SAS: a yield/failure analysis software tool

1996 ◽  
Author(s):  
Susana de Jong Perez
2008 ◽  
Vol 5 (4) ◽  
pp. 319-322 ◽  
Author(s):  
Sung Kyu Park ◽  
John D Venable ◽  
Tao Xu ◽  
John R Yates

2012 ◽  
Vol 63 (8) ◽  
pp. 1609-1630 ◽  
Author(s):  
M.J. Cobo ◽  
A.G. López-Herrera ◽  
E. Herrera-Viedma ◽  
F. Herrera

2019 ◽  
Author(s):  
Lauren Marazzi ◽  
Andrew Gainer-Dewar ◽  
Paola Vera-Licona

AbstractSummaryOCSANA+ is a Cytoscape app for identifying nodes to drive the system towards a desired long-term behavior, prioritizing combinations of interventions in large scale complex networks, and estimating the effects of node perturbations in signaling networks, all based on the analysis of the network’s structure. OCSANA+ includes an update to OCSANA (optimal combinations of interventions from network analysis) software tool with cutting-edge and rigorously tested algorithms, together with recently-developed structure-based control algorithms for non-linear systems and an algorithm for estimating signal flow. All these algorithms are based on the network’s topology. OCSANA+ is implemented as a Cytoscape app to enable a user interface for running analyses and visualizing results.Availability and ImplementationOCSANA+ app and its tutorial can be downloaded from the Cytoscape App Store or https://veraliconaresearchgroup.github.io/OCSANA-Plus/. The source code and computations are available in https://github.com/VeraLiconaResearchGroup/OCSANA-Plus_SourceCode.


Author(s):  
M. Herna´ndez-Mora ◽  
J. E. Gonza´lez ◽  
M. Ve´lez-Reyes ◽  
J. M. Orti´z ◽  
Y. Pang ◽  
...  

This paper presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of Integrated Power Electronics Modules (IPEM). This model is based on the expanded Lumped Thermal Capacitance Method (LTCM), in which the number of variables involved in the analysis of heat transfer is reduced to only time. Applying this procedure a simple, non-spatial, but highly non-linear model is obtained. Steady and transient results of the model are validated against results from a thermal analysis software tool, FLOTHERM 3.1™. A comparison between thermal results obtained with the reduced model and experimental data is presented indicating a need for incorporating the dynamic electrical performance in the reduced model. The development of this model presents an alternative to reduce the complexity level developed in commercial multidimensional and transient software for power electronics applications.


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