Interfacial studies of a metallurgical bond between "activated" ultrasonically applied solder and high purity fused silica
2001 ◽
Vol 296
(1-2)
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pp. 102-106
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1997 ◽
Vol 25
(5)
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pp. 1073-1080
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1979 ◽
Vol 42
(20)
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pp. 1346-1349
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2019 ◽
Vol 45
(8)
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pp. 10740-10745
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Keyword(s):
Keyword(s):
2011 ◽
Vol 287-290
◽
pp. 276-280
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Keyword(s):
1982 ◽
Vol 243
(2)
◽
pp. 189-206
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