Quality control optical characterization of NIR VCSEL based light sources for 3D imaging applications

83‐4: High Resolution Optical Characterization of NIR Light Sources for 3D Imaging

SID Symposium Digest of Technical Papers ◽

10.1002/sdtp.13149 ◽

2019 ◽

Vol 50 (1) ◽

pp. 1210-1213

Author(s):

Pierre Boher ◽

Thierry Leroux

Keyword(s):

High Resolution ◽

3D Imaging ◽

Optical Characterization ◽

Light Sources ◽

Nir Light

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Source–Detector Spectral Pairing-Related Inaccuracies in Pulse Oximetry: Evaluation of the Wavelength Shift

Sensors ◽

10.3390/s20113302 ◽

2020 ◽

Vol 20 (11) ◽

pp. 3302

Author(s):

Olivier Tsiakaka ◽

Benoit Gosselin ◽

Sylvain Feruglio

Keyword(s):

Oxygen Saturation ◽

Pulse Oximetry ◽

Optical Characterization ◽

Absolute Error ◽

Wavelength Shift ◽

Light Sources ◽

Performance Requirements ◽

Processing Power ◽

Key Features

Pulse oximetry enables oxygen saturation estimation ( S p O 2) non-invasively in real time with few components and modest processing power. With the advent of affordable development kits dedicated to the monitoring of biosignals, capabilities once reserved to hospitals and high-end research laboratories are becoming accessible for rapid prototyping. While one may think that medical-grade equipment differs greatly in quality, surprisingly, we found that the performance requirements are not widely different from available consumer-grade components, especially regarding the photodetection module in pulse oximetry. This study investigates how the use of candidate light sources and photodetectors for the development of a custom S p O 2 monitoring system can lead to inaccuracies when using the standard computational model for oxygen saturation without calibration. Following the optical characterization of selected light sources, we compare the extracted parameters to the key features in their respective datasheet. We then quantify the wavelength shift caused by spectral pairing of light sources in association with photodetectors. Finally, using the widely used approximation, we report the resulting absolute error in S p O 2 estimation and show that it can lead up to 8% of the critical 90–100% saturation window.

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Design of an inexpensive integrating sphere student laboratory setup for the optical characterization of light sources

European Journal of Physics ◽

10.1088/0143-0807/37/1/015302 ◽

2015 ◽

Vol 37 (1) ◽

pp. 015302

Author(s):

Frédéric B Leloup ◽

Sven Leyre ◽

Eva Bauwens ◽

Toon Van den Abeele ◽

Peter Hanselaer

Keyword(s):

Optical Characterization ◽

Integrating Sphere ◽

Light Sources ◽

Laboratory Setup ◽

Student Laboratory

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Optical Characterization of Different Thin Film Module Technologies

International Journal of Photoenergy ◽

10.1155/2015/159458 ◽

2015 ◽

Vol 2015 ◽

pp. 1-12 ◽

Cited By ~ 9

Author(s):

R. Ebner ◽

B. Kubicek ◽

G. Újvári ◽

S. Novalin ◽

M. Rennhofer ◽

...

Keyword(s):

Thin Film ◽

Quality Control ◽

Optical Measurement ◽

Optical Characterization ◽

Two Dimensional ◽

Dimensional Distribution ◽

High Resolution Images ◽

Characteristic Features ◽

Power Measurements

For a complete quality control of different thin film module technologies (a-Si, CdTe, and CIS) a combination of fast and nondestructive methods was investigated. Camera-based measurements, such as electroluminescence (EL), photoluminescence (PL), and infrared (IR) technologies, offer excellent possibilities for determining production failures or defects in solar modules which cannot be detected by means of standard power measurements. These types of optical measurement provide high resolution images with a two-dimensional distribution of the characteristic features of PV modules. This paper focuses on quality control and characterization using EL, PL, and IR imaging with conventional cameras and an alternative excitation source for the PL-setup.

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Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2008p0121 ◽

2008 ◽

Author(s):

Nicholas Randall ◽

Rahul Premachandran Nair

Keyword(s):

Mechanical Properties ◽

Quality Control ◽

Integrated Circuits ◽

Integrated Circuit ◽

Manufacturing Process ◽

Solder Bumps ◽

Initial Work ◽

Circuit Components ◽

Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

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