scholarly journals Characteristics of an Implantable Blood Pressure Sensor Packaged by Ultrafast Laser Microwelding

Sensors ◽  
2019 ◽  
Vol 19 (8) ◽  
pp. 1801 ◽  
Author(s):  
Sungil Kim ◽  
Jaesoon Park ◽  
Sangkyun So ◽  
Sanghoon Ahn ◽  
Jiyeon Choi ◽  
...  
Keyword(s):  
Blood Pressure ◽  
Laser Welding ◽  
Pressure Sensor ◽  
Ultrafast Laser ◽  
Large Temperature ◽  
Implantable Sensors ◽  
Welding Seam ◽  
Packaging Process ◽  
Resonance Frequencies ◽  
Laser Microwelding

We propose a new packaging process for an implantable blood pressure sensor using ultrafast laser micro-welding. The sensor is a membrane type, passive device that uses the change in the capacitance caused by the membrane deformation due to applied pressure. Components of the sensor such as inductors and capacitors were fabricated on two glass (quartz) wafers and the two wafers were bonded into a single package. Conventional bonding methods such as adhesive bonding, thermal bonding, and anodic bonding require considerable effort and cost. Therefore CO2 laser cutting was used due to its fast and easy operation providing melting and bonding of the interface at the same time. However, a severe heat process leading to a large temperature gradient by rapid heating and quenching at the interface causes microcracks in brittle glass and results in low durability and production yield. In this paper, we introduce an ultrafast laser process for glass bonding because it can optimize the heat accumulation inside the glass by a short pulse width within a few picoseconds and a high pulse repetition rate. As a result, the ultrafast laser welding provides microscale bonding for glass pressure sensor packaging. The packaging process was performed with a minimized welding seam width of 100 μm with a minute. The minimized welding seam allows a drastic reduction of the sensor size, which is a significant benefit for implantable sensors. The fabricated pressure sensor was operated with resonance frequencies corresponding to applied pressures and there was no air leakage through the welded interface. In addition, in vitro cytotoxicity tests with the sensor showed that there was no elution of inner components and the ultrafast laser packaged sensor is non-toxic. The ultrafast laser welding provides a fast and robust glass chip packaging, which has advantages in hermeticity, bio-compatibility, and cost-effectiveness in the manufacturing of compact implantable sensors.

Investigations of Thermal Stresses and Deformations in Laser Microwelding Processes

Manufacturing ◽  
2003 ◽  
Author(s):  
Wei Han ◽  
Ryszard J. Pryputniewicz
Keyword(s):  
Laser Welding ◽  
Heat Affected Zone ◽  
Computational Models ◽  
Thermal Stresses ◽  
Contact Process ◽  
High Stress ◽  
Weld Strength ◽  
Large Temperature ◽  
Machining Processes ◽  
Laser Microwelding

Laser microwelding has become a significant industrial process, because there are many outstanding advantages in using laser welding as the bonding method over other widely used bonding technologies. As an alternative to the common adhesives or solders used for the joining process, laser welding offers a number of attractive features such as high weld strength to weld size ratio, reliability, and a minimal heat-affected zone (HAZ). These provide the benefits of low heat distortion, a non-contact process, repeatability, and ability to automate. Therefore, the applications of laser microwelding have been broadened, especially in the microelectronic and packaging industry, in recent past decades. Quality of the laser microwelding, however, depends on a number of parameters such as the characteristics of the laser beam, environmental conditions, and properties of the workpiece. Furthermore, the large temperature gradients occur during laser microwelding process leads to a high stress level, and might result in many undesirable phenomena such as the high level of residual stresses in the vicinity of the heat-affected zone (HAZ) that adversely affect the life time of the component. Numerous studies have been performed on the evaluation and prediction of the thermal stresses in laser microwelding process. However, it is very difficult to measure the thermal stresses, and to predict the magnitude and direction of thermal stress/deformation. Therefore, we develop an optical methodology, based on opto-electronic holography (OEH) technique, to measure and evaluate the thermal stresses/deformations non-destructively. In this paper, the system of OEH measurement of the thermal deformation of the laser welds will be described in details, and representative results will be included. In addition, analytical and computational models will also be developed to simulate the temperature field and thermal stresses/deformations in laser microwelding. Continued work will lead to novel measurement system for monitoring the thermal stresses/deformations during the process of laser microwelding, which will help optimizing efficient and effective laser micro-machining processes for applications in microelectronics and packaging.

scholarly journals Development of Implantable Blood Pressure Sensor Using Quartz Wafer Direct Bonding and Ultrafast Laser Cutting

2016 ◽  
Vol 37 (5) ◽  
pp. 168-177 ◽  
Author(s):  
Sung-Il Kim ◽  
Eung-Bo Kim ◽  
Sang-kyun So ◽  
Jiyeon Choi ◽  
Yeun-Ho Joung
Keyword(s):  
Blood Pressure ◽  
Pressure Sensor ◽  
Laser Cutting ◽  
Ultrafast Laser ◽  
Quartz Wafer ◽  
Wafer Direct Bonding

scholarly journals Ultrafast Laser Welding: Taming Ultrafast Laser Filaments for Optimized Semiconductor–Metal Welding (Laser Photonics Rev. 15(2)/2021)

2021 ◽  
Vol 15 (2) ◽  
pp. 2170014
Author(s):  
Maxime Chambonneau ◽  
Qingfeng Li ◽  
Vladimir Yu. Fedorov ◽  
Markus Blothe ◽  
Kay Schaarschmidt ◽  
...  
Keyword(s):  
Laser Welding ◽  
Ultrafast Laser ◽  
Metal Welding

Cantilever arrayed blood pressure sensor for arterial applanation tonometry

2014 ◽  
Vol 8 (1) ◽  
pp. 37-43 ◽  
Author(s):  
Byeungleul Lee ◽  
Jinwoo Jeong ◽  
Jinseok Kim ◽  
Bonghwan Kim ◽  
Kukjin Chun
Keyword(s):  
Blood Pressure ◽  
Pressure Sensor ◽  
Applanation Tonometry

Implantable blood pressure sensor for analyzing elasticity in arteries

2009 ◽  
Author(s):  
Marco Franco-Ayala ◽  
Fernando Martínez-Piñón ◽  
Alfredo Reyes-Barranca ◽  
Salvador Sánchez de la Peña ◽  
José A. Álvarez-Chavez
Keyword(s):  
Blood Pressure ◽  
Pressure Sensor

A Low-Range Drift-Free Bio-compatible Pressure Sensor Based on P(VDF-TrFE) Piezoelectric Thin Film

2009 ◽  
Vol 1222 ◽  
Author(s):  
Xiaoyang Li ◽  
Timothy Reissman ◽  
Fan Yu ◽  
Edwin C. Kan
Keyword(s):  
Thin Film ◽  
Blood Pressure ◽  
Pressure Sensor ◽  
Equivalent Circuit Model ◽  
Swelling Pressure ◽  
Pressure Monitoring ◽  
Sensing Element ◽  
Piezoelectric Resonance ◽  
Piezoelectric Thin Film

AbstractA low-range pressure sensor (0-100kPa) based on the P(VDF-TrFE) piezoelectric thin film is proposed, where the long-term drift is eliminated by operating near the piezoelectric resonance. The pressure sensor is designed for blood pressure and tissue swelling pressure monitoring. The poled 50μm±1μm P(VDF-TrFE) copolymer film is used as the sensing element, with all fabrication and assembly materials biocompatible. A modified Butterworth-Van Dyke (BVD) [1] equivalent circuit model is used to characterize the sensor behavior. The pressure sensor exhibits negligible drift in weeks of operation. The device shows a sensitivity of 0.038MHz/kPa resonance frequency shift under stress, which leads to a maximum readout change of 1.1%/kPa in the present setup.

Long-Term Validation of a Blood Pressure Sensor at the Chest

2013 ◽  
Author(s):  
J Solà ◽  
M Proença ◽  
A Falhi ◽  
D Ferrario ◽  
O Grossenbacher ◽  
...  
Keyword(s):  
Blood Pressure ◽  
Pressure Sensor
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