Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM): Part I — Thermal Analysis

2003 ◽  
Author(s):  
M. Herna´ndez-Mora ◽  
J. E. Gonza´lez ◽  
M. Ve´lez-Reyes ◽  
J. M. Orti´z ◽  
Y. Pang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Power Electronics ◽  
Software Tool ◽  
Electrical Performance ◽  
Reduced Model ◽  
Analysis Software ◽  
Thermal Capacitance ◽  
Capacitance Method ◽  
Numerical Formulation

This paper presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of Integrated Power Electronics Modules (IPEM). This model is based on the expanded Lumped Thermal Capacitance Method (LTCM), in which the number of variables involved in the analysis of heat transfer is reduced to only time. Applying this procedure a simple, non-spatial, but highly non-linear model is obtained. Steady and transient results of the model are validated against results from a thermal analysis software tool, FLOTHERM 3.1™. A comparison between thermal results obtained with the reduced model and experimental data is presented indicating a need for incorporating the dynamic electrical performance in the reduced model. The development of this model presents an alternative to reduce the complexity level developed in commercial multidimensional and transient software for power electronics applications.

Comparative Study on Heat Transfer Characteristics of Three Kinds of Micro-Groove HEAT Pipes

2013 ◽  
Vol 313-314 ◽  
pp. 1034-1037
Author(s):  
Yi Bing Liu
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Focal Point ◽  
Heat Pipes ◽  
Analysis Software ◽  
Heat Transfer Characteristics ◽  
Excellent Performance ◽  
Point Temperature ◽  
Plate Heat ◽  
Trapezoidal Plate

In this paper, a simulation of three kinds of micro-groove plate heat pipes--- rectangular; trapezoidal and triangular, is conducted by thermal analysis software ANSYS. Through comparing with the focal point temperature value of the surfaces of micro-groove plate heat pipes, respectively being 30W; 40W; 50W, the result is obtained that trapezoidal plate heat piper has more excellent performance.

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

2004 ◽  
Vol 126 (4) ◽  
pp. 477-490 ◽  
Author(s):  
M. Herna´ndez-Mora ◽  
J. E. Gonza´lez ◽  
M. Ve´lez-Reyes ◽  
J. M. Ortiz-Rodrı´guez ◽  
Y. Pang ◽  
...  
Keyword(s):  
Power Electronics ◽  
Thermal Model ◽  
High Speed ◽  
Three Dimensional ◽  
Thermal Response ◽  
Software Tool ◽  
Computational Time ◽  
Highly Nonlinear ◽  
Numerical Formulation ◽  
Good Agreement

Background: This paper presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of an integrated power electronics module (IPEM). This model is based on the expanded lumped thermal capacitance method (LTCM), in which the number of variables involved in the analysis of heat transfer is reduced only to time. Method of Approach: By applying the LTCM, a simple, nonspatial, but highly nonlinear model is obtained for the case of the IPEM Generation II. Steady and transient results of the model are validated against results from a three-dimensional, transient thermal analysis software tool, FLOTHERM™ 3.1. The electrothermal coupling was obtained by implementing the reduced-order thermal model into the SABER™ circuit simulator. Two experimental setups, for low- and high-speed thermal responses, were developed and used to calibrate the reduced model with actual data. Results: The comparison of the LTCM model implemented in a Generation II IPEM with FLOTHERM 3.1 results compared very favorably in terms of accuracy and efficiency, reducing the computational time significantly. Additional validations of the reduced thermal model were made using experiment data for the low-speed thermal response at different constant powers, and good agreement was demonstrated in all cases. A comparison between SABER™ simulations, which incorporated the proposed LTCM, and the fast thermal experimental response results is also presented to validate the dynamic electrothermal model response, and excellent agreement was found for this case. Conclusions: The good agreement found for all three cases presented, the three-dimensional, transient numerical formulation, and the low- and high-speed experimental data indicates that reduced electrothermal models are an excellent alterative for design methodologies of new generations of IPEMs.

Experimental Characterization of Heat Transfer and Thermal Energy Storage Capability Using Swirling Two-Phase Flow in the Package Integrated Cyclone COoler (PICCO)

2020 ◽  
Author(s):  
Peter deBock ◽  
Rinaldo Miorini ◽  
Cathleen Hoel ◽  
Darin Sharar ◽  
Bryan Whalen
Keyword(s):  
Heat Transfer ◽  
Energy Storage ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Thermal Performance ◽  
Thermal Energy ◽  
Thermal Energy Storage ◽  
Two Phase ◽  
Thermal Capacitance

Abstract The increasing demand for high power density wide-bandgap power electronics has propelled heat transfer research leading to a constant increase in the thermal performance of cold plates and heat sinks. Most of this research has focused on reducing thermal resistance of the package which can have a detrimental effect on transient thermal performance if thermal capacitance is reduced. In order to provide both a low thermal resistance and a higher thermal capacitance integrated into the package and near the thermal junction, a new cold plate called the Package Integrated Cyclone COoler (PICCO) was developed. GE Research and the US Army Research Lab collaborated to explore and validate the potential of this concept. The PICCO coldplate, which is enabled by 3D printing, establishes a swirling coolant flow field to remove heat. The swirling flow is anticipated to significantly aid in vapor removal from the surface and hence allow for the fluid to provide thermal capacitance through two-phase heat transfer efficiently. This paper describes the experiment design and development for thermal storage and cooling performance characterization of PICCO. The test rig includes a high-pressure capability gear pump moving fluid first through a Coriolis flowmeter and then through PICCO, where the fluid is accelerated in the cyclone and heated by miniaturized ceramic heaters, simulating SiC power electronics. The coolant releases the accumulated enthalpy to a plate-fin heat exchanger that is connected to a chiller. Several absolute and differential pressure transducers and thermocouples monitor the state of FC-72. The experiments will provide empirical transfer functions characterizing the PICCO pressure drop, heat transfer coefficient, critical heat flux and thermal energy storage capability.

scholarly journals Easy Trends to Analyse Structural Profiles: Lumped Capacitance Vs Simplified Equation

2020 ◽  
Vol 10 (5) ◽  
pp. 625-629
Author(s):  
Pedro N. Oliveira ◽  
Elza M.M. Fonseca ◽  
Raul D.S.G. Campilho
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Cross Sections ◽  
Time Instant ◽  
Heat Transfer Process ◽  
Uniform Value ◽  
Temperature Calculation ◽  
Capacitance Method ◽  
Eurocode 3 ◽  
Section Surface

This work presents the calculation of the temperature in different cross-sections of structural profiles (IPE, HEM, L and UAP) using the lumped capacitance method and the simplified equation from Eurocode 3 part 1-2. The lumped capacitance method allows the temperature calculation of the solid body at any time instant during the heat transient process, as a constant and uniform value. The simplified equation from Eurocode 3 part 1-2 is a simple model for heat transfer based on the uniformly distributed temperature over the cross-section surface and directly proportional to section factor of the element. Steel profiles have as almost thermal behaviour uniform during the heat transfer process when submitted to fire conditions and the lumped capacitance method allows a great simplification to estimate the temperature field in the element and may be used when Biot number is lower than unity. Therefore, thermal analysis of solids with high thermal conductivity using this method is adequate. For the studied steel profiles, a thermal analysis was also performed using the simplified equation from the Eurocode 3 part 1-2 in order to validate the obtained results from the lumped capacitance method. The results from both methods are presented for discussion and analysis.

Thermal Analysis of Railroad Bearings: Effect of Wheel Heating

2009 ◽  
Author(s):  
Constantine M. Tarawneh ◽  
Arturo A. Fuentes ◽  
Brent M. Wilson ◽  
Kevin D. Cole ◽  
Lariza Navarro
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Roller Bearing ◽  
Railroad Wheel ◽  
Fe Model ◽  
Wheel Pair ◽  
Tapered Roller Bearing ◽  
Excessive Heat ◽  
Tapered Roller ◽  
Railroad Bearings

Catastrophic bearing failure is a major concern for the railroad industry because it can lead to costly train stoppages and even derailments. Excessive heat buildup within the bearing is one of the main factors that can warn of impending failure. A question is often raised regarding the transfer of heat from a wheel during braking and whether this can lead to false setouts. Therefore, this work was motivated by the need to understand and quantify the heat transfer paths to the tapered roller bearing within the railroad wheel assembly when wheel heating occurs. A series of experiments and finite element (FE) analyses were conducted in order to identify the different heat transfer mechanisms, with emphasis on radiation. The experimental setup consisted of a train axle with two wheels and bearings pressed onto their respective journals. One of the wheels was heated using an electric tape placed around the outside of the rim. A total of 32 thermocouples scattered throughout the heated wheel, the axle, and the bearing circumference measured the temperature distribution within the assembly. In order to quantify the heat radiated to the bearing, a second set of experiments was developed; these included, in addition to the axle and the wheel pair, a parabolic reflector that blocked body-to-body radiation to the bearing. The appropriate boundary conditions including ambient temperature, emissivity, and convection coefficient estimates were measured or calculated from the aforementioned experiments. The FE thermal analysis of the wheel assembly was performed using the ALGOR™ software. Experimental temperature data along the radius of the heated wheel, the bearing circumference, and at selected locations on the axle were compared to the results of the FE model to verify its accuracy. The results indicate that the effect of thermal radiation from a hot wheel on the cup temperature of the adjacent bearing is minimal when the wheel tread temperature is at 135°C (275°F), and does not exceed 17°C (31°F) when the wheel tread is at 315°C (600°F).

Optimum Design of Inductors Used for Wireless Power Transmission Micro-Module

2004 ◽  
Author(s):  
Chao-Liang Chang ◽  
Uei-Ming Jow ◽  
Chao-Ta Huang ◽  
Hsiang-Chi Liu ◽  
Jr-Yuan Jeng ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Electrical Properties ◽  
Optimum Design ◽  
Thermal Loading ◽  
Power Transmission ◽  
Thermal Strain ◽  
Electrical Performance ◽  
Wireless Power ◽  
Wireless Power Transmission ◽  
Analysis Software

The micro-inductor is a key component in wireless power transmission micro modules. In this paper, an optimum design for the micro-inductor was studied and related MEMS fabrication techniques were also developed. Commercial electromagnetic property analysis software, ANSOFT, was used to screen the main design factors of the micro-inductor. It was found that the high inductance and high quality factors of the micro-inductor implied high power transmission efficiency for the micro-module’s wireless power transmission. The electrical performance of the micro-inductor was affected by the thermal stress and thermal strain induced in the operational environment of the wireless power transmission micro-module. In order to investigate the reliability of the micro-inductor, commercial stress analysis software, ANSYS, was used to calculate thermal stress and thermal strain. The deformed model of the micro-inductor was then imported into ANSOFT in order to calculate its electrical properties. Glass substrate Pyrex 7740 was used to reduce the substrate loss of the magnetic flux of the micro-inductor. The surface micromachining technique, a kind of MEMS processing, was chosen to fabricate the micro-inductor; the coil of the micro-inductor was electroplated with copper to reduce the series resistance. The minimum line width and line space of the coil were 20 μm and 20 μm respectively. Polyimide (PI) was used for supporting the structure of micro-inductors. The maximum shear stress was 74.09MPa and the maximum warpage was 2.197 μm at a thermal loading of 125°C. For the simulated data, the most suitable areas for 31-turn and 48-turn coils were at an area ratio of 1.27 and 2, respectively. The electrical properties of the inductors changed slightly under thermal loading.

scholarly journals A quantitative analysis software tool for mass spectrometry–based proteomics

2008 ◽  
Vol 5 (4) ◽  
pp. 319-322 ◽  
Author(s):  
Sung Kyu Park ◽  
John D Venable ◽  
Tao Xu ◽  
John R Yates
Keyword(s):  
Mass Spectrometry ◽  
Quantitative Analysis ◽  
Software Tool ◽  
Analysis Software

scholarly journals Heat transfer simulation of the cure of thermoplastic particle interleaf carbon fibre epoxy prepregs

2018 ◽  
Vol 53 (15) ◽  
pp. 2053-2064 ◽  
Author(s):  
Tassos Mesogitis ◽  
James Kratz ◽  
Alex A Skordos
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Sensitivity Study ◽  
Process Models ◽  
Analysis Techniques ◽  
New Class ◽  
Thermosetting Polymers ◽  
Heat Transfer Simulation ◽  
Thermal Analysis Techniques ◽  
Semi Empirical

Thermochemical properties are needed to develop process models and define suitable cure cycles to convert thermosetting polymers into rigid glassy materials. Uncertainty surrounding the suitability of thermal analysis techniques and semi-empirical models developed for conventional composite materials has been raised for the new class of particle interleaf materials. This paper describes kinetics, conductivity, heat capacity and glass transition temperature measurements of HexPly® M21 particle interleaf material. Thermal models describing conventional, non-particle epoxy systems were fit to the data and validated through a thick-section cure. Results from curing experiments agree with heat transfer simulation predictions, indicating that established thermal analysis techniques and models can describe polymerisation and evolving material properties during processing of a material representing the class of interleaf toughened systems. A sensitivity study showed time savings up to about 20%, and associated energy-efficiency-productivity benefits can be achieved by using cure simulation for particle interleaf materials.

scholarly journals Improving the Heat Transfer Rate of Air Conditioning Condenser by Material Optimization

2021 ◽  
pp. 39-50
Author(s):  
A. A. Adegbola ◽  
O. A. Adeaga ◽  
A. O. Babalola ◽  
A. O. Oladejo ◽  
A. S. Alabi
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Heat Flux ◽  
Flow Rate ◽  
Transfer Rate ◽  
Air Conditioning ◽  
Static Pressure ◽  
Cfd Analysis ◽  
Condenser Tube ◽  
Total Heat Transfer

Air conditioning systems have condensers that remove unwanted heat from the refrigerant and transfer the heat outdoors. The optimization of the global exploit of heat exchanging devices is still a burdensome task due to different design parameters involved. There is need for more and substantial research into bettering cooling channel materials so as to ensure elevated performance, better efficiency, greater accuracy, long lasting and low cost heat exchanging. The aim of this research work is to improve the heat transfer rate of air conditioning condenser by optimizing materials for different tube diameters. Simulations using thermal analysis and Computational Fluid Dynamic (CFD) analysis were carried out to determine the better material and fluid respectively. The analysis was done using Analysis System software. Different parameters were calculated from the results obtained and graphs are plotted between various parameters such as heat flux, static pressure, velocity, mass flow rate and total heat transfer. The materials used for CFD analysis are R12 and R22, and for thermal analysis are copper and aluminium. From the CFD analysis, the result shows that R22 has more static pressure, velocity, mass flow rate and total heat transfer than R12 at condenser tube diameter 6 mm. In thermal investigation, the heat flux is more for copper material at condenser tube diameter 6 mm. Copper offers maximum heat flux. Also, refrigerant R22 scores maximum for the heat transfer criteria, but cannot be recommended due to toxicity

Thermal Analysis and Design Applications of the Spiral Groove Tubes in Condensers

2014 ◽  
Vol 1070-1072 ◽  
pp. 1705-1708
Author(s):  
Xiao Lu Wang ◽  
Da Yu Huang
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Thermal Performance ◽  
Tube Bundle ◽  
Spiral Groove ◽  
Analysis And Design ◽  
Grooved Tube ◽  
The Heat Transfer Coefficient

In this paper, condensation mechanism of the Freon refrigerants outside spiral grooved tube is discussed. The heat transfer coefficient of Freon refrigerants condensation outside spiral grooved tube is obtained. A calculation example of heat transfer coefficient on the tube bundle of condenser with baffle bars is presented. It shows the excellent thermal performance of the spiral groove tubes compared to smooth tubes.

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