Plasma etching of large-size silicon based microchannel plates

2017 ◽  
Author(s):  
Huan Liu ◽  
Linlin Fan ◽  
Yaojin Cheng ◽  
Shanshan Wang
2019 ◽  
Vol 3 (1) ◽  
pp. 479-482
Author(s):  
Jose Geraldo A. Brito-Neto ◽  
Shintaro Araki ◽  
Soichi Shirako ◽  
Masanori Hayase

1992 ◽  
Vol 276 ◽  
Author(s):  
R. H. Hackeit ◽  
L. E. Larson

ABSTRACTIn order to integrate micro actuators with III-V semiconductor devices, we have devised Micro-Electro-Mechanical devices (MEM's), constructed from materials and processes common to existing III-V device processing. These processes are substantially different from silicon based processes because of the requirements for low temperature processing and the use of gold-based metallizations.Our material choices include, vacuum deposited and plated metal films, silicon oxide and nitride dielectric layers, and polyimide layers and structures. Sacrificial layers are implemented with photoresist rather than the more common silicon dioxide. The processes available are based on the ‘lift off’ of unwanted areas of the metal films, wet plating of metals through openings in photoresist masks, and wet and plasma etching of metals and dielectrics.This paper will discuss why we are using these materials, the process constraints imposed by the materials, the measurement of some of the material properties, and will relate some progress in applications.


2015 ◽  
Vol 44 (7) ◽  
pp. 482-486 ◽  
Author(s):  
I. I. Bobrinetskii ◽  
A. V. Volkova ◽  
A. A. Zaitsev ◽  
V. K. Nevolin ◽  
K. A. Tsarik ◽  
...  

2020 ◽  
Author(s):  
Daniel Egert ◽  
Jeffrey R Pettibone ◽  
Stefan Lemke ◽  
Paras R. Patel ◽  
Ciara M. Caldwell ◽  
...  

AbstractNeural implants with large numbers of electrodes have become an important tool for examining brain functions. However, these devices typically displace a large intracranial volume compared to the neurons they record. This large size limits the density of implants, provokes tissue reactions that degrade chronic performance, and impedes the ability to accurately visualize recording sites within intact circuits. Here we report next-generation silicon-based neural probes at cellular-scale (5×10µm cross-section), with ultra-high-density packing (as little as 66µm between shanks) and 64 or 256 closely-spaced recording sites per probe. We show that these probes can be inserted into superficial or deep brain structures and maintain high-quality spike recordings in freely behaving rats for many weeks. Finally, we demonstrate a slice-in-place approach for the precise registration of recording sites relative to nearby neurons and anatomical features, including striatal µ-opioid receptor patches. This scalable technology provides a valuable tool for examining information processing within neural circuits, and potentially for human brain-machine interfaces.


1994 ◽  
pp. 433-436 ◽  
Author(s):  
A. Suda ◽  
I. Tajima ◽  
M. Ishii ◽  
Y. Ukyo ◽  
S. Wada

2015 ◽  
Author(s):  
Y. P. Opachich ◽  
N. Chen ◽  
P. M. Bell ◽  
D. K. Bradley ◽  
J. Feng ◽  
...  

2012 ◽  
Vol 49 (5) ◽  
pp. 052301
Author(s):  
吕文峰 Lü Wenfeng ◽  
周彬 Zhou Bin ◽  
罗建东 Luo Jiandong ◽  
雷耀虎 Lei Yaohu ◽  
郭金川 Guo Jinchuan ◽  
...  

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