sangkyun So ◽  
Sanghoon Ahn ◽  
Jiyeon Choi ◽  
...  

We propose a new packaging process for an implantable blood pressure sensor using ultrafast laser micro-welding. The sensor is a membrane type, passive device that uses the change in the capacitance caused by the membrane deformation due to applied pressure. Components of the sensor such as inductors and capacitors were fabricated on two glass (quartz) wafers and the two wafers were bonded into a single package. Conventional bonding methods such as adhesive bonding, thermal bonding, and anodic bonding require considerable effort and cost. Therefore CO2 laser cutting was used due to its fast and easy operation providing melting and bonding of the interface at the same time. However, a severe heat process leading to a large temperature gradient by rapid heating and quenching at the interface causes microcracks in brittle glass and results in low durability and production yield. In this paper, we introduce an ultrafast laser process for glass bonding because it can optimize the heat accumulation inside the glass by a short pulse width within a few picoseconds and a high pulse repetition rate. As a result, the ultrafast laser welding provides microscale bonding for glass pressure sensor packaging. The packaging process was performed with a minimized welding seam width of 100 μm with a minute. The minimized welding seam allows a drastic reduction of the sensor size, which is a significant benefit for implantable sensors. The fabricated pressure sensor was operated with resonance frequencies corresponding to applied pressures and there was no air leakage through the welded interface. In addition, in vitro cytotoxicity tests with the sensor showed that there was no elution of inner components and the ultrafast laser packaged sensor is non-toxic. The ultrafast laser welding provides a fast and robust glass chip packaging, which has advantages in hermeticity, bio-compatibility, and cost-effectiveness in the manufacturing of compact implantable sensors.


Nanophotonics ◽  
2020 ◽  
Vol 0 (0) ◽  
Author(s):  
Razvan Stoian ◽  
Jean-Philippe Colombier

AbstractLaser processing implies the generation of a material function defined by the shape and the size of the induced structures, being a collective effect of topography, morphology, and structural arrangement. A fundamental dimensional limit in laser processing is set by optical diffraction. Many material functions are yet defined at the micron scale, and laser microprocessing has become a mainstream development trend. Consequently, laser microscale applications have evolved significantly and developed into an industrial grade technology. New opportunities will nevertheless emerge from accessing the nanoscale. Advances in ultrafast laser processing technologies can enable unprecedented resolutions and processed feature sizes, with the prospect to bypass optical and thermal limits. We will review here the mechanisms of laser processing on extreme scales and the optical and material concepts allowing us to confine the energy beyond the optical limits. We will discuss direct focusing approaches, where the use of nonlinear and near-field effects has demonstrated strong capabilities for light confinement. We will argue that the control of material hydrodynamic response is the key to achieve ultimate resolution in laser processing. A specific structuring process couples both optical and material effects, the process of self-organization. We will discuss the newest results in surface and volume self-organization, indicating the dynamic interplay between light and matter evolution. Micron-sized and nanosized features can be combined into novel architectures and arrangements. We equally underline a new dimensional domain in processing accessible now using laser radiation, the sub-100-nm feature size. Potential application fields will be indicated as the structuring sizes approach the effective mean free path of transport phenomena.


Author(s):  
Dongkyun Lee ◽  
Elijah Kannatey-Asibu

Ultrafast lasers of subpicosecond pulse duration have the potential for laser microwelding of micronscale fusion zone. Due to the extremely short pulse duration, laser-metal interaction involving ultrafast laser pulses should be analyzed using the two-temperature model. In this study, the two-temperature model is analyzed using ABAQUS to study the feasibility of laser microwelding with ultrafast laser. A material model is constructed using material properties and the subsurface boiling model. The model is validated using experimental results from the literature. Laser processing parameters of repetition rate, pulse duration, and focal radius are then investigated, in terms of molten pool generated in the material and requirements on those parameters for laser microwelding using ultrafast lasers are discussed.


Author(s):  
Duncan P Hand ◽  
Richard M Carter ◽  
Robert R Thomson ◽  
M J Daniel Esser ◽  
Michael Troughton ◽  
...  

2017 ◽  
Vol 56 (16) ◽  
pp. 4873 ◽  
Author(s):  
Richard M. Carter ◽  
Michael Troughton ◽  
Jianyong Chen ◽  
Ian Elder ◽  
Robert R. Thomson ◽  
...  

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