Metal insulator semiconductor structure single crystal silicon liquid crystal light valve

1996 ◽  
Author(s):  
JiaoBo Gao ◽  
Ke-fei Ye ◽  
Yue-you Feng
2000 ◽  
Author(s):  
JiaoBo Gao ◽  
Ke-fei Ye ◽  
Jun Wang ◽  
HuiLing Chen ◽  
Peng Jiang ◽  
...  

1989 ◽  
Vol 28 (22) ◽  
pp. 4748 ◽  
Author(s):  
Keyvan Sayyah ◽  
Murray S. Welkowsky ◽  
Philip G. Reif ◽  
Norman W. Goodwin

2005 ◽  
Author(s):  
A. D. Remenyuk ◽  
E. V. Astrova ◽  
R. F. Vitman ◽  
T. S. Perova ◽  
V. A. Tolmachev

2006 ◽  
Vol 48 (2) ◽  
pp. 384-391
Author(s):  
A. D. Remenyuk ◽  
E. V. Astrova ◽  
R. F. Vitman ◽  
T. S. Perova ◽  
V. A. Tolmachev ◽  
...  

Author(s):  
N. Lewis ◽  
E. L. Hall ◽  
A. Mogro-Campero ◽  
R. P. Love

The formation of buried oxide structures in single crystal silicon by high-dose oxygen ion implantation has received considerable attention recently for applications in advanced electronic device fabrication. This process is performed in a vacuum, and under the proper implantation conditions results in a silicon-on-insulator (SOI) structure with a top single crystal silicon layer on an amorphous silicon dioxide layer. The top Si layer has the same orientation as the silicon substrate. The quality of the outermost portion of the Si top layer is important in device fabrication since it either can be used directly to build devices, or epitaxial Si may be grown on this layer. Therefore, careful characterization of the results of the ion implantation process is essential.


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