UV absorption mapping as subsurface damage inspection in transparent optical materials

2020 ◽  
Author(s):  
Heidi Cattaneo ◽  
Roelene Botha ◽  
Carsten Ziolek
Keyword(s):  
Optical Materials ◽  
Subsurface Damage ◽  
Uv Absorption

Subsurface damage in some single crystalline optical materials

2005 ◽  
Vol 44 (12) ◽  
pp. 2241 ◽  
Author(s):  
Joseph A. Randi ◽  
John C. Lambropoulos ◽  
Stephen D. Jacobs
Keyword(s):  
Optical Materials ◽  
Subsurface Damage ◽  
Single Crystalline

Analysis on the Effects of Grinding Wheel Speed on Removal Behavior of Brittle Optical Materials

2016 ◽  
Author(s):  
Ping Li ◽  
Tan Jin ◽  
Zongfu Guo ◽  
Jun Yi ◽  
Meina Qu
Keyword(s):  
Surface Quality ◽  
Material Removal ◽  
Optical Materials ◽  
Chip Thickness ◽  
Ground Surface ◽  
Subsurface Damage ◽  
Wheel Speed ◽  
Grinding Wheel ◽  
Undeformed Chip Thickness ◽  
Grinding Processes

It is often desired to increase the machining rate while maintaining the desired surface and subsurface integrity during fabricating high-quality optical glass components. This paper proposed a high-speed high-efficiency low-damage grinding technology for machining brittle optical materials, which consists of three grinding processes: rough grinding, semi-finishing grinding and finishing grinding. Grinding characteristics is investigated with respect to grinding forces, specific cutting energy, surface roughness, ground surface quality, subsurface damage, and material removal mechanisms in grinding of fused silica optical glasses with this technology at the grinding speeds of up to 150 m/s. These indications are thoroughly discussed by contacting the undeformed chip thickness. The results indicate that the level of these indications are significantly improved with an increase in the wheel speed due to the decrease of the undeformed chip thickness. It is also found that the improvement of ground surface quality is limited when the wheel speed from 120 m/s increases to 150 m/s may be due to the influence of vibration caused by the higher wheel speed. For different grinding processes, these results are also substantially improved with the change of grinding conditions. It is found that the material removal mechanism is dominated by brittle fracture at rough and semi-finishing grinding processes, while ductile flow mode can be observed at the finishing grinding process. There are some differences between the experimental results and the previous predicted model of subsurface damage depth.

scholarly journals MRF applications: measurement of process-dependent subsurface damage in optical materials using the MRF wedge technique

2005 ◽  
Author(s):  
Joseph A. Menapace ◽  
Pete J. Davis ◽  
William A. Steele ◽  
Lana L. Wong ◽  
Tayyab I. Suratwala ◽  
...  
Keyword(s):  
Optical Materials ◽  
Subsurface Damage ◽  
Wedge Technique

Analysis on the Effects of Grinding Wheel Speed on Removal Behavior of Brittle Optical Materials

2016 ◽  
Vol 139 (3) ◽  
Author(s):  
Ping Li ◽  
Tan Jin ◽  
Zongfu Guo ◽  
Jun Yi ◽  
Meina Qu
Keyword(s):  
Surface Quality ◽  
Material Removal ◽  
Optical Materials ◽  
Chip Thickness ◽  
Ground Surface ◽  
Subsurface Damage ◽  
Wheel Speed ◽  
Grinding Wheel ◽  
Undeformed Chip Thickness ◽  
Grinding Processes

It is often desired to increase the machining rate while maintaining the desired surface and subsurface integrity during fabricating high-quality optical glass components. This paper proposed a high-speed high-efficiency low-damage grinding technology for machining brittle optical materials, which consists of three grinding processes: rough grinding, semifinishing grinding, and finishing grinding. Grinding characteristics are investigated with respect to grinding forces, specific cutting energy, surface roughness, ground surface quality, subsurface damage, and material removal mechanisms in grinding of fused silica optical glasses with this technology at grinding speeds of up to 150 m/s. These indications are thoroughly discussed by contacting the undeformed chip thickness. The results indicate that the level of these indications is significantly improved with an increase in the wheel speed due to the decrease of the undeformed chip thickness. It is also found that the improvement of ground surface quality is limited when the wheel speed increases from 120 m/s to 150 m/s, which may be due to the influence of vibration caused by the higher wheel speed. For different grinding processes, these results are also substantially improved with the change of grinding conditions. It is found that the material removal mechanism is dominated by brittle fracture at rough and semifinishing grinding processes, while ductile flow mode can be observed at the finishing grinding process. There are some differences between the experimental results and the previous predicted model of subsurface damage depth.

Prediction of grinding induced subsurface damage of optical materials

2013 ◽  
Vol 21 (3) ◽  
pp. 680-686 ◽  
Author(s):  
吕东喜 L Dong-xi ◽  
王洪祥 WANG Hong-xiang ◽  
黄燕华 HUANG Yan-hua
Keyword(s):  
Optical Materials ◽  
Subsurface Damage
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