Improvement of the high-frequency performance of field effect transistors via employing a novel high-temperature electronic technique

1995 ◽  
Author(s):  
Rajendra Narasimhan ◽  
Robert P. Rozario ◽  
Laurence P. Sadwick ◽  
R. J. Hwu-Sadwick
2020 ◽  
Vol 2 (9) ◽  
pp. 4179-4186 ◽  
Author(s):  
Pedro C. Feijoo ◽  
Francisco Pasadas ◽  
Marlene Bonmann ◽  
Muhammad Asad ◽  
Xinxin Yang ◽  
...  

A drift–diffusion model including self-heating effects in graphene transistors to investigate carrier velocity saturation for optimal high frequency performance.


1995 ◽  
Vol 06 (01) ◽  
pp. 211-236 ◽  
Author(s):  
R.J. TREW ◽  
M.W. SHIN

Electronic and optical devices fabricated from wide band gap semiconductors have many properties ideal for high temperature, high frequency, high power, and radiation hard applications. Progress in wide band gap semiconductor materials growth has been impressive and high quality epitaxial layers are becoming available. Useful devices, particularly those fabricated from SiC, are rapidly approaching the commercialization stage. In particular, MESFETs (MEtal Semiconductor Field-Effect Transistors) fabricated from wide band gap semiconductors have the potential to be useful in microwave power amplifier and oscillator applications. In this work the microwave performance of MESFETs fabricated from SiC, GaN and semiconducting diamond is investigated with a theoretical simulator and the results compared to experimental measurements. Excellent agreement between the simulated and measured data is obtained. It is demonstrated that microwave power amplifiers fabricated from these semiconductors offer superior performance, particularly at elevated temperatures compared to similar components fabricated from the commonly employed GaAs MESFETs.


1995 ◽  
Vol 410 ◽  
Author(s):  
H. Aydin ◽  
M. W. Dryfuse ◽  
M. Tabib-Azar

ABSTRACTFast and slow interface traps can considerably deteriorate the performance of field effect transistors. Slow interface traps, by slowly changing their charge occupancy, contribute to a drift in the quiescent operation point of the transistor, while fast traps deteriorate the device performance by contributing to both amplitude and phase current noise. They also result in a non-equilibrium surface depletion layer between gate and source which increases the gate-to-source parasitic resistance and deteriorates the device transconductance. We examine these different effects and present some preliminary data regarding interface traps in boron-doped 611-SiC.


2016 ◽  
Vol 858 ◽  
pp. 1066-1069 ◽  
Author(s):  
Shinya Sato ◽  
Hidekazu Tanisawa ◽  
Takeshi Anzai ◽  
Hiroki Takahashi ◽  
Yoshinori Murakami ◽  
...  

In this paper, we describe a power module fabricated using SiC metal–oxide–semiconductor field-effect transistors (MOSFETs). A C-R snubber is integrated into this power module for reduction of the surge voltage and dumping of the voltage ringing. The four SiC MOSFETs are sandwiched between active metal copper (AMC) substrates. The surfaces of the SiC MOSFETs are attached to AMC substrates by Al bumps, owing to which the power module shows low inductance. Moreover, this power module ensures credibility and reliability at higher operating temperatures beyond 200 °C. The switching characteristics of the module are studied experimentally for high-temperature and high-frequency operations.


2012 ◽  
Vol 101 (5) ◽  
pp. 053123 ◽  
Author(s):  
Mathias Steiner ◽  
Michael Engel ◽  
Yu-Ming Lin ◽  
Yanqing Wu ◽  
Keith Jenkins ◽  
...  

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